Structure, shape, material or disposition of the layer connectors prior to the connecting process

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/28Structure, shape, material or disposition of the layer connectors prior to the connecting process

Industries

Patents Grantslast 30 patents

Information Patent Grant
Image sensor with tolerance optimizing interconnects
- Patent number 12,100,716
- Issue date Sep 24, 2024
- DePuy Synthes Products, Inc.
- Laurent Blanquart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die contact structure and method
- Patent number 12,074,127
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out structure and method of fabricating the same
- Patent number 12,020,953
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated system-in-package with radiation shielding
- Patent number 11,978,709
- Issue date May 7, 2024
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for sub-column parallel digitizers for hybrid sta...
- Patent number 11,973,090
- Issue date Apr 30, 2024
- DePuy Synthes Products, Inc.
- Laurent Blanquart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 11,848,337
- Issue date Dec 19, 2023
- DePuy Synthes Products, Inc.
- Laurent Blanquart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 11,842,972
- Issue date Dec 12, 2023
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel array area optimization using stacking scheme for hybrid imag...
- Patent number 11,682,682
- Issue date Jun 20, 2023
- DePuy Synthes Products, Inc.
- Laurent Blanquart
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Raised via for terminal connections on different planes
- Patent number 11,646,220
- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
- Patent number 11,626,295
- Issue date Apr 11, 2023
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fan-out structure and method of fabricating the same
- Patent number 11,626,296
- Issue date Apr 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-function bond pad
- Patent number 11,574,884
- Issue date Feb 7, 2023
- Texas Instruments Incorporated
- Suvadip Banerjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including alignment material and method for m...
- Patent number 11,538,778
- Issue date Dec 27, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die contact structure and method
- Patent number 11,515,272
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated system-in-package with radiation shielding
- Patent number 11,362,047
- Issue date Jun 14, 2022
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 11,355,462
- Issue date Jun 7, 2022
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Raised via for terminal connections on different planes
- Patent number 11,251,071
- Issue date Feb 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device package
- Patent number 11,189,593
- Issue date Nov 30, 2021
- Analog Devices International Unlimited Company
- Teik Tiong Toong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor chip transmitting sign...
- Patent number 11,049,806
- Issue date Jun 29, 2021
- Renesas Electronics Corporation
- Kazuyuki Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 11,049,833
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a solder blocking metal layer
- Patent number 11,031,365
- Issue date Jun 8, 2021
- Sumitomo Electric Device Innovations, Inc.
- Fumio Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
- Patent number 11,018,028
- Issue date May 25, 2021
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fan-out structure and method of fabricating the same
- Patent number 10,943,798
- Issue date Mar 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with liquid metal conductors
- Patent number 10,879,151
- Issue date Dec 29, 2020
- Texas Instruments Incorporated
- Dishit Paresh Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED chips, method of manufacturing the same, and display panels
- Patent number 10,868,217
- Issue date Dec 15, 2020
- Dong Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pillar in a film-type seconductor package
- Patent number 10,867,948
- Issue date Dec 15, 2020
- Samsung Electronics Co., Ltd.
- Jung-woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive substrate, transfer device having adhesive substrate, and...
- Patent number 10,818,618
- Issue date Oct 27, 2020
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 10,818,628
- Issue date Oct 27, 2020
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive substrate and method for separating an object from an adhe...
- Patent number 10,772,213
- Issue date Sep 8, 2020
- Shin-Etsu Polymer Co., Ltd.
- Yuji Irisawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
- Patent number 10,692,827
- Issue date Jun 23, 2020
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
- Publication number 20240055384
- Publication date Feb 15, 2024
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID PHASE BONDING FOR ELECTRICAL INTERCONNECTS IN SEMICONDUCTOR...
- Publication number 20230369277
- Publication date Nov 16, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Structure and Method of Fabricating the Same
- Publication number 20230245903
- Publication date Aug 3, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Contact Structure and Method
- Publication number 20230085696
- Publication date Mar 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
- Publication number 20220285305
- Publication date Sep 8, 2022
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SYSTEM-IN-PACKAGE WITH RADIATION SHIELDING
- Publication number 20220285293
- Publication date Sep 8, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20220199559
- Publication date Jun 23, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Raised Via for Terminal Connections on Different Planes
- Publication number 20220165611
- Publication date May 26, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20210327843
- Publication date Oct 21, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SYSTEM-IN-PACKAGE WITH RADIATION SHIELDING
- Publication number 20210327829
- Publication date Oct 21, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210242162
- Publication date Aug 5, 2021
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Fumio YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Structure and Method of Fabricating the Same
- Publication number 20210193485
- Publication date Jun 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE PACKAGE
- Publication number 20210082862
- Publication date Mar 18, 2021
- Analog Devices International Unlimited Company
- Teik Tiong Toong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Contact Structure and Method
- Publication number 20210074627
- Publication date Mar 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210013375
- Publication date Jan 14, 2021
- Advanced Semiconductor Engineering, Inc.
- Mei-Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
- Publication number 20210013168
- Publication date Jan 14, 2021
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Structure and Method of Fabricating the Same
- Publication number 20200258760
- Publication date Aug 13, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Raised Via for Terminal Connections on Different Planes
- Publication number 20200251380
- Publication date Aug 6, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH LIQUID METAL CONDUCTORS
- Publication number 20200211928
- Publication date Jul 2, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Dishit Paresh PAREKH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
- Publication number 20200105699
- Publication date Apr 2, 2020
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200051897
- Publication date Feb 13, 2020
- SHUN-PING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE SUBSTRATE, TRANSFER DEVICE HAVING ADHESIVE SUBSTRATE, AND...
- Publication number 20200035627
- Publication date Jan 30, 2020
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20190355639
- Publication date Nov 21, 2019
- Kingpak Technology Inc.
- JIAN-RU CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive Substrate and Method for Separating an Object from an Adhe...
- Publication number 20190327838
- Publication date Oct 24, 2019
- Shin-Etsu Polymer Co., Ltd.
- Yuji Irisawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Raised Via for Terminal Connections on Different Planes
- Publication number 20190273018
- Publication date Sep 5, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED CHIPS, METHOD OF MANUFACTURING THE SAME, AND DISPLAY PANELS
- Publication number 20190273184
- Publication date Sep 5, 2019
- Kunshan New Flat Panel Display Technology Center Co., Ltd.
- Dong WEI
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Fan-Out Structure and Method of Fabricating the Same
- Publication number 20190273001
- Publication date Sep 5, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20190115247
- Publication date Apr 18, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FORMING JOINT STRUCTURES FOR SURFACE MOUNT PACKAGES
- Publication number 20190103377
- Publication date Apr 4, 2019
- Lilia May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
- Publication number 20190081015
- Publication date Mar 14, 2019
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS

Structure, shape, material or disposition of the layer connectors prior to the connecting process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Image sensor with tolerance optimizing interconnects

Semiconductor die contact structure and method

Fan-out structure and method of fabricating the same

Integrated system-in-package with radiation shielding

System and method for sub-column parallel digitizers for hybrid sta...

Image sensor

Semiconductor device with a semiconductor chip connected in a flip...

Pixel array area optimization using stacking scheme for hybrid imag...

Raised via for terminal connections on different planes

Method of applying conductive adhesive and manufacturing device usi...

Fan-out structure and method of fabricating the same

Multi-function bond pad

Semiconductor package including alignment material and method for m...

Semiconductor die contact structure and method

Integrated system-in-package with radiation shielding

Semiconductor device with a semiconductor chip connected in a flip...

Raised via for terminal connections on different planes

Integrated device package

Semiconductor device including semiconductor chip transmitting sign...

Semiconductor packages with an intermetallic layer

Semiconductor device having a solder blocking metal layer

Method of applying conductive adhesive and manufacturing device usi...

Fan-out structure and method of fabricating the same

Semiconductor package with liquid metal conductors

LED chips, method of manufacturing the same, and display panels

Metal pillar in a film-type seconductor package

Adhesive substrate, transfer device having adhesive substrate, and...

Semiconductor device with a semiconductor chip connected in a flip...

Adhesive substrate and method for separating an object from an adhe...

Packaged microelectronic devices and methods for manufacturing pack...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...

LIQUID PHASE BONDING FOR ELECTRICAL INTERCONNECTS IN SEMICONDUCTOR...

Fan-Out Structure and Method of Fabricating the Same

Semiconductor Die Contact Structure and Method

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...

INTEGRATED SYSTEM-IN-PACKAGE WITH RADIATION SHIELDING

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

Raised Via for Terminal Connections on Different Planes

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

INTEGRATED SYSTEM-IN-PACKAGE WITH RADIATION SHIELDING

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Fan-Out Structure and Method of Fabricating the Same

INTEGRATED DEVICE PACKAGE

Semiconductor Die Contact Structure and Method

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...

Fan-Out Structure and Method of Fabricating the Same

Raised Via for Terminal Connections on Different Planes

SEMICONDUCTOR PACKAGE WITH LIQUID METAL CONDUCTORS

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...

SEMICONDUCTOR PACKAGE

ADHESIVE SUBSTRATE, TRANSFER DEVICE HAVING ADHESIVE SUBSTRATE, AND...

SENSOR PACKAGE STRUCTURE

Adhesive Substrate and Method for Separating an Object from an Adhe...

Raised Via for Terminal Connections on Different Planes

LED CHIPS, METHOD OF MANUFACTURING THE SAME, AND DISPLAY PANELS

Fan-Out Structure and Method of Fabricating the Same

ROOM TEMPERATURE METAL DIRECT BONDING

METHODS OF FORMING JOINT STRUCTURES FOR SURFACE MOUNT PACKAGES

PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...