Stacked arrangements of devices

Industry

CPC
H01L2225/06503

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06503Stacked arrangements of devices

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multi-chip package
- Patent number 12,136,608
- Issue date Nov 5, 2024
- STMicroelectronics Pte Ltd
- Yong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete three-dimensional processor
- Patent number 11,960,987
- Issue date Apr 16, 2024
- HangZhou HaiCun Information Technology Co., Ltd.
- Guobiao Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 11,817,422
- Issue date Nov 14, 2023
- Shinko Electric Industries Co., Ltd.
- Yohei Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional circuit implementing machine trained network
- Patent number 11,790,219
- Issue date Oct 17, 2023
- Adeia Semiconductor Inc.
- Steven L. Teig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Discrete three-dimensional processor
- Patent number 11,734,550
- Issue date Aug 22, 2023
- HangZhou HaiCun Information Technology Co., Ltd.
- Guobiao Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power module
- Patent number 11,721,670
- Issue date Aug 8, 2023
- Mitsubishi Electric Corporation
- Takashi Tsubakidani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device assembly in computer system
- Patent number 11,693,801
- Issue date Jul 4, 2023
- RAMBUS INC.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power on die discovery in 3D stacked die architectures with varying...
- Patent number 11,610,879
- Issue date Mar 21, 2023
- Advanced Micro Devices, Inc.
- Russell J. Schreiber
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-chip package
- Patent number 11,581,289
- Issue date Feb 14, 2023
- STMicroelectronics Pte Ltd
- Yong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,495,574
- Issue date Nov 8, 2022
- Samsung Electronics Co., Ltd.
- Yun Seok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having stacked die structure
- Patent number 11,476,200
- Issue date Oct 18, 2022
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device assembly in computer system
- Patent number 11,301,405
- Issue date Apr 12, 2022
- Rambus Inc.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three dimensional circuit implementing machine trained network
- Patent number 11,176,450
- Issue date Nov 16, 2021
- Xcelsis Corporation
- Steven L. Teig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3D processor having stacked integrated circuit die
- Patent number 11,152,336
- Issue date Oct 19, 2021
- Xcelsis Corporation
- Steven L. Teig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Time borrowing between layers of a three dimensional chip stack
- Patent number 10,970,627
- Issue date Apr 6, 2021
- Xcelsis Corporation
- Steven L. Teig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Maintaining alignment between a LED device and a backplane during b...
- Patent number 10,811,401
- Issue date Oct 20, 2020
- Facebook Technologies, LLC
- William Padraic Henry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device assembly in computer system
- Patent number 10,719,465
- Issue date Jul 21, 2020
- RAMBUS INC.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked semiconductor device assembly in computer system
- Patent number 10,445,269
- Issue date Oct 15, 2019
- Rambus Inc.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of integrating power module with in...
- Patent number 10,438,932
- Issue date Oct 8, 2019
- Semiconductor Components Industries, LLC
- Jinchang Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image capturing apparatus and mobile telephone
- Patent number 10,218,928
- Issue date Feb 26, 2019
- Canon Kabushiki Kaisha
- Mineo Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 10,211,114
- Issue date Feb 19, 2019
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device assembly in computer system
- Patent number 10,114,775
- Issue date Oct 30, 2018
- Rambus Inc.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of integrating power module with in...
- Patent number 9,972,607
- Issue date May 15, 2018
- Semiconductor Components Industries, LLC
- Jinchang Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device assembly
- Patent number 9,880,959
- Issue date Jan 30, 2018
- Rambus Inc.
- Scott C. Best
- G11 - INFORMATION STORAGE
Information Patent Grant
Bumpless build-up layer package with pre-stacked microelectronic de...
- Patent number 9,831,213
- Issue date Nov 28, 2017
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 9,768,121
- Issue date Sep 19, 2017
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image capturing apparatus and mobile telephone
- Patent number 9,635,291
- Issue date Apr 25, 2017
- Canon Kabushiki Kaisha
- Mineo Uchida
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Apparatus and methods for stackable packaging
- Patent number 9,508,632
- Issue date Nov 29, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Navas Khan Oratti Kalandar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumpless build-up layer package with pre-stacked microelectronic de...
- Patent number 9,362,253
- Issue date Jun 7, 2016
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 9,362,141
- Issue date Jun 7, 2016
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
- Publication number 20240304603
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jinchang ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING HEAT EMITTING POST BONDED THERETO AND...
- Publication number 20240297096
- Publication date Sep 5, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BONDING PADS AND METHOD FOR FABRICAT...
- Publication number 20240243081
- Publication date Jul 18, 2024
- SK HYNIX INC.
- Byung Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20240215242
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Gil Sung LEE
- G11 - INFORMATION STORAGE
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240172368
- Publication date May 23, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Yun Je JI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacked Semiconductor Device Assembly in Computer System
- Publication number 20240104037
- Publication date Mar 28, 2024
- Rambus Inc.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240096824
- Publication date Mar 21, 2024
- Murata Manufacturing Co., Ltd.
- Masao KONDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MEMORY ARCHITECTURE FOR ADVANCED 3D SYSTEMS
- Publication number 20240088098
- Publication date Mar 14, 2024
- ADVANCED MICRO DEVICES, INC.
- Divya Madapusi Srinivas PRASAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
- Publication number 20240072008
- Publication date Feb 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jinchang ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...
- Publication number 20230282613
- Publication date Sep 7, 2023
- SHINKAWA LTD.
- Toshihiko Toyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-CHIP PACKAGE
- Publication number 20230197688
- Publication date Jun 22, 2023
- STMicroelectronics Pte Ltd
- Yong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Device Assembly in Computer System
- Publication number 20220318172
- Publication date Oct 6, 2022
- Rambus Inc.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Three Dimensional Circuit Implementing Machine Trained Network
- Publication number 20220108161
- Publication date Apr 7, 2022
- Xcelsis Corporation
- Steven L. Teig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER MODULE
- Publication number 20210384163
- Publication date Dec 9, 2021
- Mitsubishi Electric Corporation
- Takashi TSUBAKIDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210050326
- Publication date Feb 18, 2021
- Samsung Electronics Co., Ltd.
- Yun Seok CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE
- Publication number 20210035952
- Publication date Feb 4, 2021
- STMicroelectronics Pte Ltd
- Yong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Device Assembly in Computer System
- Publication number 20210004340
- Publication date Jan 7, 2021
- Rambus Inc.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER ON DIE DISCOVERY IN 3D STACKED DIE ARCHITECTURES WITH VARYING...
- Publication number 20200203332
- Publication date Jun 25, 2020
- ADVANCED MICRO DEVICES, INC.
- Russell J. Schreiber
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Stacked Semiconductor Device Assembly in Computer System
- Publication number 20200117627
- Publication date Apr 16, 2020
- RAMBUS INC.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Stacked Semiconductor Device Assembly in Computer System
- Publication number 20190073328
- Publication date Mar 7, 2019
- RAMBUS INC.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
- Publication number 20180240786
- Publication date Aug 23, 2018
- Semiconductor Components Industries, LLC
- Jinchang ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
- Publication number 20180233491
- Publication date Aug 16, 2018
- Semiconductor Components Industries, LLC
- Jinchang ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPLESS BUILD-UP LAYER PACKAGE WITH A PRE-STACKED MICROELECTRONIC...
- Publication number 20180047702
- Publication date Feb 15, 2018
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...
- Publication number 20180005909
- Publication date Jan 4, 2018
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES HAVING FASTENING ELEMENT AND HALOGEN-FREE INTER-PACK...
- Publication number 20140335657
- Publication date Nov 13, 2014
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPLESS BUILD-UP LAYER PACKAGE WITH PRE-STACKED MICROELECTRONIC DE...
- Publication number 20140239510
- Publication date Aug 28, 2014
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...
- Publication number 20130252354
- Publication date Sep 26, 2013
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES HAVING FASTENING ELEMENT AND HALOGEN-FREE INTER-PACK...
- Publication number 20120280404
- Publication date Nov 8, 2012
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Device Assembly
- Publication number 20120068360
- Publication date Mar 22, 2012
- Scott C. Best
- G11 - INFORMATION STORAGE
Information Patent Application
BUMPLESS BUILD-UP LAYER PACKAGE WITH PRE-STACKED MICROELECTRONIC DE...
- Publication number 20120049382
- Publication date Mar 1, 2012
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS

Stacked arrangements of devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-chip package

Discrete three-dimensional processor

Semiconductor device

Three dimensional circuit implementing machine trained network

Discrete three-dimensional processor

Power module

Stacked semiconductor device assembly in computer system

Power on die discovery in 3D stacked die architectures with varying...

Multi-chip package

Semiconductor package

Semiconductor package structure having stacked die structure

Stacked semiconductor device assembly in computer system

Three dimensional circuit implementing machine trained network

3D processor having stacked integrated circuit die

Time borrowing between layers of a three dimensional chip stack

Maintaining alignment between a LED device and a backplane during b...

Stacked semiconductor device assembly in computer system

Stacked semiconductor device assembly in computer system

Semiconductor device and method of integrating power module with in...

Image capturing apparatus and mobile telephone

Microelectronic devices, stacked microelectronic devices, and metho...

Stacked semiconductor device assembly in computer system

Semiconductor device and method of integrating power module with in...

Stacked semiconductor device assembly

Bumpless build-up layer package with pre-stacked microelectronic de...

Microelectronic devices, stacked microelectronic devices, and metho...

Image capturing apparatus and mobile telephone

Apparatus and methods for stackable packaging

Bumpless build-up layer package with pre-stacked microelectronic de...

Microelectronic devices, stacked microelectronic devices, and metho...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...

SEMICONDUCTOR PACKAGE HAVING HEAT EMITTING POST BONDED THERETO AND...

SEMICONDUCTOR DEVICE INCLUDING BONDING PADS AND METHOD FOR FABRICAT...

SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

PRINTED CIRCUIT BOARD

Stacked Semiconductor Device Assembly in Computer System

SEMICONDUCTOR DEVICE

HYBRID MEMORY ARCHITECTURE FOR ADVANCED 3D SYSTEMS

SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...

MULTI-CHIP PACKAGE

Stacked Semiconductor Device Assembly in Computer System

Three Dimensional Circuit Implementing Machine Trained Network

POWER MODULE

SEMICONDUCTOR PACKAGE

MULTI-CHIP PACKAGE

Stacked Semiconductor Device Assembly in Computer System

POWER ON DIE DISCOVERY IN 3D STACKED DIE ARCHITECTURES WITH VARYING...

Stacked Semiconductor Device Assembly in Computer System

Stacked Semiconductor Device Assembly in Computer System

SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...

SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...

BUMPLESS BUILD-UP LAYER PACKAGE WITH A PRE-STACKED MICROELECTRONIC...

MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...

STACK PACKAGES HAVING FASTENING ELEMENT AND HALOGEN-FREE INTER-PACK...

BUMPLESS BUILD-UP LAYER PACKAGE WITH PRE-STACKED MICROELECTRONIC DE...

MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...

STACK PACKAGES HAVING FASTENING ELEMENT AND HALOGEN-FREE INTER-PACK...

Stacked Semiconductor Device Assembly

BUMPLESS BUILD-UP LAYER PACKAGE WITH PRE-STACKED MICROELECTRONIC DE...