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H01L25/0657
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L25/00
Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
Current Industry
H01L25/0657
Stacked arrangements of devices
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Patents Grants
last 30 patents
Information
Patent Grant
Integrated circuit chip and die test without cell array
Patent number
11,972,825
Issue date
Apr 30, 2024
SK hynix Inc.
Ji-Hwan Kim
G11 - INFORMATION STORAGE
Information
Patent Grant
Non-volatile memory with efficient signal routing
Patent number
11,973,044
Issue date
Apr 30, 2024
SANDISK TECHNOLOGIES LLC
Shiqian Shao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and manufacturing method thereof
Patent number
11,973,037
Issue date
Apr 30, 2024
Powertech Technology Inc.
Shang-Yu Chang Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer bonding method
Patent number
11,973,055
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Yung-Chi Lin
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Extended through wafer vias for power delivery in face-to-face dies
Patent number
11,973,060
Issue date
Apr 30, 2024
NVIDIA Corporation
Joseph Greco
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
On-the-fly compression scheme for soft bit data in non-volatile memory
Patent number
11,971,829
Issue date
Apr 30, 2024
SANDISK TECHNOLOGIES LLC
Hua-Ling Cynthia Hsu
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Chip package including stacked chips and chip couplers
Patent number
11,973,061
Issue date
Apr 30, 2024
Yibu Semiconductor Co., Ltd.
Weiping Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Charge pump current regulation during voltage ramp
Patent number
11,972,807
Issue date
Apr 30, 2024
SANDISK TECHNOLOGIES LLC
Hiroki Yabe
G11 - INFORMATION STORAGE
Information
Patent Grant
Semiconductor memory device and electronic system including the same
Patent number
11,973,035
Issue date
Apr 30, 2024
Samsung Electronics Co., Ltd.
Ha-Min Hwang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for low temperature bonding using nanoparticles
Patent number
11,973,056
Issue date
Apr 30, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density pillar interconnect conversion with stack to substrate...
Patent number
11,973,062
Issue date
Apr 30, 2024
Micron Technology, Inc.
Owen R. Fay
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System and method for sub-column parallel digitizers for hybrid sta...
Patent number
11,973,090
Issue date
Apr 30, 2024
DePuy Synthes Products, Inc.
Laurent Blanquart
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Unit with wiring board, module, and equipment
Patent number
11,972,990
Issue date
Apr 30, 2024
Canon Kabushiki Kaisha
Satoshi Nozu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method of the same
Patent number
11,967,553
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with metal layers
Patent number
11,967,583
Issue date
Apr 23, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices and electronic systems including the same
Patent number
11,967,623
Issue date
Apr 23, 2024
Samsung Electronics Co., Ltd.
Sunggil Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Assembly including plural through wafer vias, method of cooling the...
Patent number
11,967,548
Issue date
Apr 23, 2024
International Business Machines Corporation
Kerry Bernstein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Memory device and data storage system including the same
Patent number
11,967,574
Issue date
Apr 23, 2024
Samsung Electronics Co., Ltd.
Sungmin Hwang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit direct cooling systems having substrates in cont...
Patent number
11,967,540
Issue date
Apr 23, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Seungwon Im
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices and related methods
Patent number
11,961,775
Issue date
Apr 16, 2024
Amkor Technology Singapore Holding Pte Ltd.
Gyu Wan Han
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3DIC packaging with hot spot thermal management features
Patent number
11,961,779
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Balancing peak power with programming speed in non-volatile memory
Patent number
11,961,563
Issue date
Apr 16, 2024
SANDISK TECHNOLOGIES LLC
Towhidur Razzak
G11 - INFORMATION STORAGE
Information
Patent Grant
Nonvolatile memory device and method for fabricating the same
Patent number
11,963,357
Issue date
Apr 16, 2024
Samsung Electronics Co., Ltd.
Kohji Kanamori
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solderless interconnection structure and method of forming same
Patent number
11,961,810
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company
Yu-Wei Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Forming and/or configuring stacked dies
Patent number
11,961,823
Issue date
Apr 16, 2024
Xilinx, Inc.
Praful Jain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Centralized placement of command and address swapping in memory dev...
Patent number
11,961,585
Issue date
Apr 16, 2024
Kazuhiro Yoshida
G11 - INFORMATION STORAGE
Information
Patent Grant
3D memory semiconductor devices and structures with memory-line pil...
Patent number
11,963,373
Issue date
Apr 16, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic device assemblies and packages including multiple d...
Patent number
11,961,825
Issue date
Apr 16, 2024
Micron Technology, Inc.
Aparna U. Limaye
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded wafer device structure and methods for making the same
Patent number
11,961,826
Issue date
Apr 16, 2024
Harry-Hak-Lay Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional memory device with vertical field effect transist...
Patent number
11,963,352
Issue date
Apr 16, 2024
SanDisk Technologies LLC
Peter Rabkin
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING MULTI-DIMENSION THROUGH SILICON VIA...
Publication number
20240145435
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ke-Gang Wen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
Publication number
20240145445
Publication date
May 2, 2024
Sony Semiconductor Solutions Corporation
TAKUSHI SHIGETOSHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240147708
Publication date
May 2, 2024
SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Takanori MATSUZAKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH-MOLD VIA
Publication number
20240145346
Publication date
May 2, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Dong Joo PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NAND DIE WITH WIRE-BOND INDUCTIVE COMPENSATION FOR ALTERED BOND WIR...
Publication number
20240145424
Publication date
May 2, 2024
Western Digital Technologies, Inc.
John Contreras
G11 - INFORMATION STORAGE
Information
Patent Application
COMPOSITE DIELECTRIC STRUCTURES FOR SEMICONDUCTOR DIE ASSEMBLIES AN...
Publication number
20240145436
Publication date
May 2, 2024
Micron Technology, Inc.
Hung Cheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS FOR NON-VOLATILE RANDOM ACCESS MEMORY STACKS
Publication number
20240145438
Publication date
May 2, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Javier A. DeLaCruz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE DIMENSIONAL INTEGRATED CIRCUIT WITH INTERCONNECT NETWORK LAYER
Publication number
20240145459
Publication date
May 2, 2024
Silicon Genesis Corporation
Michael I. CURRENT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NON-VOLATILE MEMORY WITH DUMMY WORD LINE ASSISTED PRE-CHARGE
Publication number
20240145006
Publication date
May 2, 2024
SANDISK TECHNOLOGIES LLC
Peng Zhang
G11 - INFORMATION STORAGE
Information
Patent Application
SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK S...
Publication number
20240145305
Publication date
May 2, 2024
Micron Technology, Inc.
Jin Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20240145366
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Dongjoon Oh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIQUID-REPELLING COATING FOR UNDERFILL BLEED OUT CONTROL
Publication number
20240145422
Publication date
May 2, 2024
Micron Technology, Inc.
Jungbae Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MEMORY DEVICE, METHOD FOR MANUFACTURING THE SAME AND...
Publication number
20240147739
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Ji Hong KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D MEMORY SEMICONDUCTOR DEVICES AND STRUCTURES WITH MEMORY-LINE PIL...
Publication number
20240147740
Publication date
May 2, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED VIA STRUCTURES AND METHODS FOR FORMING THE SAME
Publication number
20240145379
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yen-Kun Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING A HIGH RELIABILITY
Publication number
20240145437
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
JI-HWAN HWANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VIA STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20240145344
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Chieh Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES
Publication number
20240145458
Publication date
May 2, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE, SEMICONDUCTOR DEVICE AND METHOD FOR FORMING SEMI...
Publication number
20240136284
Publication date
Apr 25, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC
Jiarui ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20240136327
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
AENEE JANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240136328
Publication date
Apr 25, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Joon Young Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20240136255
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
Bongwee YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL REDUNDANCY FOR BONDED STRUCTURES
Publication number
20240136333
Publication date
Apr 25, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NON-VOLATILE MEMORY WITH LOWER CURRENT PROGRAM-VERIFY
Publication number
20240136001
Publication date
Apr 25, 2024
SANDISK TECHNOLOGIES LLC
Abu Naser Zainuddin
G11 - INFORMATION STORAGE
Information
Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE ANDELECTRONIC SYSTEM...
Publication number
20240138157
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
Jiwon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL CONNECTION AND FORMING METHOD THEREOF
Publication number
20240136313
Publication date
Apr 25, 2024
National Yang Ming Chiao Tung University
Chih CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURF...
Publication number
20240136316
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chiang-Jui Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
InFO-POP Structures with TIVs Having Cavities
Publication number
20240136298
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Dp., Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240136331
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
Hyun Soo CHUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES
Publication number
20240136334
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
Jinnam KIM
H01 - BASIC ELECTRIC ELEMENTS