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H01L2924/1711

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/1711Structure

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,972,991
- Issue date Apr 30, 2024
- Mitsubishi Electric Corporation
- Hiroki Shiota
- B32 - LAYERED PRODUCTS
Information Patent Grant
Integrated circuit device with plating on lead interconnection poin...
- Patent number 10,699,990
- Issue date Jun 30, 2020
- STMicroelectronics Sdn Bhd
- Cheeyang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for mounting a power conditioner to a photovoltaic module...
- Patent number 10,686,399
- Issue date Jun 16, 2020
- Enphase Energy, Inc.
- Ryan Linderman
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Semiconductor device and mounting structure of semiconductor device
- Patent number 10,535,813
- Issue date Jan 14, 2020
- Rohm Co., Ltd.
- Shinsei Mizuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and mounting structure of semiconductor device
- Patent number 10,153,424
- Issue date Dec 11, 2018
- Rohm Co., Ltd.
- Shinsei Mizuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,090,237
- Issue date Oct 2, 2018
- Renesas Electronics Corporation
- Yoshihiko Shimanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with plating on lead interconnection poin...
- Patent number 10,062,639
- Issue date Aug 28, 2018
- STMicroelectronics Sdn Bhd
- Cheeyang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolator with reduced susceptibility to parasitic coupling
- Patent number 9,960,671
- Issue date May 1, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Dominique Ho
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Strip-shaped substrate for producing chip carriers, electronic modu...
- Patent number 9,941,197
- Issue date Apr 10, 2018
- Heraeus Deutschland GmbH & Co. KG
- Eckhard Ditzel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Molded leadframe substrate semiconductor package
- Patent number 9,899,208
- Issue date Feb 20, 2018
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,812,388
- Issue date Nov 7, 2017
- Renesas Electronics Corporation
- Yoshihiko Shimanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged device with additive substrate surface modification
- Patent number 9,780,017
- Issue date Oct 3, 2017
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip cavity package
- Patent number 9,761,435
- Issue date Sep 12, 2017
- UTAC Thai Limited
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded leadframe substrate semiconductor package
- Patent number 9,711,343
- Issue date Jul 18, 2017
- UTAC THAI LIMITED
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-planar inductive electrical elements in semiconductor package l...
- Patent number 9,704,639
- Issue date Jul 11, 2017
- SOLANTRO SEMICONDUCTOR CORP.
- Raymond Kenneth Orr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged device with additive substrate surface modification
- Patent number 9,524,926
- Issue date Dec 20, 2016
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded flip-clip semiconductor package
- Patent number 9,219,025
- Issue date Dec 22, 2015
- Infineon Technologies AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 9,209,099
- Issue date Dec 8, 2015
- Fuji Electric Co., Ltd.
- Motohito Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded leadframe substrate semiconductor package
- Patent number 9,196,470
- Issue date Nov 24, 2015
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded leadframe substrate semiconductor package
- Patent number 9,082,607
- Issue date Jul 14, 2015
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT WITH IMPROVED BOARD LEVEL RELIABILITY
- Publication number 20240404937
- Publication date Dec 5, 2024
- Murata Manufacturing Co., Ltd.
- Sami NURMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBST...
- Publication number 20240222288
- Publication date Jul 4, 2024
- Intel Corporation
- David Shia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240112988
- Publication date Apr 4, 2024
- ROHM CO., LTD.
- Kaori UEBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED EMBEDDED DIE PACKAGE
- Publication number 20240038619
- Publication date Feb 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20230378092
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20230005801
- Publication date Jan 5, 2023
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MOUTING STRUCTURE OF SEMICONDUCTOR DEVICE
- Publication number 20190067560
- Publication date Feb 28, 2019
- ROHM CO., LTD.
- Shinsei MIZUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Device with Plating on Lead Interconnection Poin...
- Publication number 20180350728
- Publication date Dec 6, 2018
- STMicroelectronics SDN BHD
- Cheeyang NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180040552
- Publication date Feb 8, 2018
- RENESAS ELECTRONICS CORPORATION
- Yoshihiko SHIMANUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20170213788
- Publication date Jul 27, 2017
- RENESAS ELECTRONICS CORPORATION
- Yoshihiko SHIMANUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRIP-SHAPED SUBSTRATE FOR PRODUCING CHIP CARRIERS, ELECTRONIC MODU...
- Publication number 20170133313
- Publication date May 11, 2017
- Heraeus Deutschland GmbH & Co. KG
- Eckhard DITZEL
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WINDOW CLAMP
- Publication number 20160276305
- Publication date Sep 22, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Ruby Ann Maya Merto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ISOLATOR WITH REDUCED SUSCEPTIBILITY TO PARASITIC COUPLING
- Publication number 20160190918
- Publication date Jun 30, 2016
- Dominique Ho
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH PLATING ON LEAD INTERCONNECTION POIN...
- Publication number 20160172273
- Publication date Jun 16, 2016
- STMicroelectronics SDN BHD
- Cheeyang NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-PLANAR INDUCTIVE ELECTRICAL ELEMENTS IN SEMICONDUCTOR PACKAGE L...
- Publication number 20160133373
- Publication date May 12, 2016
- Solantro Semiconductor Corp.
- Raymond Kenneth Orr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Robust and Reliable Power Semiconductor Package
- Publication number 20160104688
- Publication date Apr 14, 2016
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DEVICE WITH ADDITIVE SUBSTRATE SURFACE MODIFICATION
- Publication number 20160093558
- Publication date Mar 31, 2016
- TEXAS INSTRUMENTS INCORPORATED
- BENJAMIN STASSEN COOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF PACKAGED SEMICONDUCTOR DEVICES WITH BENT-LE...
- Publication number 20160005712
- Publication date Jan 7, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20150340297
- Publication date Nov 26, 2015
- Fuji Electric Co., Ltd.
- Motohito HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLIES WITH REINFORCEMENT FRAMES, AND METHOD...
- Publication number 20150262972
- Publication date Sep 17, 2015
- Invensas Corporation
- Rajesh KATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED LEADFRAME SUBSTRATE SEMICONDUCTOR PACKAGE
- Publication number 20130243893
- Publication date Sep 19, 2013
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED LEADFRAME SUBSTRATE SEMICONDUCTOR PACKAGE
- Publication number 20110076805
- Publication date Mar 31, 2011
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Integrated circuit device with plating on lead interconnection poin...

Apparatus for mounting a power conditioner to a photovoltaic module...

Semiconductor device and mounting structure of semiconductor device

Semiconductor device and mounting structure of semiconductor device

Semiconductor device and manufacturing method thereof

Integrated circuit device with plating on lead interconnection poin...

Isolator with reduced susceptibility to parasitic coupling

Strip-shaped substrate for producing chip carriers, electronic modu...

Molded leadframe substrate semiconductor package

Semiconductor device and manufacturing method thereof

Packaged device with additive substrate surface modification

Flip chip cavity package

Molded leadframe substrate semiconductor package

Non-planar inductive electrical elements in semiconductor package l...

Packaged device with additive substrate surface modification

Molded flip-clip semiconductor package

Power semiconductor module

Molded leadframe substrate semiconductor package

Molded leadframe substrate semiconductor package

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT WITH IMPROVED BOARD LEVEL RELIABILITY

SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBST...

SEMICONDUCTOR DEVICE

THERMALLY ENHANCED EMBEDDED DIE PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND MOUTING STRUCTURE OF SEMICONDUCTOR DEVICE

Integrated Circuit Device with Plating on Lead Interconnection Poin...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

STRIP-SHAPED SUBSTRATE FOR PRODUCING CHIP CARRIERS, ELECTRONIC MODU...

WINDOW CLAMP

ISOLATOR WITH REDUCED SUSCEPTIBILITY TO PARASITIC COUPLING

INTEGRATED CIRCUIT DEVICE WITH PLATING ON LEAD INTERCONNECTION POIN...

NON-PLANAR INDUCTIVE ELECTRICAL ELEMENTS IN SEMICONDUCTOR PACKAGE L...

Robust and Reliable Power Semiconductor Package

PACKAGED DEVICE WITH ADDITIVE SUBSTRATE SURFACE MODIFICATION

STRUCTURE AND METHOD OF PACKAGED SEMICONDUCTOR DEVICES WITH BENT-LE...

POWER SEMICONDUCTOR MODULE

INTEGRATED CIRCUIT ASSEMBLIES WITH REINFORCEMENT FRAMES, AND METHOD...

MOLDED LEADFRAME SUBSTRATE SEMICONDUCTOR PACKAGE

MOLDED LEADFRAME SUBSTRATE SEMICONDUCTOR PACKAGE