Structure of the additional element

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CPC
H01L2224/05086

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05086Structure of the additional element

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display device
- Patent number 11,917,875
- Issue date Feb 27, 2024
- Samsung Display Co., Ltd.
- Ki Kyung Youk
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor devices with through silicon vias and package-level c...
- Patent number 11,056,467
- Issue date Jul 6, 2021
- Micron Technology, Inc.
- Kevin G. Duesman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and equipment
- Patent number 10,622,397
- Issue date Apr 14, 2020
- Canon Kabushiki Kaisha
- Hideaki Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with through silicon vias and package-level c...
- Patent number 10,483,241
- Issue date Nov 19, 2019
- Micron Technology, Inc.
- Kevin G. Duesman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure with dense via array
- Patent number 9,711,468
- Issue date Jul 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming patterned repassivation...
- Patent number 9,397,058
- Issue date Jul 19, 2016
- STATS ChipPAC Pte. Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via network structures and method therefor
- Patent number 9,269,617
- Issue date Feb 23, 2016
- NXP B.V.
- Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure with dense via array
- Patent number 9,041,204
- Issue date May 26, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming patterned repassivation...
- Patent number 8,963,326
- Issue date Feb 24, 2015
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via network structures and method therefor
- Patent number 8,896,124
- Issue date Nov 25, 2014
- NXP B.V.
- Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connection structure
- Patent number 8,883,628
- Issue date Nov 11, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electrical connection structure
- Patent number 8,476,759
- Issue date Jul 2, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY DEVICE
- Publication number 20230015243
- Publication date Jan 19, 2023
- SAMSUNG DISPLAY CO., LTD.
- Chungi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CAPABLE OF DISPERSING STRESSES
- Publication number 20170271286
- Publication date Sep 21, 2017
- Samsung Electronics Co., Ltd.
- YOUNGBAE KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA NETWORK STRUCTURES AND METHOD THEREFOR
- Publication number 20150072520
- Publication date Mar 12, 2015
- NXP B.V.
- Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Connection Structure
- Publication number 20130288473
- Publication date Oct 31, 2013
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE WITH DENSE VIA ARRAY
- Publication number 20130256893
- Publication date Oct 3, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Han TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Patterned Repassivation...
- Publication number 20130140691
- Publication date Jun 6, 2013
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Connection Structure
- Publication number 20130134563
- Publication date May 30, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA NETWORK STRUCTURES AND METHOD THEREFOR
- Publication number 20120248623
- Publication date Oct 4, 2012
- Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20070232056
- Publication date Oct 4, 2007
- FUJITSU LIMITED
- Nobukatsu Saitou
- H01 - BASIC ELECTRIC ELEMENTS

Structure of the additional element

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device

Semiconductor devices with through silicon vias and package-level c...

Semiconductor apparatus and equipment

Semiconductor devices with through silicon vias and package-level c...

Bonding pad structure with dense via array

Semiconductor device and method of forming patterned repassivation...

Via network structures and method therefor

Bonding pad structure with dense via array

Semiconductor device and method of forming patterned repassivation...

Via network structures and method therefor

Electrical connection structure

Electrical connection structure

Patents Applicationslast 30 patents

DISPLAY DEVICE

SEMICONDUCTOR DEVICE CAPABLE OF DISPERSING STRESSES

VIA NETWORK STRUCTURES AND METHOD THEREFOR

Electrical Connection Structure

BONDING PAD STRUCTURE WITH DENSE VIA ARRAY

Semiconductor Device and Method of Forming Patterned Repassivation...

Electrical Connection Structure

VIA NETWORK STRUCTURES AND METHOD THEREFOR

Semiconductor device and method for manufacturing the same