Strontium [Sr]

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H01L2924/01038

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01038Strontium [Sr]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
- Patent number 11,257,714
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grid array connection device and method
- Patent number 10,741,515
- Issue date Aug 11, 2020
- Intel Corporation
- Munehiro Toyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a bonding layer
- Patent number 10,438,925
- Issue date Oct 8, 2019
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Grid array connection device and method
- Patent number 10,373,924
- Issue date Aug 6, 2019
- Intel Corporation
- Munehiro Toyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package, integrated fan-out package array, and m...
- Patent number 10,276,421
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sih-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method for manufacturing light emitting d...
- Patent number 10,230,034
- Issue date Mar 12, 2019
- Nichia Corporation
- Motokazu Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu pillar bump with L-shaped non-metal sidewall protection structure
- Patent number 10,163,837
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pillar structure
- Patent number 10,128,206
- Issue date Nov 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder paste, joining method using the same and joined structure
- Patent number 10,010,980
- Issue date Jul 3, 2018
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Grid array connection device and method
- Patent number 9,966,351
- Issue date May 8, 2018
- Intel Corporation
- Munehiro Toyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting apparatus
- Patent number 9,960,332
- Issue date May 1, 2018
- Sharp Kabushiki Kaisha
- Masahiro Konishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method for manufacturing light emitting d...
- Patent number 9,887,329
- Issue date Feb 6, 2018
- Nichia Corporation
- Motokazu Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die mount by conformal die coating
- Patent number 9,824,999
- Issue date Nov 21, 2017
- Invensas Corporation
- Scott Jay Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic component and method of producing an optoelectronic...
- Patent number 9,768,360
- Issue date Sep 19, 2017
- Osram Opto Semiconductors GmbH
- Michael Fehrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin composition for encapsulating semiconductor device and...
- Patent number 9,735,076
- Issue date Aug 15, 2017
- Samsung SDI Co., Ltd.
- Yoon Man Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing the same, in-millimet...
- Patent number 9,705,202
- Issue date Jul 11, 2017
- Sony Corporation
- Hirofumi Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grid array connection device and method
- Patent number 9,698,114
- Issue date Jul 4, 2017
- Intel Corporation
- Munehiro Toyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming Cu pillar bump with non-metal sidewall spacer and...
- Patent number 9,685,372
- Issue date Jun 20, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming an integrated circuit device including a pillar c...
- Patent number 9,627,339
- Issue date Apr 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a bonding layer
- Patent number 9,627,349
- Issue date Apr 18, 2017
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for fabricating bump structure without UBM undercut
- Patent number 9,598,772
- Issue date Mar 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cu pillar bump with L-shaped non-metal sidewall protection structure
- Patent number 9,524,945
- Issue date Dec 20, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic component and method for producing an optoelectronic...
- Patent number 9,508,903
- Issue date Nov 29, 2016
- Osram Opto Semiconductors GmbH
- Michael Fehrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor package, and electronic device
- Patent number 9,496,226
- Issue date Nov 15, 2016
- Samsung Electronics Co., Ltd.
- Yong-Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting apparatus
- Patent number 9,461,224
- Issue date Oct 4, 2016
- Sharp Kabushiki Kaisha
- Masahiro Konishi
- F21 - LIGHTING
Information Patent Grant
Grid array connection device and method
- Patent number 9,449,936
- Issue date Sep 20, 2016
- Intel Corporation
- Munehiro Toyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect layouts for electronic assemblies
- Patent number 9,355,951
- Issue date May 31, 2016
- Marvell World Trade Ltd.
- Huahung Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support mounted electrically interconnected die assembly
- Patent number 9,305,862
- Issue date Apr 5, 2016
- Invensas Corporation
- Simon J. S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method for producing same
- Patent number 9,299,653
- Issue date Mar 29, 2016
- TDK Corporation
- Minoru Satoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a conductive pillar bump with non-metal sidewall p...
- Patent number 9,287,171
- Issue date Mar 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240379639
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Myung Joo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRID ARRAY CONNECTION DEVICE AND METHOD
- Publication number 20190287937
- Publication date Sep 19, 2019
- Intel Corporation
- Munehiro Toyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRID ARRAY CONNECTION DEVICE AND METHOD
- Publication number 20180247908
- Publication date Aug 30, 2018
- Intel Corporation
- Munehiro Toyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT EMITTING D...
- Publication number 20180123006
- Publication date May 3, 2018
- Nichia Corporation.
- Motokazu YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING BUMP STRUCTURE
- Publication number 20180033756
- Publication date Feb 1, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Guo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE, INTEGRATED FAN-OUT PACKAGE ARRAY, AND M...
- Publication number 20170271227
- Publication date Sep 21, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sih-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...
- Publication number 20160351461
- Publication date Dec 1, 2016
- Samsung SDI Co., Ltd.
- Yoon Man LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR APPLYING A BONDING LAYER
- Publication number 20160190092
- Publication date Jun 30, 2016
- EV GROUP E. THALLNER GMBH
- Markus WIMPLINGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FORMING AN INTEGRATED CIRCUIT DEVICE INCLUDING A PILLAR C...
- Publication number 20150380371
- Publication date Dec 31, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Having Fine Pitch Electrical Interconnects
- Publication number 20150056753
- Publication date Feb 26, 2015
- Invensas Corporation
- Keith Lake Barrie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140367863
- Publication date Dec 18, 2014
- NEC Corporation
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING APPARATUS, SURFACE LIGHT SOURCE, AND METHOD FOR MANU...
- Publication number 20140361331
- Publication date Dec 11, 2014
- Masahiro KONISHI
- F21 - LIGHTING
Information Patent Application
METHOD OF MAKING A PILLAR STRUCTURE HAVING A NON-METAL SIDEWALL PRO...
- Publication number 20140363970
- Publication date Dec 11, 2014
- Chien Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP WITH COBALT-CONTAINING SIDEWALL PROTECTION LAYER
- Publication number 20140342546
- Publication date Nov 20, 2014
- Chien Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A CONDUCTIVE PILLAR BUMP WITH NON-METAL SIDEWALL P...
- Publication number 20140335687
- Publication date Nov 13, 2014
- Yi-Wen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE
- Publication number 20140225236
- Publication date Aug 14, 2014
- Yong-Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE MOUNT BY CONFORMAL DIE COATING
- Publication number 20140213020
- Publication date Jul 31, 2014
- Invensas Corporation
- Scott Jay Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING APPARATUS
- Publication number 20140159092
- Publication date Jun 12, 2014
- SHARP KABUSHIKI KAISHA
- Masahiro Konishi
- F21 - LIGHTING
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20140141550
- Publication date May 22, 2014
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING A COPPER PILLAR CAPPED BY BARRI...
- Publication number 20140124924
- Publication date May 8, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20140110740
- Publication date Apr 24, 2014
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED PROTECTION LAYER FOR COPPER POST STRUCTURE
- Publication number 20140103526
- Publication date Apr 17, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR ASSEMBLY WITH LEAD-FREE SOLDER
- Publication number 20140070409
- Publication date Mar 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN INTEGRATED CIRCUIT DEVICE
- Publication number 20140051244
- Publication date Feb 20, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Cheng KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140035115
- Publication date Feb 6, 2014
- SUMITOMO BAKELITE CO., LTD.
- Shin-ichi Zenbutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED PROTECTION LAYER FOR COPPER POST STRUCTURE
- Publication number 20130299972
- Publication date Nov 14, 2013
- Chung-Shi LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CU PILLAR BUMP WITH ELECTROLYTIC METAL SIDEWALL PROTECTION
- Publication number 20130295762
- Publication date Nov 7, 2013
- Wen-Hsiung LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD CAPABLE OF SCRIBING CHIPS WITH HIGH...
- Publication number 20130280889
- Publication date Oct 24, 2013
- FUJITSU SEMICONDUCTOR LIMITED
- Satoshi OTSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20130273696
- Publication date Oct 17, 2013
- Toshiyuki HATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING THE S...
- Publication number 20130193467
- Publication date Aug 1, 2013
- Nichia Corporation.
- Takeshi KUSUSE
- H01 - BASIC ELECTRIC ELEMENTS

Strontium [Sr]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of making a pillar structure having a non-metal sidewall pro...

Grid array connection device and method

Method for applying a bonding layer

Grid array connection device and method

Integrated fan-out package, integrated fan-out package array, and m...

Light emitting device and method for manufacturing light emitting d...

Cu pillar bump with L-shaped non-metal sidewall protection structure

Conductive pillar structure

Solder paste, joining method using the same and joined structure

Grid array connection device and method

Light-emitting apparatus

Light emitting device and method for manufacturing light emitting d...

Semiconductor die mount by conformal die coating

Optoelectronic component and method of producing an optoelectronic...

Epoxy resin composition for encapsulating semiconductor device and...

Semiconductor device, method of manufacturing the same, in-millimet...

Grid array connection device and method

Method of forming Cu pillar bump with non-metal sidewall spacer and...

Method of forming an integrated circuit device including a pillar c...

Method for applying a bonding layer

Method for fabricating bump structure without UBM undercut

Cu pillar bump with L-shaped non-metal sidewall protection structure

Optoelectronic component and method for producing an optoelectronic...

Semiconductor device, semiconductor package, and electronic device

Light-emitting apparatus

Grid array connection device and method

Interconnect layouts for electronic assemblies

Support mounted electrically interconnected die assembly

Electronic component and method for producing same

Method of making a conductive pillar bump with non-metal sidewall p...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

GRID ARRAY CONNECTION DEVICE AND METHOD

GRID ARRAY CONNECTION DEVICE AND METHOD

LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT EMITTING D...

METHOD FOR FORMING BUMP STRUCTURE

INTEGRATED FAN-OUT PACKAGE, INTEGRATED FAN-OUT PACKAGE ARRAY, AND M...

EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...

METHOD FOR APPLYING A BONDING LAYER

METHOD OF FORMING AN INTEGRATED CIRCUIT DEVICE INCLUDING A PILLAR C...

Semiconductor Die Having Fine Pitch Electrical Interconnects

SEMICONDUCTOR DEVICE

LIGHT-EMITTING APPARATUS, SURFACE LIGHT SOURCE, AND METHOD FOR MANU...

METHOD OF MAKING A PILLAR STRUCTURE HAVING A NON-METAL SIDEWALL PRO...

COPPER PILLAR BUMP WITH COBALT-CONTAINING SIDEWALL PROTECTION LAYER

METHOD OF MAKING A CONDUCTIVE PILLAR BUMP WITH NON-METAL SIDEWALL P...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE

SEMICONDUCTOR DIE MOUNT BY CONFORMAL DIE COATING

LIGHT-EMITTING APPARATUS

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

INTEGRATED CIRCUIT DEVICE INCLUDING A COPPER PILLAR CAPPED BY BARRI...

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

SELF-ALIGNED PROTECTION LAYER FOR COPPER POST STRUCTURE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR ASSEMBLY WITH LEAD-FREE SOLDER

METHOD OF FORMING AN INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE

SELF-ALIGNED PROTECTION LAYER FOR COPPER POST STRUCTURE

CU PILLAR BUMP WITH ELECTROLYTIC METAL SIDEWALL PROTECTION

SEMICONDUCTOR DEVICE AND METHOD CAPABLE OF SCRIBING CHIPS WITH HIGH...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING THE S...