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H01L21/0201

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/0201Specific process step

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods and devices related to radio frequency devices
- Patent number 12,362,191
- Issue date Jul 15, 2025
- Infineon Technologies Dresden GmbH & Co. KG
- Hans Taddiken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method
- Patent number 12,347,670
- Issue date Jul 1, 2025
- STMicroelectronics (Crolles 2) SAS
- Delia Ristoiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 12,341,023
- Issue date Jun 24, 2025
- Qorvo US, Inc.
- Krishna Chetry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate polishing method
- Patent number 12,327,719
- Issue date Jun 10, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Shay Reboh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of separating wafer
- Patent number 12,304,109
- Issue date May 20, 2025
- Disco Corporation
- Shunsuke Teranishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon carbide wafers and grinding method thereof
- Patent number 12,308,224
- Issue date May 20, 2025
- GlobalWafers Co., Ltd.
- Chin Chen Chiu
- C30 - CRYSTAL GROWTH
Information Patent Grant
Element chip manufacturing method and substrate processing method
- Patent number 12,300,482
- Issue date May 13, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidehiko Karasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method of wafer
- Patent number 12,288,682
- Issue date Apr 29, 2025
- Disco Corporation
- Youngsuk Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backside deposition tuning of stress to control wafer bow in semico...
- Patent number 12,276,922
- Issue date Apr 15, 2025
- Tokyo Electron Limited
- Daniel Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and etching apparatus
- Patent number 12,272,541
- Issue date Apr 8, 2025
- Tokyo Electron Limited
- Naoki Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for cleaning semiconductor silicon wafer and method for c...
- Patent number 12,272,542
- Issue date Apr 8, 2025
- Shin-Etsu Handotai Co., Ltd.
- Kensaku Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing methods of wafer and chips and position adjustment me...
- Patent number 12,263,539
- Issue date Apr 1, 2025
- Disco Corporation
- Kazuki Hashimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polishing pad and method of fabricating semiconductor device using...
- Patent number 12,246,408
- Issue date Mar 11, 2025
- SK ENPULSE CO., LTD.
- Eun Sun Joeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back grinding adhesive sheet, and method for manufacturing semicond...
- Patent number 12,243,766
- Issue date Mar 4, 2025
- Disco Corporation
- Karl Heinz Priewasser
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate holding apparatus, substrate suction determination method...
- Patent number 12,230,529
- Issue date Feb 18, 2025
- Ebara Corporation
- Osamu Nabeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Indium phosphide substrate
- Patent number 12,217,967
- Issue date Feb 4, 2025
- JX Advanced Metals Corporation
- Shunsuke Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method of wafer, protective sheet, and protective sheet...
- Patent number 12,217,966
- Issue date Feb 4, 2025
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming SOI substrates
- Patent number 12,211,686
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Alex Usenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a component arrangement for a package, met...
- Patent number 12,191,137
- Issue date Jan 7, 2025
- MSG LITHOGLAS GMBH
- Simon Maus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating gallium nitride substrate using ion implantation
- Patent number 12,183,575
- Issue date Dec 31, 2024
- IUCF-HYU (Industry-University Cooperation Foundation Hanyang University)
- Jea Gun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer process, apparatus and method of manufacturing an article
- Patent number 12,176,208
- Issue date Dec 24, 2024
- Canon Kabushiki Kaisha
- Byung-Jin Choi
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Manufacture method of a high-resistivity silicon handle wafer for a...
- Patent number 12,176,202
- Issue date Dec 24, 2024
- OKMETIC OY
- Päivi Sievilä
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor using slurry
- Patent number 12,176,217
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Hung Liao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
System with substrate carrier deterioration detection and repair
- Patent number 12,162,134
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jen-Ti Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming an adhesive layer, and related adhesive films an...
- Patent number 12,157,847
- Issue date Dec 3, 2024
- Seagate Technology LLC
- Zubair Ahmed Khan
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer and method of wafer thinning
- Patent number 12,154,783
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiC wafer and manufacturing method for SiC wafer
- Patent number 12,139,813
- Issue date Nov 12, 2024
- Toyota Tsusho Corporation
- Masatake Nagaya
- C30 - CRYSTAL GROWTH
Information Patent Grant
Polishing composition
- Patent number 12,139,643
- Issue date Nov 12, 2024
- Fujimi Incorporated
- Yuichiro Nakagai
- B24 - GRINDING POLISHING
Information Patent Grant
Method for wafer backside polishing
- Patent number 12,131,896
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kei-Wei Chen
- B08 - CLEANING
Information Patent Grant
Integrated method for low-cost wide band gap semiconductor device m...
- Patent number 12,125,697
- Issue date Oct 22, 2024
- ThinSiC Inc.
- Tirunelveli Subramaniam Ravi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WORKPIECE PROCESSING METHOD AND PROCESSING APPARATUS
- Publication number 20250239443
- Publication date Jul 24, 2025
- Disco Corporation
- Kokichi MINATO
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR PROCESSING METHOD
- Publication number 20250226201
- Publication date Jul 10, 2025
- GLOBALWAFERS CO., LTD.
- Ching-Shan Lin
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING, METHOD OF PRE...
- Publication number 20250215264
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Seokhwan LEE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
APPARATUSES AND METHODS FOR ORGANIZING DATA IN A MEMORY DEVICE
- Publication number 20250191969
- Publication date Jun 12, 2025
- Lodestar Licensing Group, LLC
- Glen E. Hush
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Method For Low-Cost Wide Band Gap Semiconductor Device M...
- Publication number 20250183026
- Publication date Jun 5, 2025
- ThinSiC Inc.
- Tirunelveli Subramaniam Ravi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Forming Backside Power Rails
- Publication number 20250157851
- Publication date May 15, 2025
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Dielectric Capping for Hybrid Bonding
- Publication number 20250149474
- Publication date May 8, 2025
- Applied Materials, Inc.
- Prayudi LIANTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HOLDING APPARATUS, SUBSTRATE SUCTION DETERMINATION METHOD...
- Publication number 20250140594
- Publication date May 1, 2025
- EBARA CORPORATION
- Osamu Nabeya
- B24 - GRINDING POLISHING
Information Patent Application
EPITAXIAL WAFER AND A METHOD FOR MANUFACTURING AN EPITAXIAL WAFER
- Publication number 20250125141
- Publication date Apr 17, 2025
- SK SILTRON CO., LTD
- Gun Ho LEE
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD FOR MANUFACTURING A NON-DEFORMABLE P-SIC WAFER
- Publication number 20250125140
- Publication date Apr 17, 2025
- SOITEC
- Andrea Quintero-Colmenares
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE AND MANUFACTURING METHOD THEREOF AS WELL AS SEMICONDUCTOR PACKA...
- Publication number 20250125216
- Publication date Apr 17, 2025
- ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
- YUEH-MING TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP
- Publication number 20250125197
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Junyun Kweon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESS AND POLISHING METHO...
- Publication number 20250115786
- Publication date Apr 10, 2025
- SK enpulse Co., Ltd.
- Deok Su HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20250112044
- Publication date Apr 3, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CARRIER DETERIORATION DETECTION AND REPAIR
- Publication number 20250100161
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Jen-Ti WANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TUNABLE ELECTRON TRANSPARENT SUBSTRATES FOR HIGH-RESOLUTION CHARACT...
- Publication number 20250104996
- Publication date Mar 27, 2025
- MATTIQ, INC.
- Andrey IVANKIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20250073820
- Publication date Mar 6, 2025
- Disco Corporation
- Masaru Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING METHOD OF WAFER
- Publication number 20250073821
- Publication date Mar 6, 2025
- Disco Corporation
- Akira MIZUTANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF WAFER THINNING
- Publication number 20250062114
- Publication date Feb 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR WAFER WET PROCESS
- Publication number 20250062141
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEFORMATION CONTROL OF MANUFACTURING DEVICES USING FRONT-SIDE IRRAD...
- Publication number 20250054757
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- Pradeep Kumar Subrahmanyan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250050462
- Publication date Feb 13, 2025
- EBARA CORPORATION
- Makoto KASHIWAGI
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF WAFER BONDING
- Publication number 20250046650
- Publication date Feb 6, 2025
- WAFER WORKS CORPORATION
- Wei-Jing CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR SEPARATING WAFER SLICES
- Publication number 20250029846
- Publication date Jan 23, 2025
- Yield Engineering Systems, Inc.
- Al Stone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF THINNING WAFER SUBSTRATE
- Publication number 20250018486
- Publication date Jan 16, 2025
- COMPTAKE TECHNOLOGY INC.
- YAO-GUANG YANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20250014888
- Publication date Jan 9, 2025
- Disco Corporation
- Akira MIZUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD OF WAFER
- Publication number 20250014889
- Publication date Jan 9, 2025
- Disco Corporation
- Akira MIZUTANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated Method For Low-Cost Wide Band Gap Semiconductor Device M...
- Publication number 20250014887
- Publication date Jan 9, 2025
- ThinSiC Inc.
- Tirunelveli Subramaniam Ravi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD OF WAFER
- Publication number 20250014949
- Publication date Jan 9, 2025
- Disco Corporation
- Akira MIZUTANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING METHOD OF WAFER
- Publication number 20250006484
- Publication date Jan 2, 2025
- Disco Corporation
- Akira MIZUTANI
- H01 - BASIC ELECTRIC ELEMENTS

Specific process step

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods and devices related to radio frequency devices

Etching method

Semiconductor device and method of manufacturing a semiconductor de...

Semiconductor substrate polishing method

Method of separating wafer

Silicon carbide wafers and grinding method thereof

Element chip manufacturing method and substrate processing method

Processing method of wafer

Backside deposition tuning of stress to control wafer bow in semico...

Etching method and etching apparatus

Apparatus for cleaning semiconductor silicon wafer and method for c...

Manufacturing methods of wafer and chips and position adjustment me...

Polishing pad and method of fabricating semiconductor device using...

Back grinding adhesive sheet, and method for manufacturing semicond...

Substrate holding apparatus, substrate suction determination method...

Indium phosphide substrate

Processing method of wafer, protective sheet, and protective sheet...

Methods of forming SOI substrates

Method for manufacturing a component arrangement for a package, met...

Method of fabricating gallium nitride substrate using ion implantation

Wafer process, apparatus and method of manufacturing an article

Manufacture method of a high-resistivity silicon handle wafer for a...

Method for manufacturing a semiconductor using slurry

System with substrate carrier deterioration detection and repair

Methods of forming an adhesive layer, and related adhesive films an...

Semiconductor wafer and method of wafer thinning

SiC wafer and manufacturing method for SiC wafer

Polishing composition

Method for wafer backside polishing

Integrated method for low-cost wide band gap semiconductor device m...

Patents Applicationslast 30 patents

WORKPIECE PROCESSING METHOD AND PROCESSING APPARATUS

SEMICONDUCTOR PROCESSING METHOD

SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING, METHOD OF PRE...

APPARATUSES AND METHODS FOR ORGANIZING DATA IN A MEMORY DEVICE

Integrated Method For Low-Cost Wide Band Gap Semiconductor Device M...

Method and Apparatus for Forming Backside Power Rails

Selective Dielectric Capping for Hybrid Bonding

SUBSTRATE HOLDING APPARATUS, SUBSTRATE SUCTION DETERMINATION METHOD...

EPITAXIAL WAFER AND A METHOD FOR MANUFACTURING AN EPITAXIAL WAFER

METHOD FOR MANUFACTURING A NON-DEFORMABLE P-SIC WAFER

DIE AND MANUFACTURING METHOD THEREOF AS WELL AS SEMICONDUCTOR PACKA...

SEMICONDUCTOR CHIP

POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESS AND POLISHING METHO...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SUBSTRATE CARRIER DETERIORATION DETECTION AND REPAIR

TUNABLE ELECTRON TRANSPARENT SUBSTRATES FOR HIGH-RESOLUTION CHARACT...

WAFER PROCESSING METHOD

PROCESSING METHOD OF WAFER

SEMICONDUCTOR WAFER AND METHOD OF WAFER THINNING

SYSTEM AND METHOD FOR WAFER WET PROCESS

DEFORMATION CONTROL OF MANUFACTURING DEVICES USING FRONT-SIDE IRRAD...

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

METHOD OF WAFER BONDING

APPARATUS AND METHOD FOR SEPARATING WAFER SLICES

SYSTEM AND METHOD OF THINNING WAFER SUBSTRATE

WAFER PROCESSING METHOD

PROCESSING METHOD OF WAFER

Integrated Method For Low-Cost Wide Band Gap Semiconductor Device M...

PROCESSING METHOD OF WAFER

PROCESSING METHOD OF WAFER