Supplying the plurality of semiconductor or solid-state bodies

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H01L2224/951

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/951Supplying the plurality of semiconductor or solid-state bodies

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Pixel and display device including the same
- Patent number 12,283,582
- Issue date Apr 22, 2025
- Samsung Display Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using semiconductor light-emitting elements, and man...
- Patent number 12,278,221
- Issue date Apr 15, 2025
- LG Electronics Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Full-color LED display using ultra-thin LED element and method for...
- Patent number 12,266,740
- Issue date Apr 1, 2025
- Kookmin University Industry Academy Cooperation Foundation
- Young Rag Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including dummy pattern on bank
- Patent number 12,261,160
- Issue date Mar 25, 2025
- Samsung Display Co., Ltd.
- Ki Hoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level packaging of semiconductor devices
- Patent number 12,261,084
- Issue date Mar 25, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- George Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring micro LED
- Patent number 12,255,193
- Issue date Mar 18, 2025
- Industry-University Cooperation Foundation Hanyang University Erica Campus
- Jaekyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro LED, and manufacturing method therefor
- Patent number 12,243,861
- Issue date Mar 4, 2025
- LG Electronics Inc.
- Dohan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device with improved alignment of light emitting elements,...
- Patent number 12,243,877
- Issue date Mar 4, 2025
- Samsung Display Co., Ltd.
- Se Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluidic assembly encapsulating light emitting diodes
- Patent number 12,230,743
- Issue date Feb 18, 2025
- ehux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro-LED, and manufacturing method therefor
- Patent number 12,230,617
- Issue date Feb 18, 2025
- LG Electronics Inc.
- Bongchu Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and manufacturing method therefor
- Patent number 12,224,384
- Issue date Feb 11, 2025
- Samsung Display Co., Ltd.
- Moon Jung An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for manufacturing same
- Patent number 12,218,299
- Issue date Feb 4, 2025
- Samsung Display Co., Ltd.
- Chang Il Tae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of transferring micro-light emitting diode for LED display
- Patent number 12,205,931
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro LED, and manufacturing method therefor
- Patent number 12,183,866
- Issue date Dec 31, 2024
- LG Electronics Inc.
- Hwanjoon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display panel, display panel, and display...
- Patent number 12,176,334
- Issue date Dec 24, 2024
- Shanghai Tianma Micro-Electronics Co., Ltd.
- Canyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro light emitting device array and method of manufacturing the s...
- Patent number 12,166,021
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems of forming metal interconnect layers using engi...
- Patent number 12,165,881
- Issue date Dec 10, 2024
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Single-shot encapsulation
- Patent number 12,166,001
- Issue date Dec 10, 2024
- Semtech Corporation
- Kok Khoon Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode and display apparatus having the same
- Patent number 12,159,861
- Issue date Dec 3, 2024
- SEOUL VIOSYS CO., LTD.
- Seong Kyu Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and display device including rod shaped light...
- Patent number 12,155,018
- Issue date Nov 26, 2024
- Samsung Display Co., Ltd.
- Young Rag Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for manufacturing display device
- Patent number 12,155,022
- Issue date Nov 26, 2024
- Samsung Display Co., Ltd.
- Young Rag Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shift control method in manufacture of semiconductor device
- Patent number 12,148,733
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of fabricating the same
- Patent number 12,125,834
- Issue date Oct 22, 2024
- Samsung Display Co., Ltd.
- Bek Hyun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated light emitting diodes for selective fluidic assembly
- Patent number 12,119,432
- Issue date Oct 15, 2024
- eLux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ink leveling device and method of manufacturing display device usin...
- Patent number 12,113,047
- Issue date Oct 8, 2024
- Samsung Display Co., Ltd.
- Jung Hyun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of micro light-emitting device and method of transferring...
- Patent number 12,113,150
- Issue date Oct 8, 2024
- Korea University Research and Business Foundation
- In Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of chip transferring and device/module having gas guiding st...
- Patent number 12,106,981
- Issue date Oct 1, 2024
- MICRAFT SYSTEM PLUS CO., LTD.
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using semiconductor light-emitting elements and manu...
- Patent number 12,080,689
- Issue date Sep 3, 2024
- LG Electronics Inc.
- Dohee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having an intermediate electrode between sub-areas a...
- Patent number 12,074,171
- Issue date Aug 27, 2024
- Samsung Display Co., Ltd.
- Won Sik Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding apparatus and securing assembly therefor
- Patent number 12,074,133
- Issue date Aug 27, 2024
- GUANGZHOU AIFO LIGHT COMMUNICATION TECHNOLOGY COMPANY LTD.
- Guoqiang Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AN...
- Publication number 20250132286
- Publication date Apr 24, 2025
- Yibu Semiconductor Co., Ltd.
- Wenqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERHYDROPHOBIC SURFACES FOR LIQUID CONTAINMENT IN SELF-ALIGNMENT...
- Publication number 20250112185
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20250096060
- Publication date Mar 20, 2025
- MICROCHIP TECHNOLOGY INCORPORATED
- Mankit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE, DISPLAY DEVICE COMPRISING SAME, AND METHOD F...
- Publication number 20250089411
- Publication date Mar 13, 2025
- SAMSUNG DISPLAY CO., LTD.
- Young Rag DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250087592
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Geng-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDING APPARATUS AND ARTICLE MANUFACTURING METHOD
- Publication number 20250079397
- Publication date Mar 6, 2025
- Canon Kabushiki Kaisha
- SHUN TOKAIRIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods And Systems Of Forming Metal Interconnect Layers Using Engi...
- Publication number 20250069900
- Publication date Feb 27, 2025
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LIGHT EMITTING DIODE AND DISPLAY APPARATUS HAVING THE SAME
- Publication number 20250062295
- Publication date Feb 20, 2025
- Seoul Viosys Co., Ltd.
- Seong Kyu JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE CARTRIDGE STRUCTURE
- Publication number 20250046752
- Publication date Feb 6, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BALL ATTACHMENT SYSTEM AND METHOD FOR PREVENTING WARPAGE
- Publication number 20250022826
- Publication date Jan 16, 2025
- PEP INNOVATION PTE LTD.
- Hwee Seng CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429198
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR SELF-ALIGNING BATCH PICK AND PLACE DIE BO...
- Publication number 20240429199
- Publication date Dec 26, 2024
- Intel Corporation
- Yi Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PANEL-LEVEL SEMICONDUCTOR PACKAGING METHOD
- Publication number 20240404974
- Publication date Dec 5, 2024
- PEP INNOVATION PTE LTD.
- Munirathinam Senthil Kumar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE
- Publication number 20240379617
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING ELEMENT, AND MANU...
- Publication number 20240266329
- Publication date Aug 8, 2024
- LG ELECTRONICS INC.
- Junoh SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ASSEMBLY DONOR AND METHOD FOR MANUFACTURING DISPLAY DEVICE USI...
- Publication number 20240258270
- Publication date Aug 1, 2024
- LG Display Co., Ltd.
- Sunghwan YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNET UNIT OF SEMICONDUCTOR LIGHT EMITTING DEVICE FOR DISPLAY PIXE...
- Publication number 20240128401
- Publication date Apr 18, 2024
- LG ELECTRONICS INC.
- Yangwoo BYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE ARRANGEMENT IN DONOR SUBSTRATE
- Publication number 20240096684
- Publication date Mar 21, 2024
- VueReal Inc.
- Gholamreza Chaji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING A PACKAGE STRUCTURE
- Publication number 20240088091
- Publication date Mar 14, 2024
- Advanced Semiconductor Engineering, Inc.
- Yu-Lin Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240072230
- Publication date Feb 29, 2024
- InnoLux Corporation
- Shun-Yuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE FOR DISPLAY PIXEL AND DISPLAY D...
- Publication number 20240030182
- Publication date Jan 25, 2024
- LG ELECTRONICS INC.
- Wonjae CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND METHOD FOR FABRICATING CHIP ASSEMBLY
- Publication number 20240006373
- Publication date Jan 4, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YOU-WEI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20230402428
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...
- Publication number 20230402442
- Publication date Dec 14, 2023
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Canyuan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TRANSFERRING MICRO-LIGHT EMITTING DIODE FOR LED DISPLAY
- Publication number 20230395575
- Publication date Dec 7, 2023
- Samsung Electronics Co., Ltd.
- Kyungwook HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE AND DISPLAY DEVICE COMPRISING THE SAME
- Publication number 20230395762
- Publication date Dec 7, 2023
- LG ELECTRONICS INC.
- Sunghyun HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH REGISTRATION PARTICLES-TRANSFERRING SYSTEM
- Publication number 20230366093
- Publication date Nov 16, 2023
- Xerox Corporation
- Yunda Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS AND SYSTEMS OF FORMING METAL INTERCONNECT LAYERS USING ENGI...
- Publication number 20230369065
- Publication date Nov 16, 2023
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SELF-ASSEMBLY DEVICE
- Publication number 20230361077
- Publication date Nov 9, 2023
- LG ELECTRONICS INC.
- Byungjun KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING ELEMENT
- Publication number 20230307598
- Publication date Sep 28, 2023
- LG ELECTRONICS INC.
- Sungyun PARK
- H01 - BASIC ELECTRIC ELEMENTS

Supplying the plurality of semiconductor or solid-state bodies

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Pixel and display device including the same

Display device using semiconductor light-emitting elements, and man...

Full-color LED display using ultra-thin LED element and method for...

Display device including dummy pattern on bank

Fan-out wafer level packaging of semiconductor devices

Method for transferring micro LED

Display device using micro LED, and manufacturing method therefor

Display device with improved alignment of light emitting elements,...

Fluidic assembly encapsulating light emitting diodes

Display device using micro-LED, and manufacturing method therefor

Display device and manufacturing method therefor

Display device and method for manufacturing same

Method of transferring micro-light emitting diode for LED display

Display device using micro LED, and manufacturing method therefor

Method for manufacturing display panel, display panel, and display...

Micro light emitting device array and method of manufacturing the s...

Methods and systems of forming metal interconnect layers using engi...

Single-shot encapsulation

Light emitting diode and display apparatus having the same

Light-emitting device and display device including rod shaped light...

Display device and method for manufacturing display device

Shift control method in manufacture of semiconductor device

Display device and method of fabricating the same

Encapsulated light emitting diodes for selective fluidic assembly

Ink leveling device and method of manufacturing display device usin...

Structure of micro light-emitting device and method of transferring...

Method of chip transferring and device/module having gas guiding st...

Display device using semiconductor light-emitting elements and manu...

Display device having an intermediate electrode between sub-areas a...

Chip bonding apparatus and securing assembly therefor

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AN...

SUPERHYDROPHOBIC SURFACES FOR LIQUID CONTAINMENT IN SELF-ALIGNMENT...

INTEGRATED CIRCUIT DEVICE

LIGHT-EMITTING DEVICE, DISPLAY DEVICE COMPRISING SAME, AND METHOD F...

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

BONDING METHOD, BONDING APPARATUS AND ARTICLE MANUFACTURING METHOD

Methods And Systems Of Forming Metal Interconnect Layers Using Engi...

LIGHT EMITTING DIODE AND DISPLAY APPARATUS HAVING THE SAME

MICRODEVICE CARTRIDGE STRUCTURE

SOLDER BALL ATTACHMENT SYSTEM AND METHOD FOR PREVENTING WARPAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHODS AND APPARATUS FOR SELF-ALIGNING BATCH PICK AND PLACE DIE BO...

PANEL-LEVEL SEMICONDUCTOR PACKAGING METHOD

SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE

DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING ELEMENT, AND MANU...

SELF-ASSEMBLY DONOR AND METHOD FOR MANUFACTURING DISPLAY DEVICE USI...

MAGNET UNIT OF SEMICONDUCTOR LIGHT EMITTING DEVICE FOR DISPLAY PIXE...

MICRO DEVICE ARRANGEMENT IN DONOR SUBSTRATE

METHOD FOR MANUFACTURING A PACKAGE STRUCTURE

ELECTRONIC DEVICE

SEMICONDUCTOR LIGHT EMITTING DEVICE FOR DISPLAY PIXEL AND DISPLAY D...

PACKAGE SUBSTRATE AND METHOD FOR FABRICATING CHIP ASSEMBLY

METHOD OF FORMING PACKAGE STRUCTURE

METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...

METHOD OF TRANSFERRING MICRO-LIGHT EMITTING DIODE FOR LED DISPLAY

LIGHT EMITTING DIODE AND DISPLAY DEVICE COMPRISING THE SAME

HIGH REGISTRATION PARTICLES-TRANSFERRING SYSTEM

METHODS AND SYSTEMS OF FORMING METAL INTERCONNECT LAYERS USING ENGI...

SELF-ASSEMBLY DEVICE

DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING ELEMENT