stacked type assemblies

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CPC
H01L2924/1627

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/1627stacked type assemblies

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 10,211,114
- Issue date Feb 19, 2019
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 9,768,121
- Issue date Sep 19, 2017
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency module
- Patent number 9,532,475
- Issue date Dec 27, 2016
- Fujitsu Limited
- Satoshi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 9,391,029
- Issue date Jul 12, 2016
- Kabushiki Kaisha Toshiba
- Shinya Hayashiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe structure having a plurality of discrete insulated probe tips...
- Patent number 8,754,666
- Issue date Jun 17, 2014
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
Package structure
- Patent number 8,552,544
- Issue date Oct 8, 2013
- Advanced Semiconductor Engineering, Inc.
- Ching-Hong Chuang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 8,450,839
- Issue date May 28, 2013
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded stacked integrated circuit packaging system and method of...
- Patent number 8,368,200
- Issue date Feb 5, 2013
- Stats Chippac Ltd.
- Ki Youn Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package including a thermally and electrically c...
- Patent number 8,362,607
- Issue date Jan 29, 2013
- Honeywell International Inc.
- David Scheid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for packaging semiconductor devices, packaged semiconduct...
- Patent number 8,138,021
- Issue date Mar 20, 2012
- Micron Technology, Inc.
- David J. Corisis
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Multiple chip module and package stacking method for storage devices
- Patent number 8,093,103
- Issue date Jan 10, 2012
- BiTMICRO NETWORKS, Inc.
- Rey H. Bruce
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabrication thereof
- Patent number 8,049,342
- Issue date Nov 1, 2011
- Round Rock Research, LLC
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded stacked integrated circuit packaging system and method of...
- Patent number 8,018,040
- Issue date Sep 13, 2011
- Stats Chippac Ltd.
- Ki Youn Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for shielding integrated circuit devices
- Patent number 8,018,739
- Issue date Sep 13, 2011
- Maxwell Technologies, LLC
- Janet Patterson
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
System and method for stacked die embedded chip build-up
- Patent number 8,008,125
- Issue date Aug 30, 2011
- General Electric Company
- Paul Alan McConnelee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices including semiconductor dice in laterally off...
- Patent number 7,999,378
- Issue date Aug 16, 2011
- Round Rock Research, LLC
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies, electronic devices including the s...
- Patent number 7,998,792
- Issue date Aug 16, 2011
- Round Rock Research, LLC
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Affordable high performance high frequency multichip module fabrica...
- Patent number 7,952,196
- Issue date May 31, 2011
- Lockheed Martin Corporation
- Joseph Alfred Iannotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical module
- Patent number 7,940,526
- Issue date May 10, 2011
- Curamik Electronics GmbH
- Jurgen Schulz-Harder
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Multilayer substrate manufacturing method
- Patent number 7,937,827
- Issue date May 10, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Don C. Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing process for embedded semiconductor device
- Patent number 7,923,299
- Issue date Apr 12, 2011
- Advanced Semiconductor Engineering, Inc.
- Chien-Hao Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tier structure with tier frame having a feedthrough structure
- Patent number 7,919,844
- Issue date Apr 5, 2011
- Aprolase Development Co., LLC
- Volkan Ozguz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Infinitely stackable interconnect device and method
- Patent number 7,897,503
- Issue date Mar 1, 2011
- The Board of Trustees of the University of Arkansas
- Ron B. Foster
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for producing multilayer printed wiring board
- Patent number 7,886,438
- Issue date Feb 15, 2011
- Fujikura Ltd.
- Shoji Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnecting board and three-dimensional wiring structure using it
- Patent number 7,845,954
- Issue date Dec 7, 2010
- Panasonic Corporation
- Yoshihiro Tomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical device and method
- Patent number 7,847,387
- Issue date Dec 7, 2010
- Infineon Technologies AG
- Thomas Kilger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stackable ceramic FBGA for high thermal applications
- Patent number 7,829,991
- Issue date Nov 9, 2010
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip module and package stacking for storage devices
- Patent number 7,826,243
- Issue date Nov 2, 2010
- BiTMICRO NETWORKS, Inc.
- Rey Bruce
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing process and structure for embedded semiconductor device
- Patent number 7,825,500
- Issue date Nov 2, 2010
- Advanced Semiconductor Engineering, Inc.
- Chien-Hao Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked module and manufacturing method thereof
- Patent number 7,807,499
- Issue date Oct 5, 2010
- Murata Manufacturing Co., Ltd.
- Yoshihiko Nishizawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240047301
- Publication date Feb 8, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Hyoun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230402398
- Publication date Dec 14, 2023
- Siliconware Precision Industries Co., Ltd.
- Che-Chi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...
- Publication number 20180005909
- Publication date Jan 4, 2018
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE
- Publication number 20140367156
- Publication date Dec 18, 2014
- OLYMPUS CORPORATION
- Takanori Sekido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE ALLOWING FINE TUNING AFTER ASSEMBLY
- Publication number 20140334120
- Publication date Nov 13, 2014
- Michael Dakhiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY MODULE
- Publication number 20140264788
- Publication date Sep 18, 2014
- Fujitsu Limited
- Satoshi MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE ALLOWING FINE TUNING AFTER ASSEMBLY
- Publication number 20140218883
- Publication date Aug 7, 2014
- Eagantu Ltd.
- Michael Dakhiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDOX METHOD OF FORMING A COAXIAL PROBE STRUCTURE OF ELONGATED ELEC...
- Publication number 20140191775
- Publication date Jul 10, 2014
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...
- Publication number 20130252354
- Publication date Sep 26, 2013
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20120025363
- Publication date Feb 2, 2012
- Advanced Semiconductor Engineering, Inc.
- Ching-Hong Chuang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SHIELDED STACKED INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF...
- Publication number 20110298107
- Publication date Dec 8, 2011
- Ki Youn Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE CHIP MODULE AND PACKAGE STACKING METHOD FOR STORAGE DEVICES
- Publication number 20110038127
- Publication date Feb 17, 2011
- BiTMICRO Networks, Inc.
- Rey BRUCE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING PROCESS FOR EMBEDDED SEMICONDUCTOR DEVICE
- Publication number 20110014751
- Publication date Jan 20, 2011
- Advanced Semiconductor Engineering, Inc.
- CHIEN-HAO WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated circuit package including a thermally and electrically c...
- Publication number 20100308453
- Publication date Dec 9, 2010
- Honeywell International Inc.
- David Scheid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PACKAGING SEMICONDUCTOR DEVICES, PACKAGED SEMICONDUCT...
- Publication number 20100279466
- Publication date Nov 4, 2010
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR STACKED DIE EMBEDDED CHIP BUILD-UP
- Publication number 20100224992
- Publication date Sep 9, 2010
- Paul Alan McConnelee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF ASSEMBLING THE SAME
- Publication number 20100187682
- Publication date Jul 29, 2010
- Damaruganath Pinjala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR SHIELDING INTEGRATED CIRCUIT DEVICES
- Publication number 20100155912
- Publication date Jun 24, 2010
- Maxwell Technologies, Inc.
- Janet Patterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING SEMICONDUCTOR DICE IN LATERALLY OFF...
- Publication number 20100148331
- Publication date Jun 17, 2010
- ROUND ROCK RESEARCH, LLC
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...
- Publication number 20100117212
- Publication date May 13, 2010
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES, ELECTRONIC DEVICES INCLUDING THE S...
- Publication number 20100078793
- Publication date Apr 1, 2010
- Micron Technology, Inc.
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STEREOSCOPIC ELECTRONIC CIRCUIT DEVICE, AND RELAY BOARD AND RELAY F...
- Publication number 20100008056
- Publication date Jan 14, 2010
- PANASONIC CORPORATION
- Masahiro ONO
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
HERMETIC SEALING CAP, ELECTRONIC COMPONENT ACCOMMODATION PACKAGE, A...
- Publication number 20090301749
- Publication date Dec 10, 2009
- Neomax Materials Co., Ltd.
- Tsuyoshi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MASS STORAGE FLASH MEMORY PACKAGE
- Publication number 20090286356
- Publication date Nov 19, 2009
- Micron Technology, Inc.
- Leonard E. Mess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module
- Publication number 20090279268
- Publication date Nov 12, 2009
- Kyung Joo Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD
- Publication number 20090217522
- Publication date Sep 3, 2009
- FUJIKURA LTD.
- Shoji ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical Module
- Publication number 20090213547
- Publication date Aug 27, 2009
- Jurgen Schulz-Harder
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Infinitely Stackable Interconnect Device and Method
- Publication number 20090212407
- Publication date Aug 27, 2009
- Ron B. Foster
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SHIELDED STACKED INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF...
- Publication number 20090194853
- Publication date Aug 6, 2009
- Ki Youn Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALABLE SUBSYSTEM ARCHITECTURE HAVING INTEGRATED COOLING CHANNELS
- Publication number 20090193652
- Publication date Aug 6, 2009
- Peter C. Salmon
- G02 - OPTICS

stacked type assemblies

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Microelectronic devices, stacked microelectronic devices, and metho...

Microelectronic devices, stacked microelectronic devices, and metho...

High-frequency module

Electronic device

Probe structure having a plurality of discrete insulated probe tips...

Package structure

Microelectronic devices, stacked microelectronic devices, and metho...

Shielded stacked integrated circuit packaging system and method of...

Integrated circuit package including a thermally and electrically c...

Apparatus for packaging semiconductor devices, packaged semiconduct...

Multiple chip module and package stacking method for storage devices

Semiconductor device and method of fabrication thereof

Shielded stacked integrated circuit packaging system and method of...

Apparatus for shielding integrated circuit devices

System and method for stacked die embedded chip build-up

Semiconductor devices including semiconductor dice in laterally off...

Semiconductor device assemblies, electronic devices including the s...

Affordable high performance high frequency multichip module fabrica...

Electrical module

Multilayer substrate manufacturing method

Manufacturing process for embedded semiconductor device

Tier structure with tier frame having a feedthrough structure

Infinitely stackable interconnect device and method

Process for producing multilayer printed wiring board

Interconnecting board and three-dimensional wiring structure using it

Electrical device and method

Stackable ceramic FBGA for high thermal applications

Multiple chip module and package stacking for storage devices

Manufacturing process and structure for embedded semiconductor device

Stacked module and manufacturing method thereof

Patents Applicationslast 30 patents

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...

ELECTRONIC COMPONENT MOUNTING STRUCTURE

ELECTRONIC MODULE ALLOWING FINE TUNING AFTER ASSEMBLY

HIGH-FREQUENCY MODULE

ELECTRONIC MODULE ALLOWING FINE TUNING AFTER ASSEMBLY

REDOX METHOD OF FORMING A COAXIAL PROBE STRUCTURE OF ELONGATED ELEC...

MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SHIELDED STACKED INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF...

MULTIPLE CHIP MODULE AND PACKAGE STACKING METHOD FOR STORAGE DEVICES

MANUFACTURING PROCESS FOR EMBEDDED SEMICONDUCTOR DEVICE

Integrated circuit package including a thermally and electrically c...

APPARATUS FOR PACKAGING SEMICONDUCTOR DEVICES, PACKAGED SEMICONDUCT...

SYSTEM AND METHOD FOR STACKED DIE EMBEDDED CHIP BUILD-UP

ELECTRONIC PACKAGE AND METHOD OF ASSEMBLING THE SAME

APPARATUS FOR SHIELDING INTEGRATED CIRCUIT DEVICES

SEMICONDUCTOR DEVICES INCLUDING SEMICONDUCTOR DICE IN LATERALLY OFF...

MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...

SEMICONDUCTOR DEVICE ASSEMBLIES, ELECTRONIC DEVICES INCLUDING THE S...

STEREOSCOPIC ELECTRONIC CIRCUIT DEVICE, AND RELAY BOARD AND RELAY F...

HERMETIC SEALING CAP, ELECTRONIC COMPONENT ACCOMMODATION PACKAGE, A...

STACKED MASS STORAGE FLASH MEMORY PACKAGE

Module

PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD

Electrical Module

Infinitely Stackable Interconnect Device and Method

SHIELDED STACKED INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF...

SCALABLE SUBSYSTEM ARCHITECTURE HAVING INTEGRATED COOLING CHANNELS