Structural electrical arrangements for semiconductor devices not otherwise provided for

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,148,712
- Issue date Nov 19, 2024
- Mitsubishi Electric Corporation
- Kazuya Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming large chips through stitching
- Patent number 12,148,719
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard ring design enabling in-line testing of silicon bridges for s...
- Patent number 12,142,553
- Issue date Nov 12, 2024
- Intel Corporation
- Arnab Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and fabricating methods thereof
- Patent number 12,136,599
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- He Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grounded metal ring structure for through-silicon via
- Patent number 12,136,600
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Chang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and method of manufacturing the same
- Patent number 12,131,975
- Issue date Oct 29, 2024
- Hyundai Motor Company
- Hyeon Uk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,132,013
- Issue date Oct 29, 2024
- Kioxia Corporation
- Yusuke Akada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,132,012
- Issue date Oct 29, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Nianwang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,131,980
- Issue date Oct 29, 2024
- Fuji Electric Co., Ltd.
- Toru Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including dummy conductive cells
- Patent number 12,125,809
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Delamination sensor
- Patent number 12,125,810
- Issue date Oct 22, 2024
- TAIWAN SEMICONDUTOR MANUFACTURING COMPANY, LTD.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages, packaging methods, and packaged semi...
- Patent number 12,119,338
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical conductive structure surrounded by guard ring and method o...
- Patent number 12,113,034
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chien-Hsuan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack detector units and the related semiconductor dies and methods
- Patent number 12,111,346
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Huan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing dishing resistant structure
- Patent number 12,100,673
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack stop ring trench to prevent epitaxy crack propagation
- Patent number 12,094,838
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ensuring minimum density compliance in integrated circuit inductors
- Patent number 12,087,808
- Issue date Sep 10, 2024
- Silicon Laboratories Inc.
- Eduardo Jose Dos Santos Viegas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Programmable integrated circuit underlay
- Patent number 12,086,518
- Issue date Sep 10, 2024
- Intel Corporation
- Gregg William Baeckler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Selectable monolithic or external scalable die-to-die interconnecti...
- Patent number 12,087,689
- Issue date Sep 10, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an integrated circuit device
- Patent number 12,087,712
- Issue date Sep 10, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip protected against back-face attacks
- Patent number 12,087,708
- Issue date Sep 10, 2024
- STMicroelectronics (Crolles 2) SAS
- Sebastien Petitdidier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard ring and manufacturing method thereof
- Patent number 12,087,709
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor die having edge with multiple grad...
- Patent number 12,087,618
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensing die encapsulated by an encapsulant with a roughness surface...
- Patent number 12,087,654
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit component with conductive terminals of different...
- Patent number 12,074,066
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,074,121
- Issue date Aug 27, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory devices and methods of manufacturing thereof
- Patent number 12,068,263
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including neighboring die contact and seal ri...
- Patent number 12,068,262
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for reducing process charging damages
- Patent number 12,068,227
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded and distributed inductive devices
- Patent number 12,068,100
- Issue date Aug 20, 2024
- Empower Semiconductor, Inc.
- Artin Der Minassians
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DELAMINATION SENSOR
- Publication number 20240387411
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240387447
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Geng-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, AND MEMORY SYSTEM
- Publication number 20240387402
- Publication date Nov 21, 2024
- Yangtze Memory Technologies Co., Ltd.
- Wei XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTONOMOUS ELECTRICAL POWER SOURCES
- Publication number 20240382774
- Publication date Nov 21, 2024
- FACE INTERNATIONAL CORPORATION
- Clark D. Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES, FABRICATION METHODS OF SEMICONDUCTOR DEVICES...
- Publication number 20240387408
- Publication date Nov 21, 2024
- Yangtze Memory Technologies Co., Ltd.
- Wei Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING DISHING RESISTANT STRUCTURE
- Publication number 20240387409
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Grounded Metal Ring Structure For Through-Silicon Via
- Publication number 20240387410
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING DUMMY CONDUCTIVE CELLS
- Publication number 20240387412
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Extended Seal Ring Structure on Wafer-Stacking
- Publication number 20240387403
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Hsorng Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED SEAL RING STRUCTURE AND METHOD OF MAKING THE SAME
- Publication number 20240387404
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTERCONNECTING DIES
- Publication number 20240387390
- Publication date Nov 21, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240387394
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240379584
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsiang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUARD RING AND MANUFACTURING METHOD THEREOF
- Publication number 20240379586
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUARD RING STRUCTURE
- Publication number 20240379588
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING
- Publication number 20240379585
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chien-Hsuan LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING REINFORCEMENT
- Publication number 20240379587
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen Lian Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
- Publication number 20240379564
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yi-Chu WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACKING WITH BOND PAD ABOVE A BONDLINE
- Publication number 20240371905
- Publication date Nov 7, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Swarnal BORTHAKUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRACK DETECTOR UNITS AND THE RELATED SEMICONDUCTOR DIES AND METHODS
- Publication number 20240369613
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- HUAN-NENG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENERGY HARVEST AND STORAGE DEVICE FOR SEMICONDUCTOR CHIPS AND METHO...
- Publication number 20240371798
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuen-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF TESTING THE SAME
- Publication number 20240371709
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- RUEI-JYUN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIA DIE
- Publication number 20240363490
- Publication date Oct 31, 2024
- Intel Corporation
- Mohammad Enamul KABIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING EDGE WITH MULTIPLE GRADIENTS
- Publication number 20240363398
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING STRUCTURE FOR MULTI-GATE DEVICE AND THE METHOD THEREOF
- Publication number 20240363553
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME
- Publication number 20240363415
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including Neighboring Die Contact Seal Ring a...
- Publication number 20240363554
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR REDUCING PROCESS CHARGING DAMAGES
- Publication number 20240363495
- Publication date Oct 31, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Kuan-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240363555
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE CRACK-STOP STRUCTURE TO PREVENT DAMAGE DUE TO DICING CRACK
- Publication number 20240355764
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Ting Wu
- H01 - BASIC ELECTRIC ELEMENTS

Structural electrical arrangements for semiconductor devices not otherwise provided for

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of manufacturing semiconductor device

Forming large chips through stitching

Guard ring design enabling in-line testing of silicon bridges for s...

Three-dimensional memory devices and fabricating methods thereof

Grounded metal ring structure for through-silicon via

Power module and method of manufacturing the same

Semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor module

Semiconductor device including dummy conductive cells

Delamination sensor

Semiconductor device packages, packaging methods, and packaged semi...

Vertical conductive structure surrounded by guard ring and method o...

Crack detector units and the related semiconductor dies and methods

Chemical mechanical polishing dishing resistant structure

Crack stop ring trench to prevent epitaxy crack propagation

Ensuring minimum density compliance in integrated circuit inductors

Programmable integrated circuit underlay

Selectable monolithic or external scalable die-to-die interconnecti...

Method for fabricating an integrated circuit device

Chip protected against back-face attacks

Guard ring and manufacturing method thereof

Method for forming semiconductor die having edge with multiple grad...

Sensing die encapsulated by an encapsulant with a roughness surface...

Integrated circuit component with conductive terminals of different...

Metal-free frame design for silicon bridges for semiconductor packages

Semiconductor memory devices and methods of manufacturing thereof

Semiconductor package including neighboring die contact and seal ri...

Structures and methods for reducing process charging damages

Embedded and distributed inductive devices

Patents Applicationslast 30 patents

DELAMINATION SENSOR

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, AND MEMORY SYSTEM

AUTONOMOUS ELECTRICAL POWER SOURCES

SEMICONDUCTOR DEVICES, FABRICATION METHODS OF SEMICONDUCTOR DEVICES...

CHEMICAL MECHANICAL POLISHING DISHING RESISTANT STRUCTURE

Grounded Metal Ring Structure For Through-Silicon Via

SEMICONDUCTOR DEVICE INCLUDING DUMMY CONDUCTIVE CELLS

Extended Seal Ring Structure on Wafer-Stacking

ADVANCED SEAL RING STRUCTURE AND METHOD OF MAKING THE SAME

SYSTEMS AND METHODS FOR INTERCONNECTING DIES

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

GUARD RING AND MANUFACTURING METHOD THEREOF

GUARD RING STRUCTURE

SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING

SEAL RING REINFORCEMENT

SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING

CHIP STACKING WITH BOND PAD ABOVE A BONDLINE

CRACK DETECTOR UNITS AND THE RELATED SEMICONDUCTOR DIES AND METHODS

ENERGY HARVEST AND STORAGE DEVICE FOR SEMICONDUCTOR CHIPS AND METHO...

SEMICONDUCTOR DEVICE AND METHOD OF TESTING THE SAME

THROUGH-SILICON VIA DIE

SEMICONDUCTOR DIE HAVING EDGE WITH MULTIPLE GRADIENTS

SEAL RING STRUCTURE FOR MULTI-GATE DEVICE AND THE METHOD THEREOF

INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME

Semiconductor Package Including Neighboring Die Contact Seal Ring a...

STRUCTURES AND METHODS FOR REDUCING PROCESS CHARGING DAMAGES

SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF

DEVICE CRACK-STOP STRUCTURE TO PREVENT DAMAGE DUE TO DICING CRACK