Spin coating

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H01L2224/27416

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/27416Spin coating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor components having conductive vias with aligned back s...
- Patent number 11,869,809
- Issue date Jan 9, 2024
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 11,648,750
- Issue date May 16, 2023
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for producing structure, and structure
- Patent number 11,569,192
- Issue date Jan 31, 2023
- Shinkawa Ltd.
- Yuji Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered transient liquid phase bonding
- Patent number 11,546,998
- Issue date Jan 3, 2023
- Skyworks Solutions, Inc.
- Bradley Paul Barber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 11,342,309
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of device chip
- Patent number 11,024,542
- Issue date Jun 1, 2021
- Disco Corporation
- Heidi Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer reconfiguration during a coating process or an electric plati...
- Patent number 10,964,580
- Issue date Mar 30, 2021
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 10,734,353
- Issue date Aug 4, 2020
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 10,714,457
- Issue date Jul 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly
- Patent number 10,665,565
- Issue date May 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste and die bonding method
- Patent number 10,615,144
- Issue date Apr 7, 2020
- Kaken Tech Co., Ltd.
- Shigeo Hori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for manufacturing semiconductor apparatus, method for manufa...
- Patent number 10,416,557
- Issue date Sep 17, 2019
- Shin-Etsu Chemical Co., Ltd.
- Kyoko Soga
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
3D packaging method for semiconductor components
- Patent number 10,418,339
- Issue date Sep 17, 2019
- Imec VZW
- Fabrice Duval
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 10,410,991
- Issue date Sep 10, 2019
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 10,290,611
- Issue date May 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Articles including ultra low dielectric layers
- Patent number 10,217,661
- Issue date Feb 26, 2019
- International Business Machines Corporation
- Robert L. Bruce
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly
- Patent number 10,192,848
- Issue date Jan 29, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip mounting structure
- Patent number 10,141,278
- Issue date Nov 27, 2018
- International Business Machines Corporation
- Akihiro Horibe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method for connecting two wafers
- Patent number 10,134,707
- Issue date Nov 20, 2018
- Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung E.V.
- Kai Zoschke
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for bonding substrates
- Patent number 9,929,124
- Issue date Mar 27, 2018
- EV Group E. Thallner GmbH
- Jurgen Burggraf
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chip mounting structure
- Patent number 9,893,031
- Issue date Feb 13, 2018
- International Business Machines Corporation
- Akihiro Horibe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive paste and die bonding method
- Patent number 9,818,718
- Issue date Nov 14, 2017
- Kaken Tech Co., Ltd.
- Shigeo Hori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive for semiconductor, fluxing agent, manufacturing method for...
- Patent number 9,803,111
- Issue date Oct 31, 2017
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming package assembly
- Patent number 9,780,064
- Issue date Oct 3, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an ultra low dielectric layer
- Patent number 9,773,698
- Issue date Sep 26, 2017
- International Business Machines Corporation
- Robert L. Bruce
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive for mounting flip chip for use in a method for producing a...
- Patent number 9,748,195
- Issue date Aug 29, 2017
- Sekisui Chemical Co., Ltd.
- Sayaka Wakioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a semiconductor device
- Patent number 9,653,623
- Issue date May 16, 2017
- Samsung Electronics Co., Ltd.
- Yi-Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of making same
- Patent number 9,613,932
- Issue date Apr 4, 2017
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of repellent material to protect fabrication regions in semi co...
- Patent number 9,607,896
- Issue date Mar 28, 2017
- Henkel IP & Holding GmbH
- Raj Peddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer reconfiguration
- Patent number 9,545,776
- Issue date Jan 17, 2017
- Dyi-Chung Hu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE WITH WAFER LEVEL CAPACITOR
- Publication number 20240404929
- Publication date Dec 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kapil Sahasrabudhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR PACKAGE
- Publication number 20240304639
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK S...
- Publication number 20240145305
- Publication date May 2, 2024
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240145366
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Dongjoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD...
- Publication number 20240096845
- Publication date Mar 21, 2024
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20240047407
- Publication date Feb 8, 2024
- STMicroelectronics (Grenoble 2) SAS
- Younes BOUTALEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE
- Publication number 20240021563
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- Seokhyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE MATERIAL FOR ELECTRONIC DEVICES
- Publication number 20230268309
- Publication date Aug 24, 2023
- SUMITOMO CHEMICAL CO., LTD.
- Martin Humphries
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20230191747
- Publication date Jun 22, 2023
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR USING A BUFFER SHEET
- Publication number 20230095879
- Publication date Mar 30, 2023
- Showa Denko Materials Co., Ltd.
- Yuta Koseki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230084360
- Publication date Mar 16, 2023
- InnoLux Corporation
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20220285323
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK S...
- Publication number 20210134674
- Publication date May 6, 2021
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20200365552
- Publication date Nov 19, 2020
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20200343224
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED TRANSIENT LIQUID PHASE BONDING
- Publication number 20200146155
- Publication date May 7, 2020
- SKYWORKS SOLUTIONS, INC.
- Bradley Paul Barber
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PRODUCING STRUCTURE, AND STRUCTURE
- Publication number 20200083190
- Publication date Mar 12, 2020
- SHINKAWA LTD.
- Yuji EGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20190341364
- Publication date Nov 7, 2019
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20190267354
- Publication date Aug 29, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PASTE AND DIE BONDING METHOD
- Publication number 20190139930
- Publication date May 9, 2019
- KAKEN TECH CO., LTD.
- Shigeo Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PERFORMING DIE-BASED HETEROGENEOUS INTEGRATION AND DEVICE...
- Publication number 20190123035
- Publication date Apr 25, 2019
- Samsung Electronics Co., Ltd.
- Daniel N. Carothers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MOUNTING STRUCTURE
- Publication number 20180076162
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Akihiro HORIBE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE ASSEMBLY
- Publication number 20180012860
- Publication date Jan 11, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Hung-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARTICLES INCLUDING ULTRA LOW DIELECTRIC LAYERS
- Publication number 20170365511
- Publication date Dec 21, 2017
- International Business Machines Corporation
- Robert L. Bruce
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Semiconductor Chip with Electrically Conducting Layer
- Publication number 20150145107
- Publication date May 28, 2015
- INFINEON TECHNOLOGIES AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140357025
- Publication date Dec 4, 2014
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...
- Publication number 20140317915
- Publication date Oct 30, 2014
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Yong Sung EOM
- B82 - NANO-TECHNOLOGY
Information Patent Application
COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...
- Publication number 20140317918
- Publication date Oct 30, 2014
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Yong Sung EOM
- B82 - NANO-TECHNOLOGY
Information Patent Application
Wafer scale technique for interconnecting vertically stacked dies
- Publication number 20140300008
- Publication date Oct 9, 2014
- Pinxiang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL NANOPATTERNABLE INTERFACIAL BONDING
- Publication number 20140283982
- Publication date Sep 25, 2014
- Tingrui Pan
- B32 - LAYERED PRODUCTS

Spin coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor components having conductive vias with aligned back s...

Adhesive bonding composition and method of use

Method for producing structure, and structure

Multilayered transient liquid phase bonding

Semiconductor packages and methods of forming same

Manufacturing method of device chip

Wafer reconfiguration during a coating process or an electric plati...

Adhesive bonding composition and method of use

Semiconductor packages and methods of forming same

Package assembly

Conductive paste and die bonding method

Method for manufacturing semiconductor apparatus, method for manufa...

3D packaging method for semiconductor components

Adhesive bonding composition and method of use

Semiconductor packages and methods of forming same

Articles including ultra low dielectric layers

Package assembly

Chip mounting structure

Bonding method for connecting two wafers

Method for bonding substrates

Chip mounting structure

Conductive paste and die bonding method

Adhesive for semiconductor, fluxing agent, manufacturing method for...

Method of forming package assembly

Method of manufacturing an ultra low dielectric layer

Adhesive for mounting flip chip for use in a method for producing a...

Methods of manufacturing a semiconductor device

Integrated circuit package and method of making same

Use of repellent material to protect fabrication regions in semi co...

Wafer reconfiguration

Patents Applicationslast 30 patents

ELECTRONIC DEVICE WITH WAFER LEVEL CAPACITOR

OPTICAL SENSOR PACKAGE

SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK S...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD...

INTEGRATED CIRCUIT PACKAGE

METHOD OF MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE

THERMALLY CONDUCTIVE MATERIAL FOR ELECTRONIC DEVICES

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

METHOD FOR USING A BUFFER SHEET

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor Packages and Methods of Forming Same

SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK S...

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

Semiconductor Packages and Methods of Forming Same

MULTILAYERED TRANSIENT LIQUID PHASE BONDING

METHOD FOR PRODUCING STRUCTURE, AND STRUCTURE

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

Semiconductor Packages and Methods of Forming Same

CONDUCTIVE PASTE AND DIE BONDING METHOD

METHOD OF PERFORMING DIE-BASED HETEROGENEOUS INTEGRATION AND DEVICE...

CHIP MOUNTING STRUCTURE

PACKAGE ASSEMBLY

ARTICLES INCLUDING ULTRA LOW DIELECTRIC LAYERS

Semiconductor Chip with Electrically Conducting Layer

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...

COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...

Wafer scale technique for interconnecting vertically stacked dies

UNIVERSAL NANOPATTERNABLE INTERFACIAL BONDING