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H01L2224/3313

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/3313Square or rectangular array

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Use of pre-channeled materials for anisotropic conductors
- Patent number 12,051,670
- Issue date Jul 30, 2024
- Micron Technology, Inc.
- Mark E. Tuttle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,955,453
- Issue date Apr 9, 2024
- Ultra Display Technology Corp.
- Hsien-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of pre-channeled materials for anisotropic conductors
- Patent number 11,139,262
- Issue date Oct 5, 2021
- Micron Technology, Inc.
- Mark E. Tuttle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging module can easily and stably connect an imaging-sensing dev...
- Patent number 10,804,620
- Issue date Oct 13, 2020
- Fujikura Ltd.
- Takao Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of chip package structure
- Patent number 10,431,564
- Issue date Oct 1, 2019
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for coating conductive substrate with adhesive
- Patent number 10,056,534
- Issue date Aug 21, 2018
- G-SMATT CO., LTD.
- Hak Ryul Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including an adhesive pattern
- Patent number 10,043,789
- Issue date Aug 7, 2018
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a semiconductor element and a terminal...
- Patent number 9,306,046
- Issue date Apr 5, 2016
- Mitsubishi Electric Corporation
- Shigeo Toi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for package reinforcement using molding underfill
- Patent number 9,287,143
- Issue date Mar 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting electronic components
- Patent number 8,230,590
- Issue date Jul 31, 2012
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
USE OF PRE-CHANNELED MATERIALS FOR ANISOTROPIC CONDUCTORS
- Publication number 20240387441
- Publication date Nov 21, 2024
- Micron Technology, Inc.
- Mark E. Tuttle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20240321810
- Publication date Sep 26, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YU-CHIAO TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE DEVICE WITH VIA FORMED IN ISOLATION TRENCH
- Publication number 20240105586
- Publication date Mar 28, 2024
- Saras Mirco Devices, Inc.
- Courtney Timms
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Use of Pre-Channeled Materials for Anisotropic Conductors
- Publication number 20200258859
- Publication date Aug 13, 2020
- Micron Technology, Inc.
- Mark E. Tuttle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20180061816
- Publication date Mar 1, 2018
- Youngbae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR COATING CONDUCTIVE SUBSTRATE WITH ADHESIVE
- Publication number 20160284958
- Publication date Sep 29, 2016
- G-SMATT CO., LTD.
- Hak Ryul SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE STRUCTURE
- Publication number 20150214192
- Publication date Jul 30, 2015
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Package Reinforcement
- Publication number 20140159223
- Publication date Jun 12, 2014
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOUNTING ELECTRONIC COMPONENTS
- Publication number 20080196245
- Publication date Aug 21, 2008
- Fujitsu Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Square or rectangular array

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Use of pre-channeled materials for anisotropic conductors

Electronic device

Use of pre-channeled materials for anisotropic conductors

Imaging module can easily and stably connect an imaging-sensing dev...

Structure and formation method of chip package structure

Method for coating conductive substrate with adhesive

Semiconductor packages including an adhesive pattern

Semiconductor device having a semiconductor element and a terminal...

Apparatus for package reinforcement using molding underfill

Method for mounting electronic components

Patents Applicationslast 30 patents

USE OF PRE-CHANNELED MATERIALS FOR ANISOTROPIC CONDUCTORS

CHIP PACKAGE STRUCTURE

INTEGRATED PASSIVE DEVICE WITH VIA FORMED IN ISOLATION TRENCH

Use of Pre-Channeled Materials for Anisotropic Conductors

SEMICONDUCTOR PACKAGES

METHOD FOR COATING CONDUCTIVE SUBSTRATE WITH ADHESIVE

STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE STRUCTURE

Apparatus and Method for Package Reinforcement

METHOD FOR MOUNTING ELECTRONIC COMPONENTS