Specific sequence of steps

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CPC
H01L2224/85986

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85986Specific sequence of steps

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wire bonding apparatus and method for manufacturing semiconductor d...
- Patent number 12,107,070
- Issue date Oct 1, 2024
- Shinkawa Ltd.
- Hiroaki Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 11,887,970
- Issue date Jan 30, 2024
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive wire with increased attachme...
- Patent number 11,804,447
- Issue date Oct 31, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Jun Ho Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,735,563
- Issue date Aug 22, 2023
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leads for semiconductor package
- Patent number 11,538,740
- Issue date Dec 27, 2022
- Texas Instruments Incorporated
- Jason Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 11,373,979
- Issue date Jun 28, 2022
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging
- Patent number 11,227,852
- Issue date Jan 18, 2022
- Texas Instruments Incorporated
- Honglin Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing an ultra-high density space interconnect lead...
- Patent number 11,211,357
- Issue date Dec 28, 2021
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Yun Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,189,595
- Issue date Nov 30, 2021
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical coupling assemblies and methods for optoelectronic modules
- Patent number 11,139,412
- Issue date Oct 5, 2021
- II-VI DELAWARE, INC.
- Tao Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies including multiple shingled stacks...
- Patent number 11,094,670
- Issue date Aug 17, 2021
- Micron Technology, Inc.
- Hong Wan Ng
- G11 - INFORMATION STORAGE
Information Patent Grant
Bond wire support systems and methods
- Patent number 11,049,836
- Issue date Jun 29, 2021
- Texas Instruments Incorporated
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive wire with increased attachme...
- Patent number 10,943,871
- Issue date Mar 9, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Jun Ho Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 10,916,522
- Issue date Feb 9, 2021
- Nichia Corporation
- Daisuke Fukamachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 10,756,049
- Issue date Aug 25, 2020
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic unit
- Patent number 10,714,461
- Issue date Jul 14, 2020
- Vishay Semiconductor GmbH
- Christoph Paul Gebauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging
- Patent number 10,629,562
- Issue date Apr 21, 2020
- Texas Instruments Incorporated
- Honglin Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding technique for integrated circuit board connections
- Patent number 10,600,756
- Issue date Mar 24, 2020
- United States of America, as represented by the Secretary of the Navy
- Evan A. Aanerud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies including multiple shingled stacks...
- Patent number 10,522,507
- Issue date Dec 31, 2019
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory with stacked semiconductor chips
- Patent number 10,347,618
- Issue date Jul 9, 2019
- VALLEY DEVICE MANAGEMENT
- Masanori Onodera
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device assemblies including multiple shingled stacks...
- Patent number 10,312,219
- Issue date Jun 4, 2019
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including antistatic die attach material
- Patent number 10,304,795
- Issue date May 28, 2019
- Infineon Technologies AG
- Volker Strutz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,170,402
- Issue date Jan 1, 2019
- Renesas Electronics Corporation
- Yosuke Imazeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,163,850
- Issue date Dec 25, 2018
- Rohm Co., Ltd.
- Motoharu Haga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having conductive wire with increased attachme...
- Patent number 10,141,269
- Issue date Nov 27, 2018
- Amkor Technology, Inc.
- Jun Ho Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with overlapped lead terminals
- Patent number 10,134,659
- Issue date Nov 20, 2018
- Renesas Electronics Corporation
- Hiroaki Narita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 10,062,667
- Issue date Aug 28, 2018
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding a hermetic module to an electrode array
- Patent number 9,984,994
- Issue date May 29, 2018
- The Charles Stark Draper Laboratory, Inc.
- Tirunelveli Sriram
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,972,598
- Issue date May 15, 2018
- Renesas Electronics Corporation
- Yuki Yagyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory and devices that use the same
- Patent number 9,837,397
- Issue date Dec 5, 2017
- VALLEY DEVICE MANAGEMENT
- Masanori Onodera
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SECURITY WIRE OVER STITCH BOND
- Publication number 20240128228
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Aniceto Rabilas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR P...
- Publication number 20240038720
- Publication date Feb 1, 2024
- SK HYNIX INC.
- Su Ji UM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230369282
- Publication date Nov 16, 2023
- Samsung Electronics Co., Ltd.
- Donguk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIBBON SHIELD DEVICE AND METHOD
- Publication number 20230317680
- Publication date Oct 5, 2023
- Intel Corporation
- Prabhat Ranjan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF DETERMINING A SEQUENCE FOR CREATING A PLURALITY OF WIRE...
- Publication number 20230260960
- Publication date Aug 17, 2023
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...
- Publication number 20230154888
- Publication date May 18, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Jon W. Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMAGING ELEMENT AND METHOD FOR MANUFACTURING IMAGING ELEMENT
- Publication number 20230139201
- Publication date May 4, 2023
- Sony Semiconductor Solutions Corporation
- Kenta FUKUSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230119348
- Publication date Apr 20, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE GEOMETRIES TO ENABLE VISUAL INSPECTION OF SOLDER FILLETS
- Publication number 20230098907
- Publication date Mar 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- LongTing LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR D...
- Publication number 20220328450
- Publication date Oct 13, 2022
- SHINKAWA LTD.
- Hiroaki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEV...
- Publication number 20220208721
- Publication date Jun 30, 2022
- SHINKAWA LTD.
- Hiroaki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING AN ULTRA-HIGH DENSITY SPACE INTERCONNECT LEAD...
- Publication number 20210210461
- Publication date Jul 8, 2021
- Guangdong University of Technology
- Yun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...
- Publication number 20210143105
- Publication date May 13, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Jun Ho JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADS FOR SEMICONDUCTOR PACKAGE
- Publication number 20210020549
- Publication date Jan 21, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Jason CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL COUPLING ASSEMBLIES AND METHODS FOR OPTOELECTRONIC MODULES
- Publication number 20200357946
- Publication date Nov 12, 2020
- Finisar Corporation
- Tao SUN
- G02 - OPTICS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING
- Publication number 20200251440
- Publication date Aug 6, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Honglin GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MULTIPLE SHINGLED STACKS...
- Publication number 20200020667
- Publication date Jan 16, 2020
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND WIRE SUPPORT SYSTEMS AND METHODS
- Publication number 20190326247
- Publication date Oct 24, 2019
- TEXAS INSTRUMENTS INCORPORATED
- MATTHEW DAVID ROMIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MULTIPLE SHINGLED STACKS...
- Publication number 20190244930
- Publication date Aug 8, 2019
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING WIRE BONDING STRUCTURES AND METHODS OF...
- Publication number 20190157237
- Publication date May 23, 2019
- Samsung Electronics Co., Ltd.
- Yong Je LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MULTIPLE SHINGLED STACKS...
- Publication number 20190139934
- Publication date May 9, 2019
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20190096847
- Publication date Mar 28, 2019
- Nichia Corporation.
- Daisuke FUKAMACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...
- Publication number 20190051616
- Publication date Feb 14, 2019
- Amkor Technology Inc.
- Jun Ho JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS
- Publication number 20180358331
- Publication date Dec 13, 2018
- Micron Technology, Inc.
- Mung Suan Heng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180082977
- Publication date Mar 22, 2018
- RENESAS ELECTRONICS CORPORATION
- Yuki YAGYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFORE
- Publication number 20180076188
- Publication date Mar 15, 2018
- VALLEY DEVICE MANAGEMENT
- Masanori Onodera
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20180026007
- Publication date Jan 25, 2018
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180005981
- Publication date Jan 4, 2018
- Rohm Co., Ltd.
- Motoharu HAGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170323848
- Publication date Nov 9, 2017
- RENESAS ELECTRONICS CORPORATION
- Takanori Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND PROCESS OF FORMING THE SAME
- Publication number 20170179074
- Publication date Jun 22, 2017
- Semiconductor Components Industries, LLC
- Harold G. ANDERSON
- H01 - BASIC ELECTRIC ELEMENTS

Specific sequence of steps

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wire bonding apparatus and method for manufacturing semiconductor d...

Stacked microfeature devices and associated methods

Semiconductor device having conductive wire with increased attachme...

Package-on-package assembly with wire bond vias

Leads for semiconductor package

Stacked microfeature devices and associated methods

Integrated circuit packaging

Method for processing an ultra-high density space interconnect lead...

Package-on-package assembly with wire bond vias

Electrical coupling assemblies and methods for optoelectronic modules

Semiconductor device assemblies including multiple shingled stacks...

Bond wire support systems and methods

Semiconductor device having conductive wire with increased attachme...

Semiconductor device and method for manufacturing same

Package-on-package assembly with wire bond vias

Electronic unit

Integrated circuit packaging

Wire bonding technique for integrated circuit board connections

Semiconductor device assemblies including multiple shingled stacks...

Non-volatile memory with stacked semiconductor chips

Semiconductor device assemblies including multiple shingled stacks...

Semiconductor device including antistatic die attach material

Semiconductor device

Semiconductor device

Semiconductor device having conductive wire with increased attachme...

Semiconductor device with overlapped lead terminals

Stacked microfeature devices and associated methods

Method for bonding a hermetic module to an electrode array

Method of manufacturing semiconductor device

Non-volatile memory and devices that use the same

Patents Applicationslast 30 patents

SECURITY WIRE OVER STITCH BOND

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR P...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

RIBBON SHIELD DEVICE AND METHOD

METHODS OF DETERMINING A SEQUENCE FOR CREATING A PLURALITY OF WIRE...

METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...

IMAGING ELEMENT AND METHOD FOR MANUFACTURING IMAGING ELEMENT

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE GEOMETRIES TO ENABLE VISUAL INSPECTION OF SOLDER FILLETS

WIRE BONDING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR D...

WIRE BONDING APPARATUS, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEV...

METHOD FOR PROCESSING AN ULTRA-HIGH DENSITY SPACE INTERCONNECT LEAD...

SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...

LEADS FOR SEMICONDUCTOR PACKAGE

ELECTRICAL COUPLING ASSEMBLIES AND METHODS FOR OPTOELECTRONIC MODULES

INTEGRATED CIRCUIT PACKAGING

SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MULTIPLE SHINGLED STACKS...

BOND WIRE SUPPORT SYSTEMS AND METHODS

SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MULTIPLE SHINGLED STACKS...

SEMICONDUCTOR DEVICES HAVING WIRE BONDING STRUCTURES AND METHODS OF...

SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MULTIPLE SHINGLED STACKS...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...

STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFORE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC DEVICES AND PROCESS OF FORMING THE SAME