Stripping a part of an upper metal layer to expose a lower metal layer

Industry

CPC
H05K2203/0361

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0361Stripping a part of an upper metal layer to expose a lower metal layer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods for manufacturing ultrasound transducers and other components
- Patent number 11,845,108
- Issue date Dec 19, 2023
- FUJIFILM SonoSite, Inc.
- N. Christopher Chaggares
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Method of manufacturing circuit board
- Patent number 11,419,222
- Issue date Aug 16, 2022
- Unimicron Technology Corp.
- Hsin-Chi Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for printed circuit board
- Patent number 10,893,613
- Issue date Jan 12, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jong-Guk Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro-fabricated group electroplating technique
- Patent number 10,617,011
- Issue date Apr 7, 2020
- California Institute of Technology
- Yu-Chong Tai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing circuit board
- Patent number 10,602,621
- Issue date Mar 24, 2020
- Unimicron Technology Corp.
- Hsin-Chi Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for manufacturing ultrasound transducers and other components
- Patent number 10,596,597
- Issue date Mar 24, 2020
- FUJIFILM SonoSite, Inc.
- N. Christopher Chaggares
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Carrier plate, device having the carrier plate and method for produ...
- Patent number 10,117,329
- Issue date Oct 30, 2018
- QUALCOMM Incorporated
- Sebastian Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board with embedded electro...
- Patent number 9,974,186
- Issue date May 15, 2018
- Unitech Printed Circuit Board Corp.
- Ming Yi Yeh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating touch screen panel
- Patent number 9,904,385
- Issue date Feb 27, 2018
- Samsung Display Co., Ltd.
- Akira Hirai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Touch screen, method for producing touch screen, touch display device
- Patent number 9,886,148
- Issue date Feb 6, 2018
- BOE Technology Group Co., Ltd.
- Guodong Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method for component incorporated substrate and compo...
- Patent number 9,596,765
- Issue date Mar 14, 2017
- MEIKO ELECTRONICS CO., LTD.
- Akira Yamaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed wiring board, method for manufacturing printed wiring board...
- Patent number 9,572,256
- Issue date Feb 14, 2017
- Ibiden Co., Ltd.
- Kazuhiro Yoshikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing ultrasound transducers and other components
- Patent number 9,555,443
- Issue date Jan 31, 2017
- FUJIFILM SonoSite, Inc.
- N. Christopher Chaggares
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Flip chip pad geometry for an IC package substrate
- Patent number 9,373,576
- Issue date Jun 21, 2016
- Broadcom Corporation
- Kwok Cheung Tsang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 9,363,891
- Issue date Jun 7, 2016
- Ibiden Co., Ltd.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a wiring board
- Patent number 9,345,143
- Issue date May 17, 2016
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for connecting a precious metal surface to a polymer
- Patent number 9,254,993
- Issue date Feb 9, 2016
- Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Hermann Oppermann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wiring board and semiconductor device
- Patent number 9,155,195
- Issue date Oct 6, 2015
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a wiring board
- Patent number 9,089,041
- Issue date Jul 21, 2015
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and method for manufacturing multil...
- Patent number 9,038,266
- Issue date May 26, 2015
- Ibiden Co., Ltd.
- Sho Akai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a printed wiring board
- Patent number 9,021,692
- Issue date May 5, 2015
- Ibiden Co., Ltd.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a wiring board having pads highly resistant...
- Patent number 9,024,207
- Issue date May 5, 2015
- Shinko Electric Industries Co., Ltd.
- Michiro Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of a circuit board structure
- Patent number 8,991,043
- Issue date Mar 31, 2015
- Subtron Technology Co., Ltd.
- Chao-Min Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipating substrate and method of manufacturing the same
- Patent number 8,926,714
- Issue date Jan 6, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Sang Youp Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroconductive layer, laminate using the same, and producing pro...
- Patent number 8,828,554
- Issue date Sep 9, 2014
- Mec Company Ltd.
- Mutsuyuki Kawaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing wiring substrate
- Patent number 8,790,504
- Issue date Jul 29, 2014
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring substrate, and method of manufacturing the same
- Patent number 8,772,643
- Issue date Jul 8, 2014
- NGK Spark Plug Co., Ltd.
- Shinnosuke Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Suspension board with circuit having an opening extending therethro...
- Patent number 8,767,352
- Issue date Jul 1, 2014
- Nitto Denko Corporation
- Tetsuya Ohsawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Metal foil with electric resistance film and method of producing th...
- Patent number 8,749,342
- Issue date Jun 10, 2014
- JX Nippon Mining & Metals Corporation
- Shigeo Ohsaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 8,749,046
- Issue date Jun 10, 2014
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF ELECTRONIC COMPONE...
- Publication number 20240334599
- Publication date Oct 3, 2024
- Taiyo Yuden Co., Ltd.
- Takayuki Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240306296
- Publication date Sep 12, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLATED MOLDED ARTICLE AND METHOD FOR MANUFACTURING PLATED MOLDED AR...
- Publication number 20230156923
- Publication date May 18, 2023
- SANKEI GIKEN KOGYO CO., LTD.
- Toshiyuki Kitamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR MANUFACTURING ULTRASOUND TRANSDUCERS AND OTHER COMPONENTS
- Publication number 20200222941
- Publication date Jul 16, 2020
- FUJIFILM SONOSITE, INC.
- N. Christopher Chaggares
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20200178400
- Publication date Jun 4, 2020
- Unimicron Technology Corp.
- Hsin-Chi HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...
- Publication number 20190172782
- Publication date Jun 6, 2019
- STMicroelectronics S.r.l
- Federico Giovanni Ziglioli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR MANUFACTURING ULTRASOUND TRANSDUCERS AND OTHER COMPONENTS
- Publication number 20160107193
- Publication date Apr 21, 2016
- FUJIFILM SONOSITE, INC.
- N. Christopher Chaggares
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
TOUCH SCREEN, METHOD FOR PRODUCING TOUCH SCREEN, TOUCH DISPLAY DEVICE
- Publication number 20160077628
- Publication date Mar 17, 2016
- BOE TECHNOLOGY GROUP CO., LTD.
- Guodong Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLIP CHIP PAD GEOMETRY FOR AN IC PACKAGE SUBSTRATE
- Publication number 20150194378
- Publication date Jul 9, 2015
- BROADCOM CORPORATION
- Kwok Cheung TSANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING SUBSTRATE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140215782
- Publication date Aug 7, 2014
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140165346
- Publication date Jun 19, 2014
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sang Youp LEE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUSPENSION BOARD WITH CIRCUIT
- Publication number 20140029398
- Publication date Jan 30, 2014
- Nitto Denko Corporation
- Tetsuya Ohsawa
- G11 - INFORMATION STORAGE
Information Patent Application
RESISTANCE-FORMED SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20140008104
- Publication date Jan 9, 2014
- PANASONIC CORPORATION
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR P...
- Publication number 20130269185
- Publication date Oct 17, 2013
- Shinko Electric Industries Co., Ltd.
- Junichi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130256012
- Publication date Oct 3, 2013
- Kotaro Kodani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20130235543
- Publication date Sep 12, 2013
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130185936
- Publication date Jul 25, 2013
- Shinko Electric Industries Co., Ltd.
- Michiro Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130153271
- Publication date Jun 20, 2013
- Shinko Electric Industries Co., Ltd.
- Michiro Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MANUFACTURING ULTRASOUND TRANSDUCERS AND OTHER COMPONENTS
- Publication number 20130140955
- Publication date Jun 6, 2013
- N. Christopher Chaggares
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
WIRING BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20130134127
- Publication date May 30, 2013
- Shinko Electric Industries Co., Ltd.
- Kotaro KODANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20130092422
- Publication date Apr 18, 2013
- SUBTRON TECHNOLOGY CO., LTD.
- Chao-Min Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE
- Publication number 20120267155
- Publication date Oct 25, 2012
- VIA TECHNOLOGIES, INC.
- Chen-Yueh Kung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A METAL CLAD LAMINATE
- Publication number 20120192417
- Publication date Aug 2, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Myung-Sam Kang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR FORMING A TOUCH SENSING PATTERN AND SIGNAL WIRES
- Publication number 20120118851
- Publication date May 17, 2012
- Kai-Ti Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD WITH HIGH-DENSITY CIRCUIT PATTERNS
- Publication number 20120111607
- Publication date May 10, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Shuhichi Okabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal Foil with Electric Resistance Film and Production Method Thereof
- Publication number 20120094114
- Publication date Apr 19, 2012
- JX NIPPON MINING & METALS CORPORATION
- Toshio Kurosawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
THIN FILM CAPACITOR AND METHOD OF FABRICATION THEREOF
- Publication number 20120084955
- Publication date Apr 12, 2012
- E.I. du Pont de Nemours and Company
- JUAN CARLOS FIGUEROA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTIL...
- Publication number 20120082779
- Publication date Apr 5, 2012
- IBIDEN CO., LTD.
- Sho AKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Touch screen panel and fabricating method therof
- Publication number 20120073866
- Publication date Mar 29, 2012
- Akira Hirai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120066901
- Publication date Mar 22, 2012
- IBIDEN CO., LTD.
- Satoru KAWAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Stripping a part of an upper metal layer to expose a lower metal layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods for manufacturing ultrasound transducers and other components

Method of manufacturing circuit board

Manufacturing method for printed circuit board

Micro-fabricated group electroplating technique

Method of manufacturing circuit board

Methods for manufacturing ultrasound transducers and other components

Carrier plate, device having the carrier plate and method for produ...

Method of manufacturing printed circuit board with embedded electro...

Method of fabricating touch screen panel

Touch screen, method for producing touch screen, touch display device

Manufacturing method for component incorporated substrate and compo...

Printed wiring board, method for manufacturing printed wiring board...

Methods for manufacturing ultrasound transducers and other components

Flip chip pad geometry for an IC package substrate

Printed wiring board and method for manufacturing the same

Method of fabricating a wiring board

Method for connecting a precious metal surface to a polymer

Wiring board and semiconductor device

Method of fabricating a wiring board

Multilayer printed wiring board and method for manufacturing multil...

Method for manufacturing a printed wiring board

Method of manufacturing a wiring board having pads highly resistant...

Manufacturing method of a circuit board structure

Heat dissipating substrate and method of manufacturing the same

Electroconductive layer, laminate using the same, and producing pro...

Method of manufacturing wiring substrate

Multilayer wiring substrate, and method of manufacturing the same

Suspension board with circuit having an opening extending therethro...

Metal foil with electric resistance film and method of producing th...

Wiring substrate and method of manufacturing the same

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF ELECTRONIC COMPONE...

WIRING SUBSTRATE

PLATED MOLDED ARTICLE AND METHOD FOR MANUFACTURING PLATED MOLDED AR...

METHODS FOR MANUFACTURING ULTRASOUND TRANSDUCERS AND OTHER COMPONENTS

METHOD OF MANUFACTURING CIRCUIT BOARD

PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...

METHODS FOR MANUFACTURING ULTRASOUND TRANSDUCERS AND OTHER COMPONENTS

TOUCH SCREEN, METHOD FOR PRODUCING TOUCH SCREEN, TOUCH DISPLAY DEVICE

FLIP CHIP PAD GEOMETRY FOR AN IC PACKAGE SUBSTRATE

MULTILAYER WIRING SUBSTRATE, AND METHOD OF MANUFACTURING THE SAME

HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

SUSPENSION BOARD WITH CIRCUIT

RESISTANCE-FORMED SUBSTRATE AND METHOD FOR MANUFACTURING SAME

WIRING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR P...

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD AND SEMICONDUCTOR DEVICE

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

METHODS FOR MANUFACTURING ULTRASOUND TRANSDUCERS AND OTHER COMPONENTS

WIRING BOARD AND METHOD OF FABRICATING THE SAME

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT SUBSTRATE

METHOD OF MANUFACTURING A METAL CLAD LAMINATE

METHOD FOR FORMING A TOUCH SENSING PATTERN AND SIGNAL WIRES

CIRCUIT BOARD WITH HIGH-DENSITY CIRCUIT PATTERNS

Metal Foil with Electric Resistance Film and Production Method Thereof

THIN FILM CAPACITOR AND METHOD OF FABRICATION THEREOF

MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTIL...

Touch screen panel and fabricating method therof

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME