Specific sequence of method steps

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CPC
H01L2224/81906

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81906Specific sequence of method steps

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of direct bonding semiconductor components
- Patent number 11,810,892
- Issue date Nov 7, 2023
- Imec VZW
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit packages and methods of forming same
- Patent number 11,387,118
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,257,776
- Issue date Feb 22, 2022
- Advanced Semiconductor Engineering, Inc.
- Yung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic interconnect, a method of manufacturing a metallic interco...
- Patent number 10,734,352
- Issue date Aug 4, 2020
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integration using Al—Ge eutectic bond interconnect
- Patent number 10,651,151
- Issue date May 12, 2020
- Invensense, Inc.
- Peter Smeys
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip mounted on a packaging substrate
- Patent number 10,418,340
- Issue date Sep 17, 2019
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,312,216
- Issue date Jun 4, 2019
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,297,568
- Issue date May 21, 2019
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming same
- Patent number 10,141,201
- Issue date Nov 27, 2018
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integration using Al—Ge eutectic bond interconnect
- Patent number 9,754,922
- Issue date Sep 5, 2017
- Invensense, Inc.
- Peter Smeys
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 9,633,981
- Issue date Apr 25, 2017
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D device packaging using through-substrate posts
- Patent number 9,515,006
- Issue date Dec 6, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Douglas M. Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 9,362,247
- Issue date Jun 7, 2016
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D assembly for interposer bow
- Patent number 9,059,241
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic device and electronic device
- Patent number 8,389,328
- Issue date Mar 5, 2013
- Sumitomo Bakelite Co., Ltd.
- Toru Meura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for electronic devices
- Patent number 8,278,143
- Issue date Oct 2, 2012
- Renesas Electronics Corporation
- Yoichiro Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for electronic devices
- Patent number 7,977,158
- Issue date Jul 12, 2011
- Renesas Electronics Corporation
- Yoichiro Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting an electronic component and mounting apparatus
- Patent number 7,828,193
- Issue date Nov 9, 2010
- Fujitsu Limited
- Kuniko Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite interconnect
- Patent number 7,791,194
- Issue date Sep 7, 2010
- Oracle America, Inc.
- Vadim Gektin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for electronic devices
- Patent number 7,772,032
- Issue date Aug 10, 2010
- NEC Electronics Corporation
- Yoichiro Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing an electrical connection using solder flux...
- Patent number 6,615,484
- Issue date Sep 9, 2003
- Litton Systems, Inc.
- Kenneth J. Kirsten
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder flux compatible with flip-chip underfill material
- Patent number 6,367,150
- Issue date Apr 9, 2002
- Northrop Grumman Corporation
- Kenneth J. Kirsten
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3486223
- Patent number 3,486,223
- Issue date Dec 30, 1969
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240234364
- Publication date Jul 11, 2024
- LG Innotek Co., Ltd.
- Tae Sup CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240136322
- Publication date Apr 25, 2024
- LG Innotek Co., Ltd.
- Tae Sup CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240047446
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming Same
- Publication number 20220301889
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING SEMICONDUCTOR COMPONENTS
- Publication number 20210159207
- Publication date May 27, 2021
- IMEC vzw
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210082853
- Publication date Mar 18, 2021
- Advanced Semiconductor Engineering, Inc.
- Yung-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallic Interconnect, a Method of Manufacturing a Metallic Interco...
- Publication number 20190103378
- Publication date Apr 4, 2019
- INFINEON TECHNOLOGIES AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20180026006
- Publication date Jan 25, 2018
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATION USING Al-Ge EUTECTIC BOND INTERCONNECT
- Publication number 20170330863
- Publication date Nov 16, 2017
- InvenSense, Inc.
- Peter Smeys
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20150348951
- Publication date Dec 3, 2015
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STUD BUMP AND PACKAGE STRUCTURE THEREOF AND METHOD OF MANUFACTURING...
- Publication number 20150194409
- Publication date Jul 9, 2015
- WIRE TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D ASSEMBLY FOR INTERPOSER BOW
- Publication number 20140209666
- Publication date Jul 31, 2014
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING CONNECTING PIN, SEMICONDUCTOR PACKAGE SUBSTRATE AND METHO...
- Publication number 20120127681
- Publication date May 24, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ji Man RYU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method for electronic devices
- Publication number 20110253767
- Publication date Oct 20, 2011
- RENESAS ELECTRONICS CORPORATION
- Yoichiro Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE
- Publication number 20110221075
- Publication date Sep 15, 2011
- SUMITOMO BAKELITE CO., LTD.
- Toru Meura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method for electronic devices
- Publication number 20100291732
- Publication date Nov 18, 2010
- NEC Electronics Corporation
- Yoichiro Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE INTERCONNECT
- Publication number 20090256255
- Publication date Oct 15, 2009
- SUN MICROSYSTEMS, INC.
- Vadim Gektin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method for electronic devices
- Publication number 20090137082
- Publication date May 28, 2009
- NEC Electronics Corporation
- Yoichiro Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of mounting an electronic component and mounting apparatus
- Publication number 20080203138
- Publication date Aug 28, 2008
- Fujitsu Limited
- Kuniko Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical circuit assembly with improved shock resistance
- Publication number 20050056946
- Publication date Mar 17, 2005
- Cookson Electronics, Inc.
- Kenneth B. Gilleo
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Solder flux compatible with flip-chip underfill material
- Publication number 20020095783
- Publication date Jul 25, 2002
- Kenneth J. Kirsten
- H01 - BASIC ELECTRIC ELEMENTS

Specific sequence of method steps

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of direct bonding semiconductor components

Integrated circuit packages and methods of forming same

Semiconductor package structure and method for manufacturing the same

Metallic interconnect, a method of manufacturing a metallic interco...

3D integration using Al—Ge eutectic bond interconnect

Semiconductor chip mounted on a packaging substrate

Systems and methods for bonding semiconductor elements

Systems and methods for bonding semiconductor elements

Integrated circuit packages and methods of forming same

3D integration using Al—Ge eutectic bond interconnect

Systems and methods for bonding semiconductor elements

3D device packaging using through-substrate posts

Systems and methods for bonding semiconductor elements

3D assembly for interposer bow

Method of manufacturing electronic device and electronic device

Manufacturing method for electronic devices

Manufacturing method for electronic devices

Method of mounting an electronic component and mounting apparatus

Composite interconnect

Manufacturing method for electronic devices

Method of manufacturing an electrical connection using solder flux...

Solder flux compatible with flip-chip underfill material

3486223

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

Integrated Circuit Packages and Methods of Forming Same

METHOD FOR BONDING SEMICONDUCTOR COMPONENTS

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Metallic Interconnect, a Method of Manufacturing a Metallic Interco...

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

3D INTEGRATION USING Al-Ge EUTECTIC BOND INTERCONNECT

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

STUD BUMP AND PACKAGE STRUCTURE THEREOF AND METHOD OF MANUFACTURING...

3D ASSEMBLY FOR INTERPOSER BOW

SOLDERING CONNECTING PIN, SEMICONDUCTOR PACKAGE SUBSTRATE AND METHO...

Manufacturing method for electronic devices

METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE

Manufacturing method for electronic devices

COMPOSITE INTERCONNECT

Manufacturing method for electronic devices

Method of mounting an electronic component and mounting apparatus

Electrical circuit assembly with improved shock resistance

Solder flux compatible with flip-chip underfill material