Membership
Tour
Register
Log in
Square or rectangular array
Follow
Industry
CPC
H01L2224/0613
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/0613
Square or rectangular array
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Pad structure design in fan-out package
Patent number
11,984,405
Issue date
May 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bond enhancement structure in microelectronics for trapping contami...
Patent number
11,967,575
Issue date
Apr 23, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Guilian Gao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Memories and memory components with interconnected and redundant da...
Patent number
11,955,165
Issue date
Apr 9, 2024
RAMBUS INC.
Frederick A. Ware
G11 - INFORMATION STORAGE
Information
Patent Grant
Semiconductor package and method of fabricating the same
Patent number
11,935,871
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hao-Yi Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,923,279
Issue date
Mar 5, 2024
Sony Group Corporation
Nobutoshi Fujii
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing
Patent number
11,916,031
Issue date
Feb 27, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Chia Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods related to radio-frequency switching devices having improve...
Patent number
11,901,243
Issue date
Feb 13, 2024
Skyworks Solutions, Inc.
Guillaume Alexandre Blin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contact pad for semiconductor device
Patent number
11,901,320
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chang-Chia Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Infrared sensor and imaging apparatus
Patent number
11,901,389
Issue date
Feb 13, 2024
NEC Corporation
Tomo Tanaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device
Patent number
11,862,645
Issue date
Jan 2, 2024
Samsung Display Co., Ltd.
So Young Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked semiconductor die assemblies with support members and assoc...
Patent number
11,855,065
Issue date
Dec 26, 2023
Micron Technology, Inc.
Hong Wan Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,824,043
Issue date
Nov 21, 2023
Samsung Electronics Co, Ltd.
Hyunjun Noh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device including adhesive film with conductive ball
Patent number
11,824,034
Issue date
Nov 21, 2023
Samsung Display Co., Ltd.
Joo-nyung Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of direct bonding semiconductor components
Patent number
11,810,892
Issue date
Nov 7, 2023
Imec VZW
Jaber Derakhshandeh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device and method of manufacturing the same
Patent number
11,810,869
Issue date
Nov 7, 2023
Renesas Electronics Corporation
Kazuo Tomita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D image sensor
Patent number
11,810,941
Issue date
Nov 7, 2023
Samsung Electronics Co., Ltd.
Min-Sun Keel
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Electronic device including conductive adhesive layer
Patent number
11,805,685
Issue date
Oct 31, 2023
Samsung Display Co., Ltd.
Youngmin Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display panel and manufacturing method for same
Patent number
11,776,943
Issue date
Oct 3, 2023
Samsung Display Co., Ltd.
Hyun A Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Crack detection chip and crack detection method using the same
Patent number
11,740,276
Issue date
Aug 29, 2023
Samsung Electronics Co., Ltd.
Chan-Sik Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor memory device structure
Patent number
11,742,307
Issue date
Aug 29, 2023
OVONYX MEMORY TECHNOLOGY, LLC
John Moore
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interface of integrated circuit die and method for arranging interf...
Patent number
11,742,295
Issue date
Aug 29, 2023
Global Unichip Corporation
Ting-Hao Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages and manufacturing methods for the same
Patent number
11,735,559
Issue date
Aug 22, 2023
SK hynix Inc.
Chan Sun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,728,300
Issue date
Aug 15, 2023
Samsung Electronics Co., Ltd.
Woon-Ki Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and semiconductor device manufacturing method
Patent number
11,705,415
Issue date
Jul 18, 2023
Lapis Semiconductor Co., Ltd.
Taiichi Ogumi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing the same
Patent number
11,688,705
Issue date
Jun 27, 2023
Kioxia Corporation
Takashi Watanabe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Driving chip and display panel
Patent number
11,676,921
Issue date
Jun 13, 2023
Wuhan China Star Optoelectronics Technology Co., Ltd.
Yantao Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded structures
Patent number
11,670,615
Issue date
Jun 6, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Liang Wang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor package including stacked semiconductor chips
Patent number
11,664,343
Issue date
May 30, 2023
SK hynix Inc.
Jong Hyun Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and semiconductor module
Patent number
11,657,953
Issue date
May 23, 2023
Rohm Co., Ltd.
Kosei Osada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package for improving bonding reliability
Patent number
11,658,139
Issue date
May 23, 2023
Samsung Electronics Co., Ltd.
Jaehyung Park
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGES HAVING TEST PADS
Publication number
20240145317
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Joongwon Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20240136327
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
AENEE JANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240128218
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Hung-Pin Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...
Publication number
20240128254
Publication date
Apr 18, 2024
Micron Technology, Inc.
Hong Wan Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING STRUCTURE, DISPLAY PANEL, FLEXIBLE CIRCUIT BOARD AND DISPLA...
Publication number
20240128278
Publication date
Apr 18, 2024
HEFEI VISIONOX TECHNOLOGY CO., LTD.
Fengjie XIAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Techniques For Arranging Conductive Pads In Electronic Devices
Publication number
20240120302
Publication date
Apr 11, 2024
Intel Corporation
Krishna Bharath Kolluru
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT BOARD WITH EMBEDDED CHIP AND METHOD OF MANUFACTURING THE SAME
Publication number
20240105661
Publication date
Mar 28, 2024
Unimicron Technology Corp.
Yu-Shen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH BALANCED WIRES, AND ASSOCIATED...
Publication number
20240071979
Publication date
Feb 29, 2024
Micron Technology, Inc.
Chin Hui Chong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED FAN-OUT PLATFORM AND MANUFACTURING METHOD FOR SEMICONDUC...
Publication number
20240071998
Publication date
Feb 29, 2024
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
Li-Hsien Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
Publication number
20240071964
Publication date
Feb 29, 2024
WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
Shuya Dong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR FUSION BONDING SEMICONDUCTOR DEVICES TO TEMPORARY CARRI...
Publication number
20240063207
Publication date
Feb 22, 2024
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE
Publication number
20240047389
Publication date
Feb 8, 2024
Samsung Electronics Co., Ltd.
Hyeonmin Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DRIVE CHIP AND DISPLAY PANEL
Publication number
20240038700
Publication date
Feb 1, 2024
WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
Shuya Dong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL R...
Publication number
20240038753
Publication date
Feb 1, 2024
QUALCOMM Incorporated
Aniket PATIL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING MEMORY DIE STACK HAVING CLOCK SIGNA...
Publication number
20240038295
Publication date
Feb 1, 2024
Samsung Electronics Co., Ltd.
Youngdo Um
G11 - INFORMATION STORAGE
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240021541
Publication date
Jan 18, 2024
RENESAS ELECTRONICS CORPORATION
Kazuo Tomita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PREPARING DISPLAY SUBSTRATE AND DISPLAY SUBSTRATE
Publication number
20240006421
Publication date
Jan 4, 2024
HKC Corporation Limited
ZHONGXIE XU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH ELECTRONIC CIRCUIT UNITS
Publication number
20230413586
Publication date
Dec 21, 2023
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20230411354
Publication date
Dec 21, 2023
Samsung Electronics Co., Ltd.
Chihong SHIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20230402424
Publication date
Dec 14, 2023
Samsung Electronics Co., Ltd.
Yongjin Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION PLUGS
Publication number
20230395489
Publication date
Dec 7, 2023
NANYA TECHNOLOGY CORPORATION
Chun-Cheng LIAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME, SEMICONDUCTOR...
Publication number
20230395441
Publication date
Dec 7, 2023
CHANGXIN MEMORY TECHNOLOGIES, INC
Kai TIAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE
Publication number
20230384367
Publication date
Nov 30, 2023
QUALCOMM Incorporated
Yangyang SUN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
Publication number
20230378140
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Hao-Yi Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WINDOW BALL GRID ARRAY (WBGA) PACKAGE
Publication number
20230361012
Publication date
Nov 9, 2023
NANYA TECHNOLOGY CORPORATION
Wu-Der Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BASIN-SHAPED UNDERBUMP PLATES AND METHODS OF FORMING THE SAME
Publication number
20230352428
Publication date
Nov 2, 2023
Taiwan Semiconductor Manufacturing Company Limited
Yen-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INDUCTORS FOR HYBRID BONDING INTERCONNECT ARCHITECTURES
Publication number
20230299123
Publication date
Sep 21, 2023
Intel Corporation
Qiang Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Shifting Contact Pad for Reducing Stress
Publication number
20230275047
Publication date
Aug 31, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chun-Jen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
Publication number
20230268308
Publication date
Aug 24, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Gaius Gillman Fountain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20230253269
Publication date
Aug 10, 2023
Sony Semiconductor Solutions Corporation
YUTAKA OOTAKI
H01 - BASIC ELECTRIC ELEMENTS