3486223

Information

• Patent Grant
• 3486223

• References
• Source

• Patent Number

  3,486,223

• Date Filed

  Not available

• Date Issued

  Tuesday, December 30, 1969
  55 years ago

• CPC

  • H01L24/81 - using a bump connector
  • B23K1/005 - Soldering by means of radiant energy
  • H01L24/75 - Apparatus for connecting with bump connectors or layer connectors
  • H05K3/3436 - having an array of bottom contacts
  • H01L2224/75 - Apparatus for connecting with bump connectors or layer connectors
  • H01L2224/75266 - in the upper part of the bonding apparatus
  • H01L2224/81143 - Passive alignment, i.e. self alignment
  • H01L2224/81203 - Thermocompression bonding
  • H01L2224/8123 - Polychromatic or infrared lamp heating
  • H01L2224/81815 - Reflow soldering
  • H01L2224/81906 - Specific sequence of method steps
  • H01L2224/81907 - Intermediate bonding
  • H01L2224/81986 - Specific sequence of steps
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01075 - Rhenium [Re]
  • H01L2924/01082 - Lead [Pb]
  • H01L2924/014 - Solder alloys
  • H05K3/3494 - Heating methods for reflowing of solder
  • H05K2203/111 - Preheating
  • H05K2203/1476 - Same or similar kind of process performed in phases
  • H05K2203/306 - Lifting the component during or after mounting Increasing the gap between component and PCB
  • Y02P70/613 - involving the assembly of several electronic elements
  • Y10T29/49144 - by metal fusion

• US Classifications

  • 029 - Metal working
  • 219 - Electric heating
  • 228 - Metal fusion bonding
  • 257 - Active solid-state devices
  • 361 - Electricity: electrical systems and devices
  • 392 - Electric resistance heating devices