Stud bumping

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CPC
H01L2224/1134

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/1134Stud bumping

Industries

Patents Grantslast 30 patents

Information Patent Grant
Light-emitting device and displayer
- Patent number 12,148,867
- Issue date Nov 19, 2024
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Kuai Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with encapsulant deposited along sides and sur...
- Patent number 12,094,729
- Issue date Sep 17, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Methods of manufacturing a semiconductor device including a joint a...
- Patent number 11,894,330
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 11,887,970
- Issue date Jan 30, 2024
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
- Patent number 11,881,476
- Issue date Jan 23, 2024
- Semtech Corporation
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bump of a semiconductor device and fabricating method th...
- Patent number 11,837,562
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having through silicon vias and manufacturing...
- Patent number 11,817,427
- Issue date Nov 14, 2023
- LONGITUDE LICENSING LIMITED
- Ryohei Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 11,810,867
- Issue date Nov 7, 2023
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing stacked semiconductor die assemblies with...
- Patent number 11,776,877
- Issue date Oct 3, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process and structure of fine pitch traces for a solid...
- Patent number 11,749,595
- Issue date Sep 5, 2023
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and method for reducing polymer layer...
- Patent number 11,688,728
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making wafer level chip scale pa...
- Patent number 11,676,938
- Issue date Jun 13, 2023
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,676,977
- Issue date Jun 13, 2023
- Sony Group Corporation
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded die substrate,...
- Patent number 11,652,088
- Issue date May 16, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for securing components of an integrated circuit
- Patent number 11,631,600
- Issue date Apr 18, 2023
- Cerebras Systems Inc.
- Jean-Philippe Fricker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process and structure of fine pitch traces for a solid...
- Patent number 11,594,509
- Issue date Feb 28, 2023
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,569,190
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,532,736
- Issue date Dec 20, 2022
- Murata Manufacturing Co., Ltd.
- Yasunari Umemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded wafer level chi...
- Patent number 11,488,933
- Issue date Nov 1, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip integration module, chip package structure, and chip integrati...
- Patent number 11,462,520
- Issue date Oct 4, 2022
- Huawei Technologies Co., Ltd.
- HuiLi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 11,462,483
- Issue date Oct 4, 2022
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 11,373,979
- Issue date Jun 28, 2022
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
- Patent number 11,373,990
- Issue date Jun 28, 2022
- Semtech Corporation
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,315,970
- Issue date Apr 26, 2022
- Sony Corporation
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package
- Patent number 11,289,346
- Issue date Mar 29, 2022
- Siliconware Precision Industries Co., Ltd.
- Chen-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect crack arrestor structure and methods
- Patent number 11,257,767
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with encapsulant deposited along sides and sur...
- Patent number 11,222,793
- Issue date Jan 11, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and manufacturing method
- Patent number 11,217,548
- Issue date Jan 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Guo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having through silicon vias and manufacturing...
- Patent number 11,211,363
- Issue date Dec 28, 2021
- LONGITUDE LICENSING LIMITED
- Ryohei Kitada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLIP CONNECTION STRUCTURE, ROOM-TEMPERATURE FLIP CONNECTION STRUCTU...
- Publication number 20240145428
- Publication date May 2, 2024
- Sony Semiconductor Solutions Corporation
- KAZUHIDE TERAHATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20240047376
- Publication date Feb 8, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20230395463
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20230059375
- Publication date Feb 23, 2023
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Wafer Level Chi...
- Publication number 20230012958
- Publication date Jan 19, 2023
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220231061
- Publication date Jul 21, 2022
- SONY GROUP CORPORATION
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light-Emitting Device and Displayer
- Publication number 20220231206
- Publication date Jul 21, 2022
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Kuai QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Through Silicon Vias and Manufacturing...
- Publication number 20220102318
- Publication date Mar 31, 2022
- Ryohei Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Encapsulant Deposited Along Sides and Sur...
- Publication number 20220093417
- Publication date Mar 24, 2022
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20220013434
- Publication date Jan 13, 2022
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Structure and Method for Reducing Polymer Layer...
- Publication number 20210351173
- Publication date Nov 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210210450
- Publication date Jul 8, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-LIN LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210184022
- Publication date Jun 17, 2021
- Murata Manufacturing Co., Ltd.
- Yasunari UMEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication Process and Structure of Fine Pitch Traces for a Solid...
- Publication number 20210159203
- Publication date May 27, 2021
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210091031
- Publication date Mar 25, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-LIN LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures and Methods of Forming Same
- Publication number 20200343209
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Wafer Level Chi...
- Publication number 20200335478
- Publication date Oct 22, 2020
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20200335447
- Publication date Oct 22, 2020
- Siliconware Precision Industries Co., Ltd.
- Chen-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200286846
- Publication date Sep 10, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-LIN LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Through Silicon Vias and Manufacturing...
- Publication number 20200273846
- Publication date Aug 27, 2020
- Ryohei Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20200118939
- Publication date Apr 16, 2020
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Encapsulant Deposited Along Sides and Sur...
- Publication number 20200090954
- Publication date Mar 19, 2020
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPILLARY TRANSPORT DEVICE, CAPILLARY MOUNTING DEVICE, CAPILLARY RE...
- Publication number 20200091107
- Publication date Mar 19, 2020
- KAIJO CORPORATION
- Go TAKEMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fabrication Process and Structure of Fine Pitch Traces for a Solid...
- Publication number 20200035594
- Publication date Jan 30, 2020
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hollow Metal Pillar Packaging Scheme
- Publication number 20190341377
- Publication date Nov 7, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190333887
- Publication date Oct 31, 2019
- Murata Manufacturing Co., Ltd.
- Yasunari UMEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STACKING FOR INTEGRATED CIRCUIT MANUFACTURING
- Publication number 20190326190
- Publication date Oct 24, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Crack Arrestor Structure and Methods
- Publication number 20190326228
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures and Methods of Forming Same
- Publication number 20190244920
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190164859
- Publication date May 30, 2019
- Advanced Semiconductor Engineering, Inc.
- Tsan-Hsien CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Stud bumping

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light-emitting device and displayer

Semiconductor device with encapsulant deposited along sides and sur...

Multiple plated via arrays of different wire heights on a same subs...

Methods of manufacturing a semiconductor device including a joint a...

Stacked microfeature devices and associated methods

Semiconductor device and method of stacking semiconductor die for s...

Conductive bump of a semiconductor device and fabricating method th...

Semiconductor device having through silicon vias and manufacturing...

Wire bond wires for interference shielding

Methods of manufacturing stacked semiconductor die assemblies with...

Fabrication process and structure of fine pitch traces for a solid...

Integrated circuit structure and method for reducing polymer layer...

Semiconductor device and method of making wafer level chip scale pa...

Semiconductor device

Semiconductor device and method of forming embedded die substrate,...

Apparatus and method for securing components of an integrated circuit

Fabrication process and structure of fine pitch traces for a solid...

Semiconductor structure and manufacturing method thereof

Semiconductor device

Semiconductor device and method of forming embedded wafer level chi...

Chip integration module, chip package structure, and chip integrati...

Wire bond wires for interference shielding

Stacked microfeature devices and associated methods

Semiconductor device and method of stacking semiconductor die for s...

Semiconductor device and method of manufacturing the same

Method for fabricating electronic package

Interconnect crack arrestor structure and methods

Semiconductor device with encapsulant deposited along sides and sur...

Semiconductor device structure and manufacturing method

Semiconductor device having through silicon vias and manufacturing...

Patents Applicationslast 30 patents

FLIP CONNECTION STRUCTURE, ROOM-TEMPERATURE FLIP CONNECTION STRUCTU...

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

Semiconductor Device and Method of Forming Embedded Wafer Level Chi...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Light-Emitting Device and Displayer

Semiconductor Device Having Through Silicon Vias and Manufacturing...

Semiconductor Device with Encapsulant Deposited Along Sides and Sur...

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

Integrated Circuit Structure and Method for Reducing Polymer Layer...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

Fabrication Process and Structure of Fine Pitch Traces for a Solid...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Interconnect Structures and Methods of Forming Same

Semiconductor Device and Method of Forming Embedded Wafer Level Chi...

METHOD FOR FABRICATING ELECTRONIC PACKAGE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor Device Having Through Silicon Vias and Manufacturing...

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

Semiconductor Device with Encapsulant Deposited Along Sides and Sur...

CAPILLARY TRANSPORT DEVICE, CAPILLARY MOUNTING DEVICE, CAPILLARY RE...

Fabrication Process and Structure of Fine Pitch Traces for a Solid...

Hollow Metal Pillar Packaging Scheme

SEMICONDUCTOR DEVICE

WAFER STACKING FOR INTEGRATED CIRCUIT MANUFACTURING

Interconnect Crack Arrestor Structure and Methods

Interconnect Structures and Methods of Forming Same

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME