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H01L2224/80986

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80986Specific sequence of steps

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Stacked semiconductor structure and method
- Patent number 12,068,287
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary bonding structures for die-to-die and wafer-to-wafer bonding
- Patent number 12,057,429
- Issue date Aug 6, 2024
- HRL Laboratories, LLC
- Aurelio Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buffer layer(s) on a stacked structure having a via
- Patent number 12,021,066
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Fa Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,916,031
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of transferring micro-light emitting diode for LED display
- Patent number 11,869,880
- Issue date Jan 9, 2024
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-wafer capping layer for metal arcing protection
- Patent number 11,862,515
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrate rinse module in hybrid bonding platform
- Patent number 11,854,795
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,830,838
- Issue date Nov 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing apparatus, operation method thereof, and method for m...
- Patent number 11,791,305
- Issue date Oct 17, 2023
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
- Patent number 11,776,923
- Issue date Oct 3, 2023
- Sony Corporation
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chip package and methods of manufacture thereof
- Patent number 11,664,349
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with through substrate via (TSV)
- Patent number 11,658,172
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-wafer capping layer for metal arcing protection
- Patent number 11,610,812
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor structure and method
- Patent number 11,587,910
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing for hybrid bonding
- Patent number 11,552,041
- Issue date Jan 10, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly containing oxidation barriers, hybrid bonding, or a...
- Patent number 11,393,780
- Issue date Jul 19, 2022
- SanDisk Technologies LLC
- Ramy Nashed Bassely Said
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,335,656
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembly by direct bonding between two elements, each ele...
- Patent number 11,305,372
- Issue date Apr 19, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Lea Di Cioccio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrate rinse module in hybrid bonding platform
- Patent number 11,282,697
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Buffer layer(s) on a stacked structure having a via
- Patent number 11,270,978
- Issue date Mar 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Fa Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,264,345
- Issue date Mar 1, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods for forming same
- Patent number 11,195,748
- Issue date Dec 7, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding and connecting substrates
- Patent number 11,107,855
- Issue date Aug 31, 2021
- Sony Corporation
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor structure and method
- Patent number 11,037,909
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interface structures and methods for forming same
- Patent number 10,998,265
- Issue date May 4, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic apparatus
- Patent number 10,985,081
- Issue date Apr 20, 2021
- Sony Corporation
- Yukihiro Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 10,978,655
- Issue date Apr 13, 2021
- Samsung Electronics Co., Ltd.
- Yi-Koan Hong
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
- Patent number 10,950,637
- Issue date Mar 16, 2021
- Sony Corporation
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring micro device
- Patent number 10,937,674
- Issue date Mar 2, 2021
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and method for preparing the same
- Patent number 10,923,455
- Issue date Feb 16, 2021
- Nanya Technology Corporation
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20240379607
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20240243085
- Publication date Jul 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated process sequence for hybrid bonding applications
- Publication number 20240194635
- Publication date Jun 13, 2024
- Niranjan PINGLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-WAFER CAPPING LAYER FOR METAL ARCING PROTECTION
- Publication number 20240079268
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...
- Publication number 20230402411
- Publication date Dec 14, 2023
- SONY GROUP CORPORATION
- Masaki HANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TRANSFERRING MICRO-LIGHT EMITTING DIODE FOR LED DISPLAY
- Publication number 20230395575
- Publication date Dec 7, 2023
- Samsung Electronics Co., Ltd.
- Kyungwook HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACKING STRUCTURE AND PREPARATION METHOD THEREOF, CHIP STACKI...
- Publication number 20230369292
- Publication date Nov 16, 2023
- Huawei Technologies Co., Ltd
- Shan GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD
- Publication number 20230275062
- Publication date Aug 31, 2023
- TOKYO ELECTRON LIMITED
- Toshifumi Inamasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20230268308
- Publication date Aug 24, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A PROCEDURE TO ENABLE DIE REWORK FOR HYBRID BONDING
- Publication number 20230260955
- Publication date Aug 17, 2023
- Ying WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Structure and Method
- Publication number 20230207530
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Co, LTD.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ASSEMBLY BY DIRECT BONDING OF ELECTRONIC COMPONENTS
- Publication number 20230207515
- Publication date Jun 29, 2023
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Frank Fournel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR THE ALIGNMENT OF SUBSTRATES
- Publication number 20230207513
- Publication date Jun 29, 2023
- EV GROUP E. THALLNER GMBH
- Dominik Zinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING SYSTEMS, AND METHODS OF USING THE SAME
- Publication number 20230163095
- Publication date May 25, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Andreas Marte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PLACING IN PACKAGING
- Publication number 20230137490
- Publication date May 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING APPARATUS AND HYBRID BONDING METHOD USING THE SAME
- Publication number 20230087198
- Publication date Mar 23, 2023
- HANWHA PRECISION MACHINERY CO., LTD.
- Tae Woo KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDED ARTICLE, AND BONDING DEVICE
- Publication number 20230030272
- Publication date Feb 2, 2023
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-WAFER CAPPING LAYER FOR METAL ARCING PROTECTION
- Publication number 20220375789
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing
- Publication number 20220278063
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING APPARATUS, OPERATION METHOD THEREOF, AND METHOD FOR M...
- Publication number 20220262764
- Publication date Aug 18, 2022
- KIOXIA Corporation
- Sho KAWADAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20220254746
- Publication date Aug 11, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. ENQUIST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Buffer Layer(s) on a Stacked Structure Having a Via
- Publication number 20220189928
- Publication date Jun 16, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Fa Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS FOR FORMING SAME
- Publication number 20220130714
- Publication date Apr 28, 2022
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20210366958
- Publication date Nov 25, 2021
- SONY GROUP CORPORATION
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Structure and Method
- Publication number 20210225813
- Publication date Jul 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...
- Publication number 20210183661
- Publication date Jun 17, 2021
- SONY CORPORATION
- Masaki HANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-WAFER CAPPING LAYER FOR METAL ARCING PROTECTION
- Publication number 20210134663
- Publication date May 6, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TRANSFERRING MICRO-LIGHT EMITTING DIODE FOR LED DISPLAY
- Publication number 20210134770
- Publication date May 6, 2021
- Samsung Electronics Co., Ltd.
- Kyungwook HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20210066233
- Publication date Mar 4, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Gaius Gillman FOUNTAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY CONTAINING OXIDATION BARRIERS, HYBRID BONDING, OR A...
- Publication number 20210028135
- Publication date Jan 28, 2021
- SANDISK TECHNOLOGIES LLC
- Ramy Nashed Bassely SAID
- H01 - BASIC ELECTRIC ELEMENTS

Specific sequence of steps

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stacked semiconductor structure and method

Temporary bonding structures for die-to-die and wafer-to-wafer bonding

Buffer layer(s) on a stacked structure having a via

Semiconductor device and method of manufacturing

Method of transferring micro-light emitting diode for LED display

Multi-wafer capping layer for metal arcing protection

Integrate rinse module in hybrid bonding platform

Conductive barrier direct hybrid bonding

Manufacturing apparatus, operation method thereof, and method for m...

Semiconductor device, manufacturing method, solid state image senso...

Stacked chip package and methods of manufacture thereof

Hybrid bonding with through substrate via (TSV)

Multi-wafer capping layer for metal arcing protection

Stacked semiconductor structure and method

Chemical mechanical polishing for hybrid bonding

Bonded assembly containing oxidation barriers, hybrid bonding, or a...

Semiconductor device and method of manufacturing

Method of assembly by direct bonding between two elements, each ele...

Integrate rinse module in hybrid bonding platform

Buffer layer(s) on a stacked structure having a via

Conductive barrier direct hybrid bonding

Interconnect structures and methods for forming same

Method for bonding and connecting substrates

Stacked semiconductor structure and method

Interface structures and methods for forming same

Semiconductor device and electronic apparatus

Semiconductor devices

Semiconductor device, manufacturing method, solid state image senso...

Method for transferring micro device

Semiconductor apparatus and method for preparing the same

Patents Applicationslast 30 patents

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

Integrated process sequence for hybrid bonding applications

MULTI-WAFER CAPPING LAYER FOR METAL ARCING PROTECTION

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...

METHOD OF TRANSFERRING MICRO-LIGHT EMITTING DIODE FOR LED DISPLAY

CHIP STACKING STRUCTURE AND PREPARATION METHOD THEREOF, CHIP STACKI...

BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

A PROCEDURE TO ENABLE DIE REWORK FOR HYBRID BONDING

Stacked Semiconductor Structure and Method

METHOD OF ASSEMBLY BY DIRECT BONDING OF ELECTRONIC COMPONENTS

DEVICE AND METHOD FOR THE ALIGNMENT OF SUBSTRATES

DIE BONDING SYSTEMS, AND METHODS OF USING THE SAME

SEMICONDUCTOR PLACING IN PACKAGING

HYBRID BONDING APPARATUS AND HYBRID BONDING METHOD USING THE SAME

BONDING METHOD, BONDED ARTICLE, AND BONDING DEVICE

MULTI-WAFER CAPPING LAYER FOR METAL ARCING PROTECTION

Semiconductor Device and Method of Manufacturing

MANUFACTURING APPARATUS, OPERATION METHOD THEREOF, AND METHOD FOR M...

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

Buffer Layer(s) on a Stacked Structure Having a Via

INTERCONNECT STRUCTURES AND METHODS FOR FORMING SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

Stacked Semiconductor Structure and Method

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...

MULTI-WAFER CAPPING LAYER FOR METAL ARCING PROTECTION

METHOD OF TRANSFERRING MICRO-LIGHT EMITTING DIODE FOR LED DISPLAY

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

BONDED ASSEMBLY CONTAINING OXIDATION BARRIERS, HYBRID BONDING, OR A...