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H01L2224/2501

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/2501Structure

Industries

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Patents Grantslast 30 patents

Information Patent Grant
High density substrate routing in package
- Patent number 12,051,667
- Issue date Jul 30, 2024
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,996,381
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging substrate fine pitch metal bump and reinfor...
- Patent number 11,908,819
- Issue date Feb 20, 2024
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,855,030
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in package
- Patent number 11,810,884
- Issue date Nov 7, 2023
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component embedded substrate
- Patent number 11,640,952
- Issue date May 2, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Mi Sun Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,557,561
- Issue date Jan 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in package
- Patent number 11,251,150
- Issue date Feb 15, 2022
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,069,642
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in package
- Patent number 10,861,815
- Issue date Dec 8, 2020
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and method of fabricating the same
- Patent number 10,854,570
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in package
- Patent number 10,438,915
- Issue date Oct 8, 2019
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in package
- Patent number 10,199,346
- Issue date Feb 5, 2019
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in BBUL package
- Patent number 9,929,119
- Issue date Mar 27, 2018
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded structures for package-on-package architecture
- Patent number 9,748,177
- Issue date Aug 29, 2017
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with interposer structure and m...
- Patent number 9,659,897
- Issue date May 23, 2017
- STATS ChipPAC Pte. Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in BBUL package
- Patent number 9,437,569
- Issue date Sep 6, 2016
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded structures for package-on-package architecture
- Patent number 9,368,401
- Issue date Jun 14, 2016
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with interposer structure and m...
- Patent number 9,355,983
- Issue date May 31, 2016
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in BBUL package
- Patent number 9,171,816
- Issue date Oct 27, 2015
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded structures for package-on-package architecture
- Patent number 8,866,287
- Issue date Oct 21, 2014
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
- Publication number 20240339428
- Publication date Oct 10, 2024
- Intel Corporation
- Weng Hong TEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240274567
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD
- Publication number 20240178178
- Publication date May 30, 2024
- STMicroelectronics International N.V.
- Francesca DE VITI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240096837
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240088085
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20230111006
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE HAVING IMPROVED RELIABILITY AND INSPE...
- Publication number 20220084980
- Publication date Mar 17, 2022
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210343675
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED SUBSTRATE
- Publication number 20210193609
- Publication date Jun 24, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Mi Sun HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20210082858
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200203303
- Publication date Jun 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
- Publication number 20190393180
- Publication date Dec 26, 2019
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
- Publication number 20190139926
- Publication date May 9, 2019
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20190035759
- Publication date Jan 31, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
- Publication number 20180145047
- Publication date May 24, 2018
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN BBUL PACKAGE
- Publication number 20170053887
- Publication date Feb 23, 2017
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN BBUL PACKAGE
- Publication number 20160079196
- Publication date Mar 17, 2016
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN BBUL PACKAGE
- Publication number 20150194406
- Publication date Jul 9, 2015
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED STRUCTURES FOR PACKAGE-ON-PACKAGE ARCHITECTURE
- Publication number 20150014861
- Publication date Jan 15, 2015
- Intel Corporation
- Weng Hong TEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN BBUL PACKAGE
- Publication number 20140159228
- Publication date Jun 12, 2014
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20140117524
- Publication date May 1, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED STRUCTURES FOR PACKAGE-ON-PACKAGE ARCHITECTURE
- Publication number 20140093999
- Publication date Apr 3, 2014
- Weng Hong TEH
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High density substrate routing in package

Package structure and method of fabricating the same

Semiconductor packaging substrate fine pitch metal bump and reinfor...

Package structure and method of manufacturing the same

High density substrate routing in package

Electronic component embedded substrate

Package structure and method of fabricating the same

High density substrate routing in package

Package structure and method of manufacturing the same

High density substrate routing in package

Integrated fan-out package and method of fabricating the same

High density substrate routing in package

High density substrate routing in package

High density substrate routing in BBUL package

Embedded structures for package-on-package architecture

Integrated circuit packaging system with interposer structure and m...

High density substrate routing in BBUL package

Embedded structures for package-on-package architecture

Integrated circuit packaging system with interposer structure and m...

High density substrate routing in BBUL package

Embedded structures for package-on-package architecture

Patents Applicationslast 30 patents

HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

PACKAGED SEMICONDUCTOR DEVICE HAVING IMPROVED RELIABILITY AND INSPE...

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC COMPONENT EMBEDDED SUBSTRATE

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE

HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE

INTEGRATED FAN-OUT PACKAGE AND METHOD OF FABRICATING THE SAME

HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE

HIGH DENSITY SUBSTRATE ROUTING IN BBUL PACKAGE

HIGH DENSITY SUBSTRATE ROUTING IN BBUL PACKAGE

HIGH DENSITY SUBSTRATE ROUTING IN BBUL PACKAGE

EMBEDDED STRUCTURES FOR PACKAGE-ON-PACKAGE ARCHITECTURE

HIGH DENSITY SUBSTRATE ROUTING IN BBUL PACKAGE

POWER SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF

EMBEDDED STRUCTURES FOR PACKAGE-ON-PACKAGE ARCHITECTURE