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CPC
H01L2224/4801

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4801Structure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,131,983
- Issue date Oct 29, 2024
- Rohm Co., Ltd.
- Katsutoki Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with a first substrate, a second substrate and...
- Patent number 12,125,817
- Issue date Oct 22, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack with cascade and vertical connections
- Patent number 12,068,283
- Issue date Aug 20, 2024
- Intel Corporation
- Min-Tih Ted Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with electrical fuses
- Patent number 12,009,336
- Issue date Jun 11, 2024
- Texas Instruments Incorporated
- Mahmud Halim Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated copper bonding wire, manufacturing method of palla...
- Patent number 11,996,382
- Issue date May 28, 2024
- Tanaka Denshi Kogyo K.K.
- Mitsuo Takada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Power management
- Patent number 11,935,602
- Issue date Mar 19, 2024
- Micron Technology, Inc.
- Liang Yu
- G11 - INFORMATION STORAGE
Information Patent Grant
Dual head capillary design for vertical wire bond
- Patent number 11,894,334
- Issue date Feb 6, 2024
- Intel Corporation
- Yuhong Cai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,824,036
- Issue date Nov 21, 2023
- Kioxia Corporation
- Akihiro Iida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including plurality of semiconductor chips on...
- Patent number 11,791,298
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Yun Tae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ribbon bond solution for reducing thermal stress on an intermittent...
- Patent number 11,706,852
- Issue date Jul 18, 2023
- Illinois Tool Works Inc.
- Marco Carcano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack with cascade and vertical connections
- Patent number 11,171,114
- Issue date Nov 9, 2021
- Intel Corporation
- Min-Tih Ted Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including plurality of semiconductor chips on...
- Patent number 11,164,838
- Issue date Nov 2, 2021
- Samsung Electronics Co., Ltd.
- Yun Tae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly and method for forming the same
- Patent number 10,903,198
- Issue date Jan 26, 2021
- Mediatek Inc.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforcement for electrical connectors
- Patent number 10,700,037
- Issue date Jun 30, 2020
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,672,733
- Issue date Jun 2, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resonator device, electronic apparatus, and vehicle
- Patent number 10,594,295
- Issue date Mar 17, 2020
- Seiko Epson Corporation
- Akio Tsutsumi
- G04 - HOROLOGY
Information Patent Grant
Semiconductor package assembly and method for forming the same
- Patent number 10,497,689
- Issue date Dec 3, 2019
- Mediatek Inc.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,497,663
- Issue date Dec 3, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,468,376
- Issue date Nov 5, 2019
- Napra Co., Ltd
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,468,370
- Issue date Nov 5, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,461,055
- Issue date Oct 29, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency power component and radio frequency signal transcei...
- Patent number 10,347,596
- Issue date Jul 9, 2019
- Huawei Technologies Co., Ltd.
- An Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed impedance leads for die packages and method of making the same
- Patent number 10,340,209
- Issue date Jul 2, 2019
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a protruding interposer edge face
- Patent number 10,332,937
- Issue date Jun 25, 2019
- Sumitomo Electric Industries, Ltd.
- Akira Furuya
- G02 - OPTICS
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,236,272
- Issue date Mar 19, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 10,211,114
- Issue date Feb 19, 2019
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with first and second chips and connections th...
- Patent number 10,204,899
- Issue date Feb 12, 2019
- Renesas Electronics Corporation
- Masaki Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging using wire bond wires in place of a redistrib...
- Patent number 10,008,469
- Issue date Jun 26, 2018
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flipped die stacks with multiple rows of leadframe interconnects
- Patent number 9,859,257
- Issue date Jan 2, 2018
- Invensas Corporation
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 9,837,373
- Issue date Dec 5, 2017
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGES WITH ELECTRICAL FUSES
- Publication number 20240332243
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Mahmud Halim CHOWDHURY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240228264
- Publication date Jul 11, 2024
- STMicroelectronics International N.V.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
POWER MANAGEMENT
- Publication number 20240233836
- Publication date Jul 11, 2024
- Micron Technology, Inc.
- Liang Yu
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240203812
- Publication date Jun 20, 2024
- RENESAS ELECTRONICS CORPORATION
- Takamichi HOSOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Die Attach with Adhesive Layer C...
- Publication number 20240194628
- Publication date Jun 13, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE WITH MOLDED VIA AND DUAL SIDE PRESS-FIT PIN
- Publication number 20240170378
- Publication date May 23, 2024
- Semiconductor Components Industries, LLC
- Heejo CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240132340
- Publication date Apr 25, 2024
- STMicroelectronics (Malta) Ltd.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
QFN PACKAGE AND FABRICATING METHOD OF THE SAME
- Publication number 20240128168
- Publication date Apr 18, 2024
- UNITED MICROELECTRONICS CORP.
- Chiu-Feng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDS FOR GALVANIC ISOLATION DEVICE
- Publication number 20240113155
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM BONDING WIRE FOR POWER SEMICONDUCTOR
- Publication number 20240105667
- Publication date Mar 28, 2024
- TANAKA DENSHI KOGYO K.K.
- Shuichi MITOMA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
DOCUMENT STRUCTURE FORMATION
- Publication number 20240105669
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING SEMICONDUCTOR DIES THROUGH TRACES
- Publication number 20240079369
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Terrence B. McDaniel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240071996
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Wonil SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOHERTY AMPLIFIERS
- Publication number 20240063756
- Publication date Feb 22, 2024
- NXP USA, Inc.
- Qi Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240047313
- Publication date Feb 8, 2024
- Integrated Silicon Solution Inc.
- Cheng-Fu YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240047336
- Publication date Feb 8, 2024
- Siliconware Precision Industries Co., Ltd.
- Ching-Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH FIXING FEATURE ON...
- Publication number 20240014168
- Publication date Jan 11, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR ADJUSTING PHASE CHARACTERISTICS...
- Publication number 20240014150
- Publication date Jan 11, 2024
- Kabushiki Kaisha Toshiba
- Koji TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE QFN HYBRID PACKAGE
- Publication number 20240006278
- Publication date Jan 4, 2024
- MEDIATEK INC.
- Hsin-Long Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT PACKAGE, METHOD OF MANUFACTURING THE SAME, AND ELEC...
- Publication number 20230420404
- Publication date Dec 28, 2023
- Sony Semiconductor Solutions Corporation
- Yuji HARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SUPPORTER AGAINST WHICH BONDING WIRE IS D...
- Publication number 20230395558
- Publication date Dec 7, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSS STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS
- Publication number 20230378128
- Publication date Nov 23, 2023
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS
- Publication number 20230378129
- Publication date Nov 23, 2023
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SUBSTRATE FOR ELECTRICAL CONNECTION
- Publication number 20230369280
- Publication date Nov 16, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP DEVICE WITH GATE REDISTRIBUTION STRUCTURE
- Publication number 20230335530
- Publication date Oct 19, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD OF HIGH-POWER RADIO FREQUE...
- Publication number 20230282609
- Publication date Sep 7, 2023
- INNOGRATION (SUZHOU) CO., LTD.
- Yinghao ZHUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230260952
- Publication date Aug 17, 2023
- Mitsubishi Electric Corporation
- Hideki YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE BASE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230223327
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- Minkyeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR USING SPACER-ON-SPACER DESIGN FOR SOLDER...
- Publication number 20230207488
- Publication date Jun 29, 2023
- Micron Technology, Inc.
- Faxing Che
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230154882
- Publication date May 18, 2023
- Fuji Electric Co., Ltd.
- Ryotaro TSURUOKA
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Semiconductor module with a first substrate, a second substrate and...

Die stack with cascade and vertical connections

Packages with electrical fuses

Palladium-coated copper bonding wire, manufacturing method of palla...

Power management

Dual head capillary design for vertical wire bond

Semiconductor device

Semiconductor package including plurality of semiconductor chips on...

Ribbon bond solution for reducing thermal stress on an intermittent...

Die stack with cascade and vertical connections

Semiconductor package including plurality of semiconductor chips on...

Semiconductor package assembly and method for forming the same

Reinforcement for electrical connectors

Cu alloy core bonding wire with Pd coating for semiconductor device

Resonator device, electronic apparatus, and vehicle

Semiconductor package assembly and method for forming the same

Cu alloy core bonding wire with Pd coating for semiconductor device

Semiconductor device and method for manufacturing the same

Bonding wire for semiconductor device

Cu alloy core bonding wire with Pd coating for semiconductor device

Radio frequency power component and radio frequency signal transcei...

Mixed impedance leads for die packages and method of making the same

Semiconductor device having a protruding interposer edge face

Cu alloy core bonding wire with Pd coating for semiconductor device

Microelectronic devices, stacked microelectronic devices, and metho...

Semiconductor device with first and second chips and connections th...

Wafer-level packaging using wire bond wires in place of a redistrib...

Flipped die stacks with multiple rows of leadframe interconnects

Semiconductor device and production method therefor

Patents Applicationslast 30 patents

PACKAGES WITH ELECTRICAL FUSES

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

POWER MANAGEMENT

SEMICONDUCTOR DEVICE

Semiconductor Device and Method of Die Attach with Adhesive Layer C...

POWER MODULE PACKAGE WITH MOLDED VIA AND DUAL SIDE PRESS-FIT PIN

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

QFN PACKAGE AND FABRICATING METHOD OF THE SAME

WIRE BONDS FOR GALVANIC ISOLATION DEVICE

ALUMINUM BONDING WIRE FOR POWER SEMICONDUCTOR

DOCUMENT STRUCTURE FORMATION

CONNECTING SEMICONDUCTOR DIES THROUGH TRACES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

DOHERTY AMPLIFIERS

PACKAGE STRUCTURE

ELECTRONIC PACKAGE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH FIXING FEATURE ON...

SEMICONDUCTOR DEVICE AND METHOD FOR ADJUSTING PHASE CHARACTERISTICS...

MULTI-DIE QFN HYBRID PACKAGE

IMAGING ELEMENT PACKAGE, METHOD OF MANUFACTURING THE SAME, AND ELEC...

SEMICONDUCTOR DEVICE WITH SUPPORTER AGAINST WHICH BONDING WIRE IS D...

CROSS STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS

THROUGH STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS

SEMICONDUCTOR DEVICE WITH SUBSTRATE FOR ELECTRICAL CONNECTION

MULTI-CHIP DEVICE WITH GATE REDISTRIBUTION STRUCTURE

PACKAGING STRUCTURE AND PACKAGING METHOD OF HIGH-POWER RADIO FREQUE...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE BASE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

METHODS AND APPARATUS FOR USING SPACER-ON-SPACER DESIGN FOR SOLDER...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME