Structures for avoiding electrostatic attraction

Industry

CPC
B81B3/0008

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B3/00Devices comprising flexible or deformable elements

Current Industry

B81B3/0008Structures for avoiding electrostatic attraction

Industries

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for providing getters in microelectromechanical...
- Patent number 11,945,713
- Issue date Apr 2, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro-mechanical system (MEMS) thermal sensor
- Patent number 11,796,396
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsai-Hao Hung
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS structure and method of forming same
- Patent number 11,736,037
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi Heng Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Physical quantity sensor, electronic apparatus, and vehicle
- Patent number 11,656,243
- Issue date May 23, 2023
- Seiko Epson Corporation
- Satoru Tanaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inertial sensor, electronic instrument, and vehicle
- Patent number 11,460,483
- Issue date Oct 4, 2022
- Seiko Epson Corporation
- Satoru Tanaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 11,459,226
- Issue date Oct 4, 2022
- Mitsubishi Electric Corporation
- Yasuo Yamaguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for preparing silicon wafer with rough surface and silicon w...
- Patent number 11,305,988
- Issue date Apr 19, 2022
- AAC Acoustic Technologies (Shenzhen) Co., Ltd.
- Wooicheang Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Physical quantity sensor manufacturing method, physical quantity se...
- Patent number 11,292,714
- Issue date Apr 5, 2022
- Seiko Epson Corporation
- Satoru Tanaka
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Fence structure to prevent stiction in a MEMS motion sensor
- Patent number 11,261,083
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lee-Chuan Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS element
- Patent number 11,214,481
- Issue date Jan 4, 2022
- Kabushiki Kaisha Toshiba
- Fumitaka Ishibashi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for preparing silicon wafer with rough surface and silicon w...
- Patent number 11,192,782
- Issue date Dec 7, 2021
- AAC Acoustic Technologies (Shenzhen) Co., Ltd.
- Wooicheang Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vibration device and method for controlling the same
- Patent number 11,092,440
- Issue date Aug 17, 2021
- Kabushikikaisha Toshiba
- Ryunosuke Gando
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with reduced electric charge, cavity volume and stiction
- Patent number 10,988,372
- Issue date Apr 27, 2021
- Invensense, Inc.
- Dongyang Kang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro-mechanical system (MEMS) thermal sensor
- Patent number 10,962,424
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsai-Hao Hung
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Physical quantity sensor manufacturing method, physical quantity se...
- Patent number 10,850,975
- Issue date Dec 1, 2020
- Seiko Epson Corporation
- Satoru Tanaka
- B60 - VEHICLES IN GENERAL
Information Patent Grant
MEMS sensor compensation for off-axis movement
- Patent number 10,766,764
- Issue date Sep 8, 2020
- Invensense, Inc.
- Ilya Gurin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems, devices, and methods for reducing surface dielectric charg...
- Patent number 10,640,362
- Issue date May 5, 2020
- Wispry, Inc.
- David Molinero-Giles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS structure with bilayer stopper and method for forming the same
- Patent number 10,618,801
- Issue date Apr 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Chuan Tai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fence structure to prevent stiction in a MEMS motion sensor
- Patent number 10,562,763
- Issue date Feb 18, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lee-Chuan Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS structure and method of forming same
- Patent number 10,541,627
- Issue date Jan 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi Heng Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS sensor compensation for off-axis movement
- Patent number 10,421,659
- Issue date Sep 24, 2019
- Invensense, Inc.
- Ilya Gurin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for providing getters in microelectromechanical...
- Patent number 10,384,930
- Issue date Aug 20, 2019
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro-mechanical system (MEMS) variable capacitor apparatus...
- Patent number 10,354,804
- Issue date Jul 16, 2019
- Wispry, Inc.
- Arthur S. Morris
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical sensor and method for producing a micromechanical s...
- Patent number 10,294,095
- Issue date May 21, 2019
- Robert Bosch GmbH
- Benny Pekka Herzogenrath
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Physical quantity sensor, electronic device, and moving object
- Patent number 10,197,591
- Issue date Feb 5, 2019
- Seiko Epson Corporation
- Satoru Tanaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System and method for a perpendicular electrode transducer
- Patent number 10,104,478
- Issue date Oct 16, 2018
- Infineon Technologies AG
- Christoph Glacer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Digital pattern generator having charge drain coating
- Patent number 10,072,334
- Issue date Sep 11, 2018
- KLA-Tencor Corporation
- William M. Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro-mechanical system (MEMS) variable capacitor apparatus...
- Patent number 10,062,517
- Issue date Aug 28, 2018
- Wispry, Inc.
- Arthur S. Morris
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Physical quantity sensor, electronic device, and moving object
- Patent number 9,952,251
- Issue date Apr 24, 2018
- Seiko Epson Corporation
- Satoru Tanaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for stiction reduction in MEMS sensors
- Patent number 9,926,192
- Issue date Mar 27, 2018
- Invensense, Inc.
- Cerina Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MEMS DEVICE AND METHOD FOR MANUFACTURING MEMS DEVICE
- Publication number 20240400374
- Publication date Dec 5, 2024
- Rohm Co., Ltd.
- Toma FUJITA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND METHOD OF MANUFACTURING MEMS DEVICE
- Publication number 20240317574
- Publication date Sep 26, 2024
- Rohm Co., Ltd.
- Martin Wilfried HELLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE, METHOD FOR MANUFACTURING MEMS DEVICE AND ELECTRONIC DE...
- Publication number 20240262678
- Publication date Aug 8, 2024
- Beijing BOE Technology Development Co., Ltd.
- Jingwen GUO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Microelectromechanical Systems Die
- Publication number 20240217807
- Publication date Jul 4, 2024
- KNOWLES ELECTRONICS, LLC
- Yunfei Ma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Micro-Electro-Mechanical System (Mems) Thermal Sensor
- Publication number 20230375416
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsai-Hao HUNG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Structure and Method of Forming Same
- Publication number 20230353066
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company Co., Ltd.
- Yi Heng Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING GETTERS IN MICROELECTROMECHANICAL...
- Publication number 20220348455
- Publication date Nov 3, 2022
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUBSTRATE AND MICROPHONE UNIT
- Publication number 20220219968
- Publication date Jul 14, 2022
- HOSIDEN CORPORATION
- Shingo OKANO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PREPARING SILICON WAFER WITH ROUGH SURFACE AND SILICON W...
- Publication number 20220063995
- Publication date Mar 3, 2022
- AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD
- Wooicheang Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FORMATION OF SELF-ASSEMBLED MONOLAYER FOR ULTRASONIC TRANSDUCERS
- Publication number 20210403321
- Publication date Dec 30, 2021
- Butterfly Network, Inc.
- Jianwei Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS, DEVICES, AND METHODS TO REDUCE DIELECTRIC CHARGING IN MICR...
- Publication number 20210238027
- Publication date Aug 5, 2021
- wiSpry, Inc.
- Dana Richard DeReus
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYTEM (MEMS) THERMAL SENSOR
- Publication number 20210215550
- Publication date Jul 15, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsai-Hao HUNG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PHYSICAL QUANTITY SENSOR MANUFACTURING METHOD, PHYSICAL QUANTITY SE...
- Publication number 20210078859
- Publication date Mar 18, 2021
- SEIKO EPSON CORPORATION
- Satoru TANAKA
- B60 - VEHICLES IN GENERAL
Information Patent Application
MEMS DEVICE WITH REDUCED ELECTRIC CHARGE, CAVITY VOLUME AND STICTION
- Publication number 20210070608
- Publication date Mar 11, 2021
- InvenSense, Inc.
- Dongyang Kang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FENCE STRUCTURE TO PREVENT STICTION IN A MEMS MOTION SENSOR
- Publication number 20200140265
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Lee-Chuan Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) THERMAL SENSOR
- Publication number 20200103290
- Publication date Apr 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsai-Hao HUNG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Structure and Method of Forming Same
- Publication number 20200067425
- Publication date Feb 27, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi Heng Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) VARIABLE CAPACITOR APPARATUS...
- Publication number 20190362899
- Publication date Nov 28, 2019
- wiSpry, Inc.
- Arthur S. Morris
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR COMPENSATION FOR OFF-AXIS MOVEMENT
- Publication number 20190359479
- Publication date Nov 28, 2019
- InvenSense, Inc.
- Ilya Gurin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING GETTERS IN MICROELECTROMECHANICAL...
- Publication number 20190330052
- Publication date Oct 31, 2019
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VIBRATION DEVICE AND METHOD FOR CONTROLLING THE SAME
- Publication number 20190204081
- Publication date Jul 4, 2019
- Kabushiki Kaisha Toshiba
- Ryunosuke Gando
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR COMPENSATION FOR OFF-AXIS MOVEMENT
- Publication number 20190144264
- Publication date May 16, 2019
- InvenSense, Inc.
- Ilya Gurin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PHYSICAL QUANTITY SENSOR MANUFACTURING METHOD, PHYSICAL QUANTITY SE...
- Publication number 20180273375
- Publication date Sep 27, 2018
- SEIKO EPSON CORPORATION
- Satoru TANAKA
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20180215606
- Publication date Aug 2, 2018
- Mitsubishi Electric Corporation
- Yasuo YAMAGUCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Structure and Method of Forming Same
- Publication number 20180145612
- Publication date May 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi Heng Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIGITAL PATTERN GENERATOR HAVING CHARGE DRAIN COATING
- Publication number 20180037993
- Publication date Feb 8, 2018
- William M. Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Micromechanical Sensor and Method for Producing a Micromechanical S...
- Publication number 20170341927
- Publication date Nov 30, 2017
- ROBERT BOSCH GmbH
- Benny Pekka Herzogenrath
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE
- Publication number 20160272481
- Publication date Sep 22, 2016
- Kabushiki Kaisha Toshiba
- Hiroaki YAMAZAKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DISPLAY DEVICE AND METHOD FOR PRODUCING SAME
- Publication number 20160025963
- Publication date Jan 28, 2016
- Pixtronix, Inc.
- Naohisa Andou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE
- Publication number 20150368089
- Publication date Dec 24, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- KAZUO GODA
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Structures for avoiding electrostatic attraction

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods for providing getters in microelectromechanical...

Micro-electro-mechanical system (MEMS) thermal sensor

MEMS structure and method of forming same

Physical quantity sensor, electronic apparatus, and vehicle

Inertial sensor, electronic instrument, and vehicle

Semiconductor device and semiconductor device manufacturing method

Method for preparing silicon wafer with rough surface and silicon w...

Physical quantity sensor manufacturing method, physical quantity se...

Fence structure to prevent stiction in a MEMS motion sensor

MEMS element

Method for preparing silicon wafer with rough surface and silicon w...

Vibration device and method for controlling the same

MEMS device with reduced electric charge, cavity volume and stiction

Micro-electro-mechanical system (MEMS) thermal sensor

Physical quantity sensor manufacturing method, physical quantity se...

MEMS sensor compensation for off-axis movement

Systems, devices, and methods for reducing surface dielectric charg...

MEMS structure with bilayer stopper and method for forming the same

Fence structure to prevent stiction in a MEMS motion sensor

MEMS structure and method of forming same

MEMS sensor compensation for off-axis movement

Systems and methods for providing getters in microelectromechanical...

Micro-electro-mechanical system (MEMS) variable capacitor apparatus...

Micromechanical sensor and method for producing a micromechanical s...

Physical quantity sensor, electronic device, and moving object

System and method for a perpendicular electrode transducer

Digital pattern generator having charge drain coating

Micro-electro-mechanical system (MEMS) variable capacitor apparatus...

Physical quantity sensor, electronic device, and moving object

Methods for stiction reduction in MEMS sensors

Patents Applicationslast 30 patents

MEMS DEVICE AND METHOD FOR MANUFACTURING MEMS DEVICE

MEMS DEVICE AND METHOD OF MANUFACTURING MEMS DEVICE

MEMS DEVICE, METHOD FOR MANUFACTURING MEMS DEVICE AND ELECTRONIC DE...

Microelectromechanical Systems Die

Micro-Electro-Mechanical System (Mems) Thermal Sensor

MEMS Structure and Method of Forming Same

SYSTEMS AND METHODS FOR PROVIDING GETTERS IN MICROELECTROMECHANICAL...

SUBSTRATE AND MICROPHONE UNIT

METHOD FOR PREPARING SILICON WAFER WITH ROUGH SURFACE AND SILICON W...

FORMATION OF SELF-ASSEMBLED MONOLAYER FOR ULTRASONIC TRANSDUCERS

SYSTEMS, DEVICES, AND METHODS TO REDUCE DIELECTRIC CHARGING IN MICR...

MICRO-ELECTRO-MECHANICAL SYTEM (MEMS) THERMAL SENSOR

PHYSICAL QUANTITY SENSOR MANUFACTURING METHOD, PHYSICAL QUANTITY SE...

MEMS DEVICE WITH REDUCED ELECTRIC CHARGE, CAVITY VOLUME AND STICTION

FENCE STRUCTURE TO PREVENT STICTION IN A MEMS MOTION SENSOR

MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) THERMAL SENSOR

MEMS Structure and Method of Forming Same

MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) VARIABLE CAPACITOR APPARATUS...

MEMS SENSOR COMPENSATION FOR OFF-AXIS MOVEMENT

SYSTEMS AND METHODS FOR PROVIDING GETTERS IN MICROELECTROMECHANICAL...

VIBRATION DEVICE AND METHOD FOR CONTROLLING THE SAME

MEMS SENSOR COMPENSATION FOR OFF-AXIS MOVEMENT

PHYSICAL QUANTITY SENSOR MANUFACTURING METHOD, PHYSICAL QUANTITY SE...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

MEMS Structure and Method of Forming Same

DIGITAL PATTERN GENERATOR HAVING CHARGE DRAIN COATING

Micromechanical Sensor and Method for Producing a Micromechanical S...

MEMS DEVICE

DISPLAY DEVICE AND METHOD FOR PRODUCING SAME

MEMS DEVICE