Strap and wire connectors

Industry

CPC
H01L2224/73271

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/73271Strap and wire connectors

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with integrated shunt resistor
- Patent number 10,950,509
- Issue date Mar 16, 2021
- Infineon Technologies AG
- Rainald Sander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating stack die package
- Patent number 10,546,840
- Issue date Jan 28, 2020
- Vishay SIliconix, LLC
- Kyle Terrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,403,616
- Issue date Sep 3, 2019
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing a semiconductor devic...
- Patent number 9,991,242
- Issue date Jun 5, 2018
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die power converter
- Patent number 9,842,797
- Issue date Dec 12, 2017
- Texas Instruments Incorporated
- Brian A. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating stack die package
- Patent number 9,589,929
- Issue date Mar 7, 2017
- Vishay Siliconix
- Kyle Terrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Segmented bond pads and methods of fabrication thereof
- Patent number 9,543,260
- Issue date Jan 10, 2017
- Infineon Technologies AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module package and method of manufacturing the same
- Patent number 9,524,929
- Issue date Dec 20, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked synchronous buck converter having chip embedded in outside...
- Patent number 9,425,132
- Issue date Aug 23, 2016
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure, method of mounting semiconductor chip, and sol...
- Patent number 9,245,829
- Issue date Jan 26, 2016
- Omron Corporation
- Shintaro Hara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip semiconductor device
- Patent number 8,669,650
- Issue date Mar 11, 2014
- Alpha & Omega Semiconductor, Inc.
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282678
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Ryotaro KAKIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282677
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Masaaki MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A SOLDER WETTING STRUCTURE
- Publication number 20240250056
- Publication date Jul 25, 2024
- Mohd Afiz Hashim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALF-BRIDGE POWER DEVICE AND HALF-BRIDGE POWER MODULE
- Publication number 20240106342
- Publication date Mar 28, 2024
- ZF Friedrichshafen AG
- Zhiwu Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20180254267
- Publication date Sep 6, 2018
- Fuji Electric Co., Ltd.
- Kenichiro SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170047265
- Publication date Feb 16, 2017
- Mitsubishi Electric Corporation
- Yuki HATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING STACK DIE PACKAGE
- Publication number 20140273344
- Publication date Sep 18, 2014
- VISHAY-SILICONIX
- Kyle TERRILL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE, METHOD OF MOUNTING SEMICONDUCTOR CHIP, AND SOL...
- Publication number 20140077375
- Publication date Mar 20, 2014
- Omron Corporation
- Shintaro Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE POWER CONVERTER
- Publication number 20140061884
- Publication date Mar 6, 2014
- Brian A. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP SEMICONDUCTOR DEVICE
- Publication number 20120248539
- Publication date Oct 4, 2012
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE POWER CONVERTER
- Publication number 20120228696
- Publication date Sep 13, 2012
- TEXAS INSTRUMENTS INCORPORATED
- BRIAN ASHLEY CARPENTER
- H01 - BASIC ELECTRIC ELEMENTS

Strap and wire connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with integrated shunt resistor

Method for fabricating stack die package

Method of manufacturing a semiconductor device

Semiconductor device, method of manufacturing a semiconductor devic...

Stacked die power converter

Method for fabricating stack die package

Segmented bond pads and methods of fabrication thereof

Semiconductor module package and method of manufacturing the same

Stacked synchronous buck converter having chip embedded in outside...

Substrate structure, method of mounting semiconductor chip, and sol...

Flip chip semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE HAVING A SOLDER WETTING STRUCTURE

HALF-BRIDGE POWER DEVICE AND HALF-BRIDGE POWER MODULE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHOD FOR FABRICATING STACK DIE PACKAGE

SUBSTRATE STRUCTURE, METHOD OF MOUNTING SEMICONDUCTOR CHIP, AND SOL...

STACKED DIE POWER CONVERTER

FLIP CHIP SEMICONDUCTOR DEVICE

STACKED DIE POWER CONVERTER