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H01L21/0201

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/0201Specific process step

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Etching method and etching apparatus
- Patent number 12,272,541
- Issue date Apr 8, 2025
- Tokyo Electron Limited
- Naoki Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for cleaning semiconductor silicon wafer and method for c...
- Patent number 12,272,542
- Issue date Apr 8, 2025
- Shin-Etsu Handotai Co., Ltd.
- Kensaku Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing methods of wafer and chips and position adjustment me...
- Patent number 12,263,539
- Issue date Apr 1, 2025
- Disco Corporation
- Kazuki Hashimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polishing pad and method of fabricating semiconductor device using...
- Patent number 12,246,408
- Issue date Mar 11, 2025
- SK ENPULSE CO., LTD.
- Eun Sun Joeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back grinding adhesive sheet, and method for manufacturing semicond...
- Patent number 12,243,766
- Issue date Mar 4, 2025
- Disco Corporation
- Karl Heinz Priewasser
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate holding apparatus, substrate suction determination method...
- Patent number 12,230,529
- Issue date Feb 18, 2025
- Ebara Corporation
- Osamu Nabeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Indium phosphide substrate
- Patent number 12,217,967
- Issue date Feb 4, 2025
- JX Advanced Metals Corporation
- Shunsuke Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method of wafer, protective sheet, and protective sheet...
- Patent number 12,217,966
- Issue date Feb 4, 2025
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming SOI substrates
- Patent number 12,211,686
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Alex Usenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a component arrangement for a package, met...
- Patent number 12,191,137
- Issue date Jan 7, 2025
- MSG LITHOGLAS GMBH
- Simon Maus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating gallium nitride substrate using ion implantation
- Patent number 12,183,575
- Issue date Dec 31, 2024
- IUCF-HYU (Industry-University Cooperation Foundation Hanyang University)
- Jea Gun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer process, apparatus and method of manufacturing an article
- Patent number 12,176,208
- Issue date Dec 24, 2024
- Canon Kabushiki Kaisha
- Byung-Jin Choi
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Manufacture method of a high-resistivity silicon handle wafer for a...
- Patent number 12,176,202
- Issue date Dec 24, 2024
- OKMETIC OY
- Päivi Sievilä
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor using slurry
- Patent number 12,176,217
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Hung Liao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
System with substrate carrier deterioration detection and repair
- Patent number 12,162,134
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jen-Ti Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming an adhesive layer, and related adhesive films an...
- Patent number 12,157,847
- Issue date Dec 3, 2024
- Seagate Technology LLC
- Zubair Ahmed Khan
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer and method of wafer thinning
- Patent number 12,154,783
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiC wafer and manufacturing method for SiC wafer
- Patent number 12,139,813
- Issue date Nov 12, 2024
- Toyota Tsusho Corporation
- Masatake Nagaya
- C30 - CRYSTAL GROWTH
Information Patent Grant
Polishing composition
- Patent number 12,139,643
- Issue date Nov 12, 2024
- Fujimi Incorporated
- Yuichiro Nakagai
- B24 - GRINDING POLISHING
Information Patent Grant
Method for wafer backside polishing
- Patent number 12,131,896
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kei-Wei Chen
- B08 - CLEANING
Information Patent Grant
Integrated method for low-cost wide band gap semiconductor device m...
- Patent number 12,125,697
- Issue date Oct 22, 2024
- ThinSiC Inc.
- Tirunelveli Subramaniam Ravi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide substrate
- Patent number 12,104,278
- Issue date Oct 1, 2024
- Sumitomo Electric Industries, Ltd.
- Tsubasa Honke
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,094,704
- Issue date Sep 17, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Le Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a substrate
- Patent number 12,094,751
- Issue date Sep 17, 2024
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of printing laser mark and method of producing laser-marked...
- Patent number 12,083,624
- Issue date Sep 10, 2024
- Sumco Corporation
- Yoichiro Hirakawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing semiconductor wafers using a wire saw, wire sa...
- Patent number 12,083,705
- Issue date Sep 10, 2024
- Siltronic AG
- Axel Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Etching compositions
- Patent number 12,074,020
- Issue date Aug 27, 2024
- Fujifilm Electronic Materials U.S.A., Inc.
- Mick Bjelopavlic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processed inorganic wafer and processing wafer stack with abrasive...
- Patent number 12,062,534
- Issue date Aug 13, 2024
- MOSAIC MICROSYSTEMS LLC
- Shelby Forrester Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a substrate and system for producing a substrate
- Patent number 12,062,533
- Issue date Aug 13, 2024
- Disco Corporation
- Karl Heinz Priewasser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Monolayer graphene on non-polar face SiC substrate and control meth...
- Patent number 12,051,585
- Issue date Jul 30, 2024
- Tianjin University
- Lei Ma
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESS AND POLISHING METHO...
- Publication number 20250115786
- Publication date Apr 10, 2025
- SK enpulse Co., Ltd.
- Deok Su HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20250112044
- Publication date Apr 3, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CARRIER DETERIORATION DETECTION AND REPAIR
- Publication number 20250100161
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Jen-Ti WANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TUNABLE ELECTRON TRANSPARENT SUBSTRATES FOR HIGH-RESOLUTION CHARACT...
- Publication number 20250104996
- Publication date Mar 27, 2025
- MATTIQ, INC.
- Andrey IVANKIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20250073820
- Publication date Mar 6, 2025
- Disco Corporation
- Masaru Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING METHOD OF WAFER
- Publication number 20250073821
- Publication date Mar 6, 2025
- Disco Corporation
- Akira MIZUTANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF WAFER THINNING
- Publication number 20250062114
- Publication date Feb 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR WAFER WET PROCESS
- Publication number 20250062141
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEFORMATION CONTROL OF MANUFACTURING DEVICES USING FRONT-SIDE IRRAD...
- Publication number 20250054757
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- Pradeep Kumar Subrahmanyan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250050462
- Publication date Feb 13, 2025
- EBARA CORPORATION
- Makoto KASHIWAGI
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF WAFER BONDING
- Publication number 20250046650
- Publication date Feb 6, 2025
- WAFER WORKS CORPORATION
- Wei-Jing CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR SEPARATING WAFER SLICES
- Publication number 20250029846
- Publication date Jan 23, 2025
- Yield Engineering Systems, Inc.
- Al Stone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF THINNING WAFER SUBSTRATE
- Publication number 20250018486
- Publication date Jan 16, 2025
- COMPTAKE TECHNOLOGY INC.
- YAO-GUANG YANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20250014888
- Publication date Jan 9, 2025
- Disco Corporation
- Akira MIZUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD OF WAFER
- Publication number 20250014889
- Publication date Jan 9, 2025
- Disco Corporation
- Akira MIZUTANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated Method For Low-Cost Wide Band Gap Semiconductor Device M...
- Publication number 20250014887
- Publication date Jan 9, 2025
- ThinSiC Inc.
- Tirunelveli Subramaniam Ravi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD OF WAFER
- Publication number 20250014949
- Publication date Jan 9, 2025
- Disco Corporation
- Akira MIZUTANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING METHOD OF WAFER
- Publication number 20250006484
- Publication date Jan 2, 2025
- Disco Corporation
- Akira MIZUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD AND PROCESSING SYSTEM
- Publication number 20240404852
- Publication date Dec 5, 2024
- TOKYO ELECTRON LIMITED
- Yohei YAMASHITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
N-TYPE DOUBLE-SIDED SOLAR CELL PREPARATION METHOD
- Publication number 20240405151
- Publication date Dec 5, 2024
- Tongwei Solar (Meishan) Co., Ltd.
- Wenzhou XU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR WAFER BACKSIDE POLISHING
- Publication number 20240387162
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- KEI-WEI CHEN
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240379584
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsiang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR GRINDING SEMICONDUCTOR WAFERS
- Publication number 20240379342
- Publication date Nov 14, 2024
- Siltronic AG
- Stephan OBERHANS
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR WAFERS AND METHOD OF MANUFACT...
- Publication number 20240379341
- Publication date Nov 14, 2024
- GlobalWafers Japan Co., Ltd.
- Ken HAYAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING COMPOSITIONS
- Publication number 20240376606
- Publication date Nov 14, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Simon Joshua JACOBS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CARRIER SUBSTRATE FOR SEMICONDUCTOR STRUCTURES SUITABLE FOR A TRANS...
- Publication number 20240371669
- Publication date Nov 7, 2024
- X-FAB SEMICONDUCTOR FOUNDRIES GmbH
- Ralf LERNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SILICON WAFERS
- Publication number 20240339315
- Publication date Oct 10, 2024
- GlobalWafers Japan Co., Ltd.
- Susumu MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20240331998
- Publication date Oct 3, 2024
- TOKYO ELECTRON LIMITED
- Susumu HAYAKAWA
- B24 - GRINDING POLISHING
Information Patent Application
MANUFACTURING METHOD FOR MANUFACTURING SUBSTRATE OF NITRIDE CRYSTAL...
- Publication number 20240293912
- Publication date Sep 5, 2024
- KYOCERA CORPORATION
- Mari YOSHIMORI HIGUCHI
- C30 - CRYSTAL GROWTH
Information Patent Application
DISPLAY DEVICE, METHOD OF MANUFACTURING WINDOW, AND METHOD OF MANUF...
- Publication number 20240295904
- Publication date Sep 5, 2024
- SAMSUNG DISPLAY CO., LTD.
- IN-BAE KIM
- G06 - COMPUTING CALCULATING COUNTING

Specific process step

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Etching method and etching apparatus

Apparatus for cleaning semiconductor silicon wafer and method for c...

Manufacturing methods of wafer and chips and position adjustment me...

Polishing pad and method of fabricating semiconductor device using...

Back grinding adhesive sheet, and method for manufacturing semicond...

Substrate holding apparatus, substrate suction determination method...

Indium phosphide substrate

Processing method of wafer, protective sheet, and protective sheet...

Methods of forming SOI substrates

Method for manufacturing a component arrangement for a package, met...

Method of fabricating gallium nitride substrate using ion implantation

Wafer process, apparatus and method of manufacturing an article

Manufacture method of a high-resistivity silicon handle wafer for a...

Method for manufacturing a semiconductor using slurry

System with substrate carrier deterioration detection and repair

Methods of forming an adhesive layer, and related adhesive films an...

Semiconductor wafer and method of wafer thinning

SiC wafer and manufacturing method for SiC wafer

Polishing composition

Method for wafer backside polishing

Integrated method for low-cost wide band gap semiconductor device m...

Silicon carbide substrate

Semiconductor device and method of fabricating the same

Method of processing a substrate

Method of printing laser mark and method of producing laser-marked...

Method for producing semiconductor wafers using a wire saw, wire sa...

Etching compositions

Processed inorganic wafer and processing wafer stack with abrasive...

Method of producing a substrate and system for producing a substrate

Monolayer graphene on non-polar face SiC substrate and control meth...

Patents Applicationslast 30 patents

POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESS AND POLISHING METHO...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SUBSTRATE CARRIER DETERIORATION DETECTION AND REPAIR

TUNABLE ELECTRON TRANSPARENT SUBSTRATES FOR HIGH-RESOLUTION CHARACT...

WAFER PROCESSING METHOD

PROCESSING METHOD OF WAFER

SEMICONDUCTOR WAFER AND METHOD OF WAFER THINNING

SYSTEM AND METHOD FOR WAFER WET PROCESS

DEFORMATION CONTROL OF MANUFACTURING DEVICES USING FRONT-SIDE IRRAD...

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

METHOD OF WAFER BONDING

APPARATUS AND METHOD FOR SEPARATING WAFER SLICES

SYSTEM AND METHOD OF THINNING WAFER SUBSTRATE

WAFER PROCESSING METHOD

PROCESSING METHOD OF WAFER

Integrated Method For Low-Cost Wide Band Gap Semiconductor Device M...

PROCESSING METHOD OF WAFER

PROCESSING METHOD OF WAFER

PROCESSING METHOD AND PROCESSING SYSTEM

N-TYPE DOUBLE-SIDED SOLAR CELL PREPARATION METHOD

METHOD FOR WAFER BACKSIDE POLISHING

SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

METHOD FOR GRINDING SEMICONDUCTOR WAFERS

METHOD OF MANUFACTURING SEMICONDUCTOR WAFERS AND METHOD OF MANUFACT...

ETCHING COMPOSITIONS

CARRIER SUBSTRATE FOR SEMICONDUCTOR STRUCTURES SUITABLE FOR A TRANS...

METHOD OF MANUFACTURING SILICON WAFERS

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM

MANUFACTURING METHOD FOR MANUFACTURING SUBSTRATE OF NITRIDE CRYSTAL...

DISPLAY DEVICE, METHOD OF MANUFACTURING WINDOW, AND METHOD OF MANUF...