Stacked arrangements of devices

Industry

CPC
H01L25/0657

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/0657Stacked arrangements of devices

Industries

Patents Grantslast 30 patents

Information Patent Grant
Transistor configurations for multi-deck memory devices
- Patent number 12,310,116
- Issue date May 20, 2025
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked SRAM device
- Patent number 12,309,989
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Huai-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuitry for electrical redundancy in bonded structures
- Patent number 12,308,332
- Issue date May 20, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Javier A. DeLACruz
- G01 - MEASURING TESTING
Information Patent Grant
Electronic component module, sub-module, and method for manufacturi...
- Patent number 12,309,932
- Issue date May 20, 2025
- Murata Manufacturing Co., Ltd.
- Tsuyoshi Takakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, related electronic systems, and methods of...
- Patent number 12,308,333
- Issue date May 20, 2025
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnected stacked circuits
- Patent number 12,308,347
- Issue date May 20, 2025
- STMicroelectronics (Grenoble 2) SAS
- Didier Campos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die, manufacturing method thereof, and semiconductor...
- Patent number 12,308,298
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-height interconnect structures and associated systems and met...
- Patent number 12,308,348
- Issue date May 20, 2025
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compute in memory three-dimensional non-volatile nor memory for neu...
- Patent number 12,307,354
- Issue date May 20, 2025
- SanDisk Technologies, Inc.
- Yanli Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Seamless bonding layers in semiconductor packages and methods of fo...
- Patent number 12,300,639
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact for thermal displacement in a multi-wafer stacked...
- Patent number 12,300,669
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ping-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bond pad structure
- Patent number 12,300,670
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sin-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a heat dissipation structure connected...
- Patent number 12,300,618
- Issue date May 13, 2025
- Taiwna Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including conductive element on side surface of s...
- Patent number 12,300,641
- Issue date May 13, 2025
- INNOLUX CORPORATION
- Shuhei Hosaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector and method for forming the same
- Patent number 12,300,645
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,300,667
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- YeongBeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of manufacturing the semiconduct...
- Patent number 12,300,671
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Eunsuk Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device and methods for forming the same
- Patent number 12,300,317
- Issue date May 13, 2025
- Yangtze Memory Technologies Co., Ltd.
- Mingkang Zhang
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory devices and methods for forming the same
- Patent number 12,300,648
- Issue date May 13, 2025
- Yangtze Memory Technologies Co., Ltd.
- Yuancheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,300,650
- Issue date May 13, 2025
- Kioxia Corporation
- Keisuke Nakatsuka
- G11 - INFORMATION STORAGE
Information Patent Grant
Configurable random-access memory (RAM) array including through-sil...
- Patent number 12,300,688
- Issue date May 13, 2025
- Jianwen Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,300,560
- Issue date May 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Ming-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,300,668
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Raehyung Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 12,300,575
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid cooled interposer for integrated circuit stack
- Patent number 12,300,579
- Issue date May 13, 2025
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unified micro system with memory integrated circuit and logic integ...
- Patent number 12,302,554
- Issue date May 13, 2025
- Etron Technology, Inc.
- Chao-Chun Lu
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor integrated circuit comprising master chip with first...
- Patent number 12,293,990
- Issue date May 6, 2025
- SK hynix Inc.
- Yun Gi Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power module package structures
- Patent number 12,293,955
- Issue date May 6, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimization of the thermal performance of the 3D ICs utilizing the...
- Patent number 12,293,957
- Issue date May 6, 2025
- Kambix Innovations II, LLC
- Kambiz Vafai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including shielding cover that covers molded...
- Patent number 12,293,977
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Young-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Stacked Semiconductor Device Assembly in Computer System
- Publication number 20250165420
- Publication date May 22, 2025
- Rambus Inc.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PANEL LEVEL FABRICATION OF STACKED ELECTRONIC DEVICE PACKAGES WITH...
- Publication number 20250167083
- Publication date May 22, 2025
- NXP USA, Inc.
- Sharan Kishore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167084
- Publication date May 22, 2025
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20250167115
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jimo GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER
- Publication number 20250167123
- Publication date May 22, 2025
- SK HYNIX INC.
- Jae Jun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge structure of semiconductor wafer and manufacturing method thereof
- Publication number 20250166997
- Publication date May 22, 2025
- UNITED MICROELECTRONICS CORP.
- Yu-Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR CHIP INCLUDING SEMICONDUCTOR...
- Publication number 20250167144
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Junho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167179
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Sangcheon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING WORD LINE SIGNAL PATH
- Publication number 20250169066
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Daesun Kim
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING CRACK-RESISTANT BACKSIDE...
- Publication number 20250169070
- Publication date May 22, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Kota FUNAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING FUSE STRUCTURE AND METHODS FOR FORMING...
- Publication number 20250167078
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250167134
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Huishu MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BUMP INTERFACE COMPATIBLE WITH DIFFERENT ORIENTATIONS AND TYPE...
- Publication number 20250167152
- Publication date May 22, 2025
- Xilinx, Inc.
- Ygal ARBEL
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167178
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Youngkun JEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UTILIZING MEMORY CHIP THROUGH-SILICON VIAS FOR CONNECTING LOGIC CHI...
- Publication number 20250167191
- Publication date May 22, 2025
- International Business Machines Corporation
- Robert K. Montoye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250169053
- Publication date May 22, 2025
- SK HYNIX INC.
- Nam Jae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
- Publication number 20250167180
- Publication date May 22, 2025
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCT...
- Publication number 20250167156
- Publication date May 22, 2025
- SAMSUNG ELECTRONICS CO., LTD.
- Aenee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250168984
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jin Duck PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL MEMORY DEVICE
- Publication number 20250169080
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Bonjae KOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION MEMBER, AND METHOD...
- Publication number 20250167065
- Publication date May 22, 2025
- SK HYNIX INC.
- Jun Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH THROUGH VIA
- Publication number 20250167077
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ke-Gang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167175
- Publication date May 22, 2025
- Minkyeong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250169071
- Publication date May 22, 2025
- SK HYNIX INC.
- Do Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250169083
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- IN JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF IMPLEMENTING REDISTRIBUTION LAY...
- Publication number 20250167174
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Yunseok YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Integration of Passive Devices
- Publication number 20250167176
- Publication date May 22, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING POWER MANAGEMENT DIE IN A STACK AND...
- Publication number 20250167177
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250167089
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Sungmin MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH UNDERFILL SQUEEZE-UP, AND METHODS FOR...
- Publication number 20250157828
- Publication date May 15, 2025
- Micron Technology, Inc.
- Youngrae Kim
- H01 - BASIC ELECTRIC ELEMENTS

Stacked arrangements of devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Transistor configurations for multi-deck memory devices

Stacked SRAM device

Circuitry for electrical redundancy in bonded structures

Electronic component module, sub-module, and method for manufacturi...

Microelectronic devices, related electronic systems, and methods of...

Interconnected stacked circuits

Semiconductor die, manufacturing method thereof, and semiconductor...

Multi-height interconnect structures and associated systems and met...

Compute in memory three-dimensional non-volatile nor memory for neu...

Seamless bonding layers in semiconductor packages and methods of fo...

Backside contact for thermal displacement in a multi-wafer stacked...

Hybrid bond pad structure

Semiconductor device having a heat dissipation structure connected...

Electronic device including conductive element on side surface of s...

Connector and method for forming the same

Semiconductor package and method of fabricating the same

Semiconductor packages and methods of manufacturing the semiconduct...

Three-dimensional memory device and methods for forming the same

Three-dimensional memory devices and methods for forming the same

Semiconductor memory device

Configurable random-access memory (RAM) array including through-sil...

Semiconductor device package and method of manufacturing the same

Semiconductor package

Semiconductor package and method

Liquid cooled interposer for integrated circuit stack

Unified micro system with memory integrated circuit and logic integ...

Semiconductor integrated circuit comprising master chip with first...

High power module package structures

Optimization of the thermal performance of the 3D ICs utilizing the...

Semiconductor package including shielding cover that covers molded...

Patents Applicationslast 30 patents

Stacked Semiconductor Device Assembly in Computer System

PANEL LEVEL FABRICATION OF STACKED ELECTRONIC DEVICE PACKAGES WITH...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER

Edge structure of semiconductor wafer and manufacturing method thereof

SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR CHIP INCLUDING SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE INCLUDING WORD LINE SIGNAL PATH

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING CRACK-RESISTANT BACKSIDE...

SEMICONDUCTOR DIE INCLUDING FUSE STRUCTURE AND METHODS FOR FORMING...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

CHIP BUMP INTERFACE COMPATIBLE WITH DIFFERENT ORIENTATIONS AND TYPE...

SEMICONDUCTOR PACKAGE

UTILIZING MEMORY CHIP THROUGH-SILICON VIAS FOR CONNECTING LOGIC CHI...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCT...

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

VERTICAL MEMORY DEVICE

SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION MEMBER, AND METHOD...

SEMICONDUCTOR STRUCTURES WITH THROUGH VIA

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF IMPLEMENTING REDISTRIBUTION LAY...

Wafer Level Integration of Passive Devices

SEMICONDUCTOR DEVICE INCLUDING POWER MANAGEMENT DIE IN A STACK AND...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR ASSEMBLIES WITH UNDERFILL SQUEEZE-UP, AND METHODS FOR...