Specific process step

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CPC
H01L21/0201

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/0201Specific process step

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating gallium nitride substrate using ion implantation
- Patent number 12,183,575
- Issue date Dec 31, 2024
- IUCF-HYU (Industry-University Cooperation Foundation Hanyang University)
- Jea Gun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer process, apparatus and method of manufacturing an article
- Patent number 12,176,208
- Issue date Dec 24, 2024
- Canon Kabushiki Kaisha
- Byung-Jin Choi
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Manufacture method of a high-resistivity silicon handle wafer for a...
- Patent number 12,176,202
- Issue date Dec 24, 2024
- OKMETIC OY
- Päivi Sievilä
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor using slurry
- Patent number 12,176,217
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Hung Liao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
System with substrate carrier deterioration detection and repair
- Patent number 12,162,134
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jen-Ti Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming an adhesive layer, and related adhesive films an...
- Patent number 12,157,847
- Issue date Dec 3, 2024
- Seagate Technology LLC
- Zubair Ahmed Khan
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer and method of wafer thinning
- Patent number 12,154,783
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiC wafer and manufacturing method for SiC wafer
- Patent number 12,139,813
- Issue date Nov 12, 2024
- Toyota Tsusho Corporation
- Masatake Nagaya
- C30 - CRYSTAL GROWTH
Information Patent Grant
Polishing composition
- Patent number 12,139,643
- Issue date Nov 12, 2024
- Fujimi Incorporated
- Yuichiro Nakagai
- B24 - GRINDING POLISHING
Information Patent Grant
Method for wafer backside polishing
- Patent number 12,131,896
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kei-Wei Chen
- B08 - CLEANING
Information Patent Grant
Integrated method for low-cost wide band gap semiconductor device m...
- Patent number 12,125,697
- Issue date Oct 22, 2024
- ThinSiC Inc.
- Tirunelveli Subramaniam Ravi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide substrate
- Patent number 12,104,278
- Issue date Oct 1, 2024
- Sumitomo Electric Industries, Ltd.
- Tsubasa Honke
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,094,704
- Issue date Sep 17, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Le Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a substrate
- Patent number 12,094,751
- Issue date Sep 17, 2024
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of printing laser mark and method of producing laser-marked...
- Patent number 12,083,624
- Issue date Sep 10, 2024
- Sumco Corporation
- Yoichiro Hirakawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing semiconductor wafers using a wire saw, wire sa...
- Patent number 12,083,705
- Issue date Sep 10, 2024
- Siltronic AG
- Axel Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Etching compositions
- Patent number 12,074,020
- Issue date Aug 27, 2024
- Fujifilm Electronic Materials U.S.A., Inc.
- Mick Bjelopavlic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processed inorganic wafer and processing wafer stack with abrasive...
- Patent number 12,062,534
- Issue date Aug 13, 2024
- MOSAIC MICROSYSTEMS LLC
- Shelby Forrester Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a substrate and system for producing a substrate
- Patent number 12,062,533
- Issue date Aug 13, 2024
- Disco Corporation
- Karl Heinz Priewasser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Monolayer graphene on non-polar face SiC substrate and control meth...
- Patent number 12,051,585
- Issue date Jul 30, 2024
- Tianjin University
- Lei Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,016,182
- Issue date Jun 18, 2024
- Kioxia Corporation
- Naomi Fukumaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device, method of manufacturing window, and method of manuf...
- Patent number 12,001,243
- Issue date Jun 4, 2024
- Samsung Display Co., Ltd.
- In-Bae Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods and apparatus for forming backside power rails
- Patent number 12,002,705
- Issue date Jun 4, 2024
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method of manufacturing the same
- Patent number 11,973,036
- Issue date Apr 30, 2024
- Advanced Semiconductor Engineering, Inc.
- Ting-Yang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects having spacers for improved top via critical dimensio...
- Patent number 11,961,759
- Issue date Apr 16, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices related to radio frequency devices
- Patent number 11,948,802
- Issue date Apr 2, 2024
- Infineon Technologies Dresden GmbH & Co. KG
- Hans Taddiken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor devices having processor and static random-acc...
- Patent number 11,950,399
- Issue date Apr 2, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer production method
- Patent number 11,948,789
- Issue date Apr 2, 2024
- Sumco Corporation
- Toshiyuki Tanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Film for component manufacture and component manufacturing method
- Patent number 11,942,349
- Issue date Mar 26, 2024
- Mitsui Chemicals Tohcello, Inc.
- Eiji Hayashishita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of CMP integration for improved optical uniformity in advanc...
- Patent number 11,908,678
- Issue date Feb 20, 2024
- Applied Materials, Inc.
- Lan Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESSING METHOD OF WAFER
- Publication number 20250006484
- Publication date Jan 2, 2025
- Disco Corporation
- Akira MIZUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD AND PROCESSING SYSTEM
- Publication number 20240404852
- Publication date Dec 5, 2024
- TOKYO ELECTRON LIMITED
- Yohei YAMASHITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
N-TYPE DOUBLE-SIDED SOLAR CELL PREPARATION METHOD
- Publication number 20240405151
- Publication date Dec 5, 2024
- Tongwei Solar (Meishan) Co., Ltd.
- Wenzhou XU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR WAFER BACKSIDE POLISHING
- Publication number 20240387162
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- KEI-WEI CHEN
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240379584
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsiang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR GRINDING SEMICONDUCTOR WAFERS
- Publication number 20240379342
- Publication date Nov 14, 2024
- Siltronic AG
- Stephan OBERHANS
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR WAFERS AND METHOD OF MANUFACT...
- Publication number 20240379341
- Publication date Nov 14, 2024
- GlobalWafers Japan Co., Ltd.
- Ken HAYAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING COMPOSITIONS
- Publication number 20240376606
- Publication date Nov 14, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Simon Joshua JACOBS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CARRIER SUBSTRATE FOR SEMICONDUCTOR STRUCTURES SUITABLE FOR A TRANS...
- Publication number 20240371669
- Publication date Nov 7, 2024
- X-FAB SEMICONDUCTOR FOUNDRIES GmbH
- Ralf LERNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SILICON WAFERS
- Publication number 20240339315
- Publication date Oct 10, 2024
- GlobalWafers Japan Co., Ltd.
- Susumu MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20240331998
- Publication date Oct 3, 2024
- TOKYO ELECTRON LIMITED
- Susumu HAYAKAWA
- B24 - GRINDING POLISHING
Information Patent Application
MANUFACTURING METHOD FOR MANUFACTURING SUBSTRATE OF NITRIDE CRYSTAL...
- Publication number 20240293912
- Publication date Sep 5, 2024
- KYOCERA CORPORATION
- Mari YOSHIMORI HIGUCHI
- C30 - CRYSTAL GROWTH
Information Patent Application
DISPLAY DEVICE, METHOD OF MANUFACTURING WINDOW, AND METHOD OF MANUF...
- Publication number 20240295904
- Publication date Sep 5, 2024
- SAMSUNG DISPLAY CO., LTD.
- IN-BAE KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING SYSTEM AND COMPUT...
- Publication number 20240290607
- Publication date Aug 29, 2024
- TOKYO ELECTRON LIMITED
- Takashi UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240282761
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng Yong Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE COMPRISING AN ELECTRICALLY CONDUCTIVE BONDI...
- Publication number 20240266172
- Publication date Aug 8, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Frédéric Allibert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PROCESSING SEMICONDUCTOR WAFERS USING DOUBLE SIDE GRINDI...
- Publication number 20240253173
- Publication date Aug 1, 2024
- GLOBALWAFERS CO., LTD.
- Tsunehiro Muronoi
- B24 - GRINDING POLISHING
Information Patent Application
PROCESSING METHOD
- Publication number 20240258179
- Publication date Aug 1, 2024
- Disco Corporation
- Atsushi KOMATSU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND STATIC RANDOM-ACC...
- Publication number 20240251538
- Publication date Jul 25, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE SHEET FOR BACKGRINDING, SEMICONDUCTOR WAFER MANUFACTURING...
- Publication number 20240243000
- Publication date Jul 18, 2024
- Disco Corporation
- Shingo Motoike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICON...
- Publication number 20240234125
- Publication date Jul 11, 2024
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Application
SILICON WAFER MANUFACTURING METHOD
- Publication number 20240203745
- Publication date Jun 20, 2024
- Shin-Etsu Handotai Co., Ltd.
- Tatsuo ABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING COMPOSITION
- Publication number 20240199915
- Publication date Jun 20, 2024
- Yuichiro Nakagai
- B24 - GRINDING POLISHING
Information Patent Application
PRE-STACKING MECHANICAL STRENGTH ENHANCEMENT OF POWER DEVICE STRUCT...
- Publication number 20240186285
- Publication date Jun 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING GAAS WAFER, AND GAAS WAFER GROUP
- Publication number 20240162031
- Publication date May 16, 2024
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Junji SUGIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES RELATED TO RADIO FREQUENCY DEVICES
- Publication number 20240145253
- Publication date May 2, 2024
- Infineon Technologies Dresden GmbH & Co., KG
- Hans Taddiken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SUBSTRATE AND METHOD OF MANUFACTURING SILICON CARBI...
- Publication number 20240145229
- Publication date May 2, 2024
- Sumitomo Electric Industries, Ltd.
- Kyoko OKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICON...
- Publication number 20240136173
- Publication date Apr 25, 2024
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Application
PROCESSING METHOD OF BONDED WAFER AND PROCESSING APPARATUS
- Publication number 20240112902
- Publication date Apr 4, 2024
- Disco Corporation
- Hayato IGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRIMMING METHOD
- Publication number 20240112928
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- An-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS

Specific process step

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of fabricating gallium nitride substrate using ion implantation

Wafer process, apparatus and method of manufacturing an article

Manufacture method of a high-resistivity silicon handle wafer for a...

Method for manufacturing a semiconductor using slurry

System with substrate carrier deterioration detection and repair

Methods of forming an adhesive layer, and related adhesive films an...

Semiconductor wafer and method of wafer thinning

SiC wafer and manufacturing method for SiC wafer

Polishing composition

Method for wafer backside polishing

Integrated method for low-cost wide band gap semiconductor device m...

Silicon carbide substrate

Semiconductor device and method of fabricating the same

Method of processing a substrate

Method of printing laser mark and method of producing laser-marked...

Method for producing semiconductor wafers using a wire saw, wire sa...

Etching compositions

Processed inorganic wafer and processing wafer stack with abrasive...

Method of producing a substrate and system for producing a substrate

Monolayer graphene on non-polar face SiC substrate and control meth...

Semiconductor device and method of manufacturing the same

Display device, method of manufacturing window, and method of manuf...

Methods and apparatus for forming backside power rails

Semiconductor package structure and method of manufacturing the same

Interconnects having spacers for improved top via critical dimensio...

Methods and devices related to radio frequency devices

Bonded semiconductor devices having processor and static random-acc...

Wafer production method

Film for component manufacture and component manufacturing method

Method of CMP integration for improved optical uniformity in advanc...

Patents Applicationslast 30 patents

PROCESSING METHOD OF WAFER

PROCESSING METHOD AND PROCESSING SYSTEM

N-TYPE DOUBLE-SIDED SOLAR CELL PREPARATION METHOD

METHOD FOR WAFER BACKSIDE POLISHING

SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

METHOD FOR GRINDING SEMICONDUCTOR WAFERS

METHOD OF MANUFACTURING SEMICONDUCTOR WAFERS AND METHOD OF MANUFACT...

ETCHING COMPOSITIONS

CARRIER SUBSTRATE FOR SEMICONDUCTOR STRUCTURES SUITABLE FOR A TRANS...

METHOD OF MANUFACTURING SILICON WAFERS

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM

MANUFACTURING METHOD FOR MANUFACTURING SUBSTRATE OF NITRIDE CRYSTAL...

DISPLAY DEVICE, METHOD OF MANUFACTURING WINDOW, AND METHOD OF MANUF...

SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING SYSTEM AND COMPUT...

CARRIER STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE COMPRISING AN ELECTRICALLY CONDUCTIVE BONDI...

METHODS OF PROCESSING SEMICONDUCTOR WAFERS USING DOUBLE SIDE GRINDI...

PROCESSING METHOD

BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND STATIC RANDOM-ACC...

ADHESIVE SHEET FOR BACKGRINDING, SEMICONDUCTOR WAFER MANUFACTURING...

METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICON...

SILICON WAFER MANUFACTURING METHOD

POLISHING COMPOSITION

PRE-STACKING MECHANICAL STRENGTH ENHANCEMENT OF POWER DEVICE STRUCT...

METHOD OF PRODUCING GAAS WAFER, AND GAAS WAFER GROUP

METHODS AND DEVICES RELATED TO RADIO FREQUENCY DEVICES

SILICON CARBIDE SUBSTRATE AND METHOD OF MANUFACTURING SILICON CARBI...

METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICON...

PROCESSING METHOD OF BONDED WAFER AND PROCESSING APPARATUS

TRIMMING METHOD