Structure

Industry

CPC
H01L2224/2201

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/2201Structure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,824,033
- Issue date Nov 21, 2023
- Samsung Electronics Co., Ltd.
- Gyoyoung Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out packaging structure and method
- Patent number 11,749,657
- Issue date Sep 5, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,552,038
- Issue date Jan 10, 2023
- Samsung Electronics Co., Ltd.
- Gyoyoung Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having thermal through vias (TTV)
- Patent number 11,373,922
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and fixture for chip attachment to physical objects
- Patent number 10,847,384
- Issue date Nov 24, 2020
- Palo Alto Research Center Incorporated
- Ping Mei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor structure element and method for producing a conductor st...
- Patent number 9,456,500
- Issue date Sep 27, 2016
- Schweizer Electronic AG
- Thomas Gottwald
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor modules
- Patent number 8,592,257
- Issue date Nov 26, 2013
- Sanyo Electric Co., LTD
- Mayumi Nakasato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating semiconductor devices and a semiconductor d...
- Patent number 8,586,450
- Issue date Nov 19, 2013
- STMicroelectronics (Grenoble 2) SAS
- Eric Saugier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming fully embedded bumpless build-up layer packages...
- Patent number 8,580,616
- Issue date Nov 12, 2013
- Intel Corporation
- Ravi K. Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing vias in fan-out wafers using dry film and cond...
- Patent number 8,535,980
- Issue date Sep 17, 2013
- STMicroelectronics Pte Ltd
- Puay Gek Chua
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods of forming fully embedded bumpless build-up layer packages...
- Patent number 8,304,913
- Issue date Nov 6, 2012
- Intel Corporation
- Ravi K Nalla
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD...
- Publication number 20240321804
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Dowan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNEC...
- Publication number 20240096809
- Publication date Mar 21, 2024
- Intel Corporation
- Hiroki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Package Comprising a Decoupling Layer Structure
- Publication number 20240030095
- Publication date Jan 25, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Andreas Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20230133567
- Publication date May 4, 2023
- Samsung Electronics Co., Ltd.
- Gyoyoung JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBMODULE SEMICONDUCTOR PACKAGE
- Publication number 20220406744
- Publication date Dec 22, 2022
- Semiconductor Components Industries, LLC
- JooYang EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIA...
- Publication number 20220285241
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20220130786
- Publication date Apr 28, 2022
- Samsung Electronics Co., Ltd.
- Gyoyoung JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING STRUCTURE AND METHOD
- Publication number 20220084996
- Publication date Mar 17, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20140117524
- Publication date May 1, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING FULLY EMBEDDED BUMPLESS BUILD-UP LAYER PACKAGES...
- Publication number 20130023088
- Publication date Jan 24, 2013
- Ravi K. Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductor Structural Element and Method for Producing a Conductor S...
- Publication number 20120320549
- Publication date Dec 20, 2012
- Schweizer Electronic AG
- Thomas Gottwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR MODULES
- Publication number 20120288999
- Publication date Nov 15, 2012
- Sanyo Electric Co., Ltd.
- Mayumi NAKASATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING VIAS IN FAN-OUT WAFERS USING DRY FILM AND COND...
- Publication number 20120161332
- Publication date Jun 28, 2012
- STMicroelectronics Pte Ltd
- Puay Gek Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING FULLY EMBEDDED BUMPLESS BUILD-UP LAYER PACKAGES...
- Publication number 20120074580
- Publication date Mar 29, 2012
- Ravi K. Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR FABRICATING SEMICONDUCTOR DEVICES AND A SEMICONDUCTOR D...
- Publication number 20110278733
- Publication date Nov 17, 2011
- STMicroelectronics (Grenoble 2) SAS
- Eric Saugier
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and method of manufacturing the semiconductor...

Fan-out packaging structure and method

Semiconductor package and method of manufacturing the semiconductor...

Semiconductor packages having thermal through vias (TTV)

Method and fixture for chip attachment to physical objects

Conductor structure element and method for producing a conductor st...

Method for manufacturing semiconductor modules

Process for fabricating semiconductor devices and a semiconductor d...

Methods of forming fully embedded bumpless build-up layer packages...

Method for producing vias in fan-out wafers using dry film and cond...

Methods of forming fully embedded bumpless build-up layer packages...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD...

MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNEC...

Electronic Package Comprising a Decoupling Layer Structure

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SUBMODULE SEMICONDUCTOR PACKAGE

METHOD OF FORMING SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIA...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

FAN-OUT PACKAGING STRUCTURE AND METHOD

POWER SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF

METHODS OF FORMING FULLY EMBEDDED BUMPLESS BUILD-UP LAYER PACKAGES...

Conductor Structural Element and Method for Producing a Conductor S...

METHOD FOR MANUFACTURING SEMICONDUCTOR MODULES

METHOD FOR PRODUCING VIAS IN FAN-OUT WAFERS USING DRY FILM AND COND...

METHODS OF FORMING FULLY EMBEDDED BUMPLESS BUILD-UP LAYER PACKAGES...

PROCESS FOR FABRICATING SEMICONDUCTOR DEVICES AND A SEMICONDUCTOR D...