Structure of the auxiliary member

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H01L2224/0218

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0218Structure of the auxiliary member

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,080,662
- Issue date Sep 3, 2024
- Samsung Display Co., Ltd.
- Eui Jeong Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metal film on surface between passivation...
- Patent number 12,057,416
- Issue date Aug 6, 2024
- Sumitomo Electric Industries, Ltd.
- Mitsuhiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with edge-protecting spacers over bonding pad
- Patent number 12,027,479
- Issue date Jul 2, 2024
- NANYA TECHNOLOGY CORPORATION
- Jung-Hsing Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,990,434
- Issue date May 21, 2024
- Rohm Co., Ltd.
- Kazuki Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal structure
- Patent number 11,961,880
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with edge-protecting spacers over bonding pad
- Patent number 11,894,328
- Issue date Feb 6, 2024
- NANYA TECHNOLOGY CORPORATION
- Jung-Hsing Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip including a passivation nitride layer in co...
- Patent number 11,887,948
- Issue date Jan 30, 2024
- STMicroelectronics S.r.l.
- Simone Dario Mariani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including stress-resistant bonding structures and...
- Patent number 11,887,955
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,855,014
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device having a bond wire o...
- Patent number 11,837,528
- Issue date Dec 5, 2023
- Infineon Technologies AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,764,174
- Issue date Sep 19, 2023
- United Microelectronics Corp.
- Chun-Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display backboard and manufacturing method thereof and display device
- Patent number 11,764,343
- Issue date Sep 19, 2023
- BOE Technology Group Co., Ltd.
- Zhiwei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moat coverage with dielectric film for device passivation and singu...
- Patent number 11,764,110
- Issue date Sep 19, 2023
- Semiconductor Components Industries, LLC
- Mark Anand Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and manufacturing methods for the same
- Patent number 11,735,559
- Issue date Aug 22, 2023
- SK hynix Inc.
- Chan Sun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,670,559
- Issue date Jun 6, 2023
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer (RDL) structure, semiconductor device and manu...
- Patent number 11,605,605
- Issue date Mar 14, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with spacer over bonding pad
- Patent number 11,605,606
- Issue date Mar 14, 2023
- NANYA TECHNOLOGY CORPORATION
- Chun-Chi Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlocked redistribution layer interface for flip-chip integrated...
- Patent number 11,545,450
- Issue date Jan 3, 2023
- NVIDIA Corporation
- Yuanjing Jane Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DI solder cup
- Patent number 11,532,578
- Issue date Dec 20, 2022
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with spacer over bonding pad
- Patent number 11,521,945
- Issue date Dec 6, 2022
- NANYA TECHNOLOGY CORPORATION
- Chun-Chi Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor contact structure having stress buffer layer formed b...
- Patent number 11,476,212
- Issue date Oct 18, 2022
- United Microelectronics Corporation
- Yu-Jie Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 11,476,210
- Issue date Oct 18, 2022
- Kabushiki Kaisha Toshiba
- Keiichiro Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and manufacturing methods for the same
- Patent number 11,437,342
- Issue date Sep 6, 2022
- SK hynix Inc.
- Chan Sun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,380,636
- Issue date Jul 5, 2022
- Samsung Electronics Co., Ltd.
- Seung Min Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device load terminal
- Patent number 11,315,892
- Issue date Apr 26, 2022
- Infineon Technologies AG
- Roman Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,309,258
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate and manufacturing method therefor
- Patent number 11,251,145
- Issue date Feb 15, 2022
- JX Nippon Mining & Metals Corporation
- Takuto Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,239,329
- Issue date Feb 1, 2022
- Mitsubishi Electric Corporation
- Shinya Soneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly containing a dielectric bonding pattern definition...
- Patent number 11,094,653
- Issue date Aug 17, 2021
- SanDisk Technologies LLC
- Chen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and methods of packaging thereof
- Patent number 11,094,622
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240413106
- Publication date Dec 12, 2024
- United Microelectronics Corp.
- Chien-Ming Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240404969
- Publication date Dec 5, 2024
- SAMSUNG DISPLAY CO., LTD.
- EUI JEONG KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL STRUCTURE
- Publication number 20240274653
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING EXPOSED LEADS
- Publication number 20240203919
- Publication date Jun 20, 2024
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo Cruz Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND...
- Publication number 20240128219
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP INCLUDING A PASSIVATION NITRIDE LAYER IN CO...
- Publication number 20240120301
- Publication date Apr 11, 2024
- STMicroelectronics S.r.l
- Simone Dario MARIANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240113016
- Publication date Apr 4, 2024
- LAPIS SEMICONDUCTOR CO., LTD.
- MANAMI KINASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING...
- Publication number 20240096825
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY BACKBOARD AND MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE
- Publication number 20230378414
- Publication date Nov 23, 2023
- BOE TECHNOLOGY GROUP CO., LTD.
- Zhiwei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOAT COVERAGE WITH DIELECTRIC FILM FOR DEVICE PASSIVATION AND SINGU...
- Publication number 20230377974
- Publication date Nov 23, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Mark Anand THOMAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND TILED DISPLAY DEVICE
- Publication number 20230238373
- Publication date Jul 27, 2023
- SAMSUNG DISPLAY CO., LTD.
- Nak Cho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING RING, STACKED STRUCTURE, AND METHOD FOR MANUFACTURING SEALI...
- Publication number 20230140743
- Publication date May 4, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20230103655
- Publication date Apr 6, 2023
- Rohm Co., Ltd.
- Yuki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY BACKBOARD AND MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE
- Publication number 20230097502
- Publication date Mar 30, 2023
- BOE TECHNOLOGY GROUP CO., LTD.
- Zhiwei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND...
- Publication number 20230065797
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivation Structure for Metal Pattern
- Publication number 20230052604
- Publication date Feb 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Hung Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP INCLUDING A PASSIVATION NITRIDE LAYER IN CO...
- Publication number 20230032635
- Publication date Feb 2, 2023
- STMicroelectronics S.r.l
- Simone Dario MARIANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS FOR THE SAME
- Publication number 20220359453
- Publication date Nov 10, 2022
- SK HYNIX INC.
- Chan Sun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL STRUCTURE
- Publication number 20220359644
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220328437
- Publication date Oct 13, 2022
- Rohm Co., Ltd.
- Kazuki YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220181279
- Publication date Jun 9, 2022
- Sumitomo Electric Industries, Ltd.
- Mitsuhiko SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLOCKED REDISTRIBUTION LAYER INTERFACE FOR FLIP-CHIP INTEGRATED...
- Publication number 20220020709
- Publication date Jan 20, 2022
- NVIDIA Corporation
- Yuanjing Jane Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220013481
- Publication date Jan 13, 2022
- RENESAS ELECTRONICS CORPORATION
- Tatsuya USAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210375804
- Publication date Dec 2, 2021
- SAMSUNG DISPLAY CO., LTD.
- EUI JEONG KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20210288006
- Publication date Sep 16, 2021
- Kabushiki Kaisha Toshiba
- Keiichiro Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER (RDL) STRUCTURE, SEMICONDUCTOR DEVICE AND MANU...
- Publication number 20210225787
- Publication date Jul 22, 2021
- Changxin Memory Technologies, Inc.
- Ping-Heng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS FOR THE SAME
- Publication number 20210210458
- Publication date Jul 8, 2021
- SK HYNIX INC.
- Chan Sun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DI Solder Cup
- Publication number 20210202411
- Publication date Jul 1, 2021
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY CONTAINING A DIELECTRIC BONDING PATTERN DEFINITION...
- Publication number 20210143115
- Publication date May 13, 2021
- SANDISK TECHNOLOGIES LLC
- Chen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONTACT STRUCTURE HAVING STRESS BUFFER LAYER FORMED B...
- Publication number 20210104478
- Publication date Apr 8, 2021
- UNITED MICROELECTRONICS CORPORATION
- YU-JIE LIN
- H01 - BASIC ELECTRIC ELEMENTS

Structure of the auxiliary member

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device and method of manufacturing the same

Semiconductor device with metal film on surface between passivation...

Semiconductor device with edge-protecting spacers over bonding pad

Semiconductor device and method of manufacturing semiconductor device

Metal-insulator-metal structure

Semiconductor device with edge-protecting spacers over bonding pad

Integrated circuit chip including a passivation nitride layer in co...

Semiconductor die including stress-resistant bonding structures and...

Semiconductor device and method

Method of manufacturing a semiconductor device having a bond wire o...

Semiconductor structure

Display backboard and manufacturing method thereof and display device

Moat coverage with dielectric film for device passivation and singu...

Semiconductor packages and manufacturing methods for the same

Semiconductor device

Redistribution layer (RDL) structure, semiconductor device and manu...

Semiconductor device with spacer over bonding pad

Interlocked redistribution layer interface for flip-chip integrated...

3DI solder cup

Semiconductor device with spacer over bonding pad

Semiconductor contact structure having stress buffer layer formed b...

Semiconductor device and semiconductor package

Semiconductor packages and manufacturing methods for the same

Semiconductor package

Power semiconductor device load terminal

Semiconductor structure

Semiconductor substrate and manufacturing method therefor

Semiconductor device

Bonded assembly containing a dielectric bonding pattern definition...

Packaged semiconductor devices and methods of packaging thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

METAL-INSULATOR-METAL STRUCTURE

INTEGRATED CIRCUIT HAVING EXPOSED LEADS

SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND...

INTEGRATED CIRCUIT CHIP INCLUDING A PASSIVATION NITRIDE LAYER IN CO...

SEMICONDUCTOR DEVICE

BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING...

DISPLAY BACKBOARD AND MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE

MOAT COVERAGE WITH DIELECTRIC FILM FOR DEVICE PASSIVATION AND SINGU...

DISPLAY DEVICE AND TILED DISPLAY DEVICE

SEALING RING, STACKED STRUCTURE, AND METHOD FOR MANUFACTURING SEALI...

ELECTRONIC COMPONENT

DISPLAY BACKBOARD AND MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE

SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND...

Passivation Structure for Metal Pattern

INTEGRATED CIRCUIT CHIP INCLUDING A PASSIVATION NITRIDE LAYER IN CO...

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS FOR THE SAME

METAL-INSULATOR-METAL STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

INTERLOCKED REDISTRIBUTION LAYER INTERFACE FOR FLIP-CHIP INTEGRATED...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

REDISTRIBUTION LAYER (RDL) STRUCTURE, SEMICONDUCTOR DEVICE AND MANU...

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS FOR THE SAME

3DI Solder Cup

BONDED ASSEMBLY CONTAINING A DIELECTRIC BONDING PATTERN DEFINITION...

SEMICONDUCTOR CONTACT STRUCTURE HAVING STRESS BUFFER LAYER FORMED B...