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H01L2924/1811

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1811Structure

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Flip chip package unit comprising thermal protection film and assoc...
- Patent number 12,159,792
- Issue date Dec 3, 2024
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including inner conductive layer having region...
- Patent number 12,125,823
- Issue date Oct 22, 2024
- Denso Corporation
- Shingo Tsuchimochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing light emitting devices
- Patent number 12,080,695
- Issue date Sep 3, 2024
- Nichia Corporation
- Kenji Ozeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with multiple gap-filling layers and fabrica...
- Patent number 12,057,363
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 12,051,634
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with thermal pad
- Patent number 12,021,019
- Issue date Jun 25, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and method for forming the same
- Patent number 12,014,969
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,972,991
- Issue date Apr 30, 2024
- Mitsubishi Electric Corporation
- Hiroki Shiota
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor structures and method of manufacturing the same
- Patent number 11,961,811
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die modules for semiconductor device assemblies and methods...
- Patent number 11,942,430
- Issue date Mar 26, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-use package architecture
- Patent number 11,929,295
- Issue date Mar 12, 2024
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having first heat spreader and second heat spr...
- Patent number 11,915,991
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,901,332
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapsulant comprising conductive f...
- Patent number 11,842,946
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 11,791,324
- Issue date Oct 17, 2023
- Nichia Corporation
- Kenji Ozeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 11,756,849
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures
- Patent number 11,646,281
- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a substrate, an integrated device, and an encaps...
- Patent number 11,605,571
- Issue date Mar 14, 2023
- QUALCOMM Incorporated
- Alberto Jose Teixeira De Queiros
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power semiconductor module and power conversion apparatus
- Patent number 11,476,170
- Issue date Oct 18, 2022
- Mitsubishi Electric Corporation
- Yusuke Kaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D printed semiconductor package
- Patent number 11,417,540
- Issue date Aug 16, 2022
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 11,404,341
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,398,424
- Issue date Jul 26, 2022
- Advanced Semiconductor Engineering, Inc.
- Jaw-Ming Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 11,393,803
- Issue date Jul 19, 2022
- Nichia Corporation
- Kenji Ozeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 11,282,810
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming same
- Patent number 11,239,233
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- G01 - MEASURING TESTING
Information Patent Grant
IC package having a metal die for ESP protection
- Patent number 11,107,807
- Issue date Aug 31, 2021
- NANYA TECHNOLOGY CORPORATION
- Fang Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,031,370
- Issue date Jun 8, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structures with improved adhesion and strength
- Patent number 10,971,418
- Issue date Apr 6, 2021
- Skyworks Solutions, Inc.
- Bradley Paul Barber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit packages and methods of forming same
- Patent number 10,872,885
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D printed semiconductor package
- Patent number 10,861,715
- Issue date Dec 8, 2020
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REDISTRIBUTION LAYER METALLIC LAYOUT STRUCTURE AND METHOD WITH WARP...
- Publication number 20240404853
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dian-Hau CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20240395786
- Publication date Nov 28, 2024
- Nichia Corporation.
- Kenji OZEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20240369765
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACT...
- Publication number 20240355693
- Publication date Oct 24, 2024
- Kabushiki Kaisha Toshiba
- Shogo MINAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
- Publication number 20240347436
- Publication date Oct 17, 2024
- Resonac Corporation
- Tomoaki SHIBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING...
- Publication number 20240347407
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD
- Publication number 20240347441
- Publication date Oct 17, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PACKAGE DEVICE, FABRICATION METHOD THEREOF AND MEMORY SY...
- Publication number 20240332152
- Publication date Oct 3, 2024
- Yangtze Memory Technologies Co., Ltd.
- Xinru Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Antenna-in-Package St...
- Publication number 20240321664
- Publication date Sep 26, 2024
- JCET STATS ChipPAC Korea Limited
- YeJin PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING A SEMICONDUCT...
- Publication number 20240312874
- Publication date Sep 19, 2024
- SERIPHY TECHNOLOGY CORPORATION
- TZU-WEI CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240297089
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240282713
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENERGY CONVERSION MODULE AND ENERGY CONVERSION DEVICE
- Publication number 20240282652
- Publication date Aug 22, 2024
- ACTRON TECHNOLOGY CORPORATION
- Hsin-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240266321
- Publication date Aug 8, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE MODULES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND METHODS...
- Publication number 20240258243
- Publication date Aug 1, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selectively Dispensed Underfill and Edge Bond Patterns
- Publication number 20240249989
- Publication date Jul 25, 2024
- Apple Inc.
- Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240250035
- Publication date Jul 25, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Se Hwan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240243102
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- Yikoan HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING
- Publication number 20240222216
- Publication date Jul 4, 2024
- Intel Corporation
- Zhixin XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240222290
- Publication date Jul 4, 2024
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240203812
- Publication date Jun 20, 2024
- RENESAS ELECTRONICS CORPORATION
- Takamichi HOSOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH MOLDING CONTACT ENABLED EMI SHIELDING
- Publication number 20240203895
- Publication date Jun 20, 2024
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240153855
- Publication date May 9, 2024
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240136246
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE RECONSTITUTION AND HIGH-DENSITY INTERCONNECTS FOR EMBEDDED CHIPS
- Publication number 20240128222
- Publication date Apr 18, 2024
- Neuralink Corp.
- Supin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Assembly
- Publication number 20240120260
- Publication date Apr 11, 2024
- NEXPERIA B.V.
- Tim Böttcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE WITH SEALED DIE ENCLOSURES
- Publication number 20240088081
- Publication date Mar 14, 2024
- QUALCOMM Incorporated
- Bart KASSTEEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20240088093
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...
- Publication number 20240071865
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGE WITH PRESS-FIT CONDUCTIVE PINS
- Publication number 20240071892
- Publication date Feb 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Flip chip package unit comprising thermal protection film and assoc...

Semiconductor device including inner conductive layer having region...

Method for manufacturing light emitting devices

Chip package structure with multiple gap-filling layers and fabrica...

Package and package-on-package structure having elliptical columns...

Semiconductor device package with thermal pad

Package structure and method for forming the same

Semiconductor device

Semiconductor structures and method of manufacturing the same

Stacked die modules for semiconductor device assemblies and methods...

Multi-use package architecture

Semiconductor device having first heat spreader and second heat spr...

Semiconductor device and manufacturing method thereof

Semiconductor package having an encapsulant comprising conductive f...

Light emitting device

Package and package-on-package structure having elliptical columns...

Semiconductor structures

Package comprising a substrate, an integrated device, and an encaps...

Power semiconductor module and power conversion apparatus

3D printed semiconductor package

Package and package-on-package structure having elliptical columns...

Semiconductor package structure

Light emitting device

Integrated fan-out package and manufacturing method thereof

Integrated circuit packages and methods of forming same

IC package having a metal die for ESP protection

Semiconductor device and manufacturing method thereof

Packaging structures with improved adhesion and strength

Integrated circuit packages and methods of forming same

3D printed semiconductor package

Patents Applicationslast 30 patents

REDISTRIBUTION LAYER METALLIC LAYOUT STRUCTURE AND METHOD WITH WARP...

LIGHT EMITTING DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACT...

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

METHOD FOR FORMING CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING...

SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD

INTEGRATED PACKAGE DEVICE, FABRICATION METHOD THEREOF AND MEMORY SY...

Semiconductor Device and Method of Forming an Antenna-in-Package St...

SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING A SEMICONDUCT...

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

ENERGY CONVERSION MODULE AND ENERGY CONVERSION DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

STACKED DIE MODULES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND METHODS...

Selectively Dispensed Underfill and Edge Bond Patterns

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

THROUGH MOLDING CONTACT ENABLED EMI SHIELDING

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

DIE RECONSTITUTION AND HIGH-DENSITY INTERCONNECTS FOR EMBEDDED CHIPS

Semiconductor Package Assembly

DIE PACKAGE WITH SEALED DIE ENCLOSURES

Integrated Circuit Packages and Methods of Forming the Same

SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...

MOLDED PACKAGE WITH PRESS-FIT CONDUCTIVE PINS