Surface mounted components

Industry

CPC
H05K3/303

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/303Surface mounted components

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic device and manufacturing method thereof
- Patent number 12,176,615
- Issue date Dec 24, 2024
- Kore Semiconductor Co., Ltd.
- Ying-Chieh Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency and high power thin film component
- Patent number 12,177,960
- Issue date Dec 24, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component and method for manufacturing a component
- Patent number 12,177,986
- Issue date Dec 24, 2024
- TDK ELECTRONICS AG
- Jan Ihle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly and method for thermal balancing of surfacemoun...
- Patent number 12,171,056
- Issue date Dec 17, 2024
- MELLANOX TECHNOLOGIES LTD.
- Igor Loiferman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 12,156,337
- Issue date Nov 26, 2024
- Dai Nippon Printing Co., Ltd.
- Seiji Take
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal wearable battery and system
- Patent number 12,114,426
- Issue date Oct 8, 2024
- Inventus Power, Inc.
- Elijah Brett Goldin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive assembly, camera module and manufacturing method the...
- Patent number 12,081,849
- Issue date Sep 3, 2024
- NINGBO SUNNY OPOTECH CO., LTD.
- Zhongyu Luan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Ceramic electronic component, circuit substrate arrangement, and me...
- Patent number 12,068,115
- Issue date Aug 20, 2024
- Taiyo Yuden Co., Ltd.
- Anju Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging design for a flow sensor and methods of manufacturing the...
- Patent number 12,061,103
- Issue date Aug 13, 2024
- Applied Materials, Inc.
- Srikanth Krishnamurthy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board with embedded coil and position sensor
- Patent number 12,063,742
- Issue date Aug 13, 2024
- Apple Inc.
- Sai Harsha Jandhyala
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Control device and manufacturing method of control device
- Patent number 12,058,820
- Issue date Aug 6, 2024
- Yazaki Corporation
- Hayato Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid transformers for power supplies
- Patent number 12,057,255
- Issue date Aug 6, 2024
- Acleap Power Inc.
- Arturo Silva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed, efficient SiC power module
- Patent number 12,046,998
- Issue date Jul 23, 2024
- Wolfspeed, Inc.
- Mrinal K. Das
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power semiconductor module arrangement and method for producing a p...
- Patent number 12,041,755
- Issue date Jul 16, 2024
- Infineon Technologies AG
- Regina Nottelmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical light emitting device, manufacturing method thereof, and op...
- Patent number 12,038,140
- Issue date Jul 16, 2024
- Japan Display Inc.
- Tomoyuki Ishihara
- F21 - LIGHTING
Information Patent Grant
Stackable via package and method
- Patent number 12,035,472
- Issue date Jul 9, 2024
- Amkor Technology Singapore Holding Ptd. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing electronic components connected to a circuit board
- Patent number 12,023,756
- Issue date Jul 2, 2024
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transfer printing high-precision devices
- Patent number 12,016,131
- Issue date Jun 18, 2024
- X Display Company Technology Limited
- Matthew Alexander Meitl
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Protective enclosure for an electronic device
- Patent number 12,016,111
- Issue date Jun 18, 2024
- Western Digital Technologies, Inc.
- Chun Sean Lau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflow furnace
- Patent number 12,013,185
- Issue date Jun 18, 2024
- Illinois Tool Works Inc.
- Yuwei Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic-based circuit board assemblies formed using metal nanoparti...
- Patent number 12,016,118
- Issue date Jun 18, 2024
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrating system in package (SiP) with input/output (IO) board fo...
- Patent number 12,002,793
- Issue date Jun 4, 2024
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power supply apparatus
- Patent number 11,996,225
- Issue date May 28, 2024
- TDK Corporation
- Akihiko Hirokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly having circuit board with adjacent chips imm...
- Patent number 11,984,391
- Issue date May 14, 2024
- Auradine, Inc.
- Anuya Reddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical arrangements for sensor assemblies in electromagnetic na...
- Patent number 11,980,724
- Issue date May 14, 2024
- Boston Scientific Scimed, Inc.
- Steven J. Meyer
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Electronic component, electric device including the same, and bondi...
- Patent number 11,979,987
- Issue date May 7, 2024
- Samsung Display Co., Ltd.
- Han-Sung Bae
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method of manufacturing a three-dimensional electronic module havin...
- Patent number 11,974,399
- Issue date Apr 30, 2024
- Yuriy Borisovich Sokolov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring board with a meandering shape section
- Patent number 11,968,777
- Issue date Apr 23, 2024
- Dai Nippon Printing Co., Ltd.
- Kenichi Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fixing belt of wearable device, method for manufacturing the same,...
- Patent number 11,968,788
- Issue date Apr 23, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Yong-Quan Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printing components to substrate posts
- Patent number 11,950,375
- Issue date Apr 2, 2024
- X Display Company Technology Limited
- David Gomez
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL CIRCUIT FORMING METHOD AND ELECTRICAL CIRCUIT FORMING AP...
- Publication number 20240422917
- Publication date Dec 19, 2024
- FUJI CORPORATION
- Kenji TSUKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT-FORMING METHOD AND CIRCUIT-FORMING APPARATUS
- Publication number 20240422916
- Publication date Dec 19, 2024
- FUJI CORPORATION
- Kenji TSUKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATELESS HYBRID POWER MODULE ASSEMBLY AND METHOD FOR FABRICATI...
- Publication number 20240389237
- Publication date Nov 21, 2024
- IndiaVPSemiconductor Pvt Ltd.
- VIJAY BOLLOJU BOLLOJU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH SPEED, EFFICIENT SIC POWER MODULE
- Publication number 20240380320
- Publication date Nov 14, 2024
- Wolfspeed, Inc.
- Mrinal K. DAS
- B60 - VEHICLES IN GENERAL
Information Patent Application
PACKAGING DESIGN FOR A FLOW SENSOR AND METHODS OF MANUFACTURING THE...
- Publication number 20240369389
- Publication date Nov 7, 2024
- Applied Materials, Inc.
- Srikanth Krishnamurthy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCU...
- Publication number 20240365464
- Publication date Oct 31, 2024
- Canon Kabushiki Kaisha
- HIROYUKI YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID TRANSFORMERS FOR POWER SUPPLIES
- Publication number 20240355534
- Publication date Oct 24, 2024
- AcLeap Power Inc.
- Arturo Silva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTING COMPONENTS TO SUBSTRATE POSTS
- Publication number 20240349431
- Publication date Oct 17, 2024
- X Display Company Technology Limited
- David Gomez
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
REFLOW FURNACE
- Publication number 20240344771
- Publication date Oct 17, 2024
- Illinois Tool Works Inc.
- Yuwei WANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BGA Element Self-Alignment Structure and Alignment Method
- Publication number 20240334592
- Publication date Oct 3, 2024
- SHENZHEN SIPTORY TECHNOLOGY CO., LTD
- Dongdong Shao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSFER PRINTING HIGH-PRECISION DEVICES
- Publication number 20240292543
- Publication date Aug 29, 2024
- X Display Company Technology Limited
- Matthew Alexander Meitl
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
CERAMIC-BASED CIRCUIT BOARD ASSEMBLIES FORMED USING METAL NANOPARTI...
- Publication number 20240292531
- Publication date Aug 29, 2024
- Kuprion Inc.
- Alfred A. ZINN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...
- Publication number 20240284594
- Publication date Aug 22, 2024
- SAMSUNG DISPLAY CO., LTD.
- Han-Sung BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNT CONSTRUCTED MILLIMETER WAVE TRANSCEIVER DEVICE AND ME...
- Publication number 20240250398
- Publication date Jul 25, 2024
- Vubiq Networks, Inc.
- Michael Gregory PETTUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conformal Wearable Battery
- Publication number 20240224424
- Publication date Jul 4, 2024
- Inventus Power, Inc.
- Paul John Kudrna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE ARRAY WITH PRECISE POSITION ASSEMBLY FOR AUTOM...
- Publication number 20240206072
- Publication date Jun 20, 2024
- Lumileds LLC
- Say Chun OOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240121899
- Publication date Apr 11, 2024
- InnoLux Corporation
- Chin-Cheng Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELF-EQUALIZING FRAME FOR THERMAL MANAGEMENT DEVICE PRELOAD
- Publication number 20240121932
- Publication date Apr 11, 2024
- Cisco Technology, Inc.
- Robert Gregory Twiss
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PIN-FIN COOLING FOR PRINTED CIRCUIT BOARDS (PCBS)
- Publication number 20240098878
- Publication date Mar 21, 2024
- Raytheon Technologies Corporation
- Yongduk Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL LIGHT EMITTING DEVICE, MANUFACTURING METHOD THEREOF, AND OP...
- Publication number 20240044458
- Publication date Feb 8, 2024
- Japan Display Inc.
- Tomoyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conformal Wearable Battery
- Publication number 20240023244
- Publication date Jan 18, 2024
- Inventus Power, Inc.
- Elijah Brett Goldin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING CIRCUITS OF SUBSTRATE OF DISPLAY DEVICE
- Publication number 20240015891
- Publication date Jan 11, 2024
- TCL China Star Optoelectronics Technology Co., Ltd.
- Tong Deng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Battery Management System
- Publication number 20240014678
- Publication date Jan 11, 2024
- Holding Zero, LLC
- Derek Simkowiak
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ELECTRONIC ASSEMBLY AND METHOD FOR THERMAL BALANCING OF SURFACEMOUN...
- Publication number 20230413417
- Publication date Dec 21, 2023
- MELLANOX TECHNOLOGIES LTD.
- Igor LOIFERMAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC-COMPONENT-EQUIPPED CIRCUIT BOARD
- Publication number 20230380075
- Publication date Nov 23, 2023
- Murata Manufacturing Co., Ltd.
- Kenji MATSUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERLACED CROSSTALK CONTROLLED TRACES, VIAS, AND CAPACITORS
- Publication number 20230371169
- Publication date Nov 16, 2023
- Cisco Technology, Inc.
- Shadi Ebrahimi Asl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER REGULATOR INTERFACES FOR INTEGRATED CIRCUITS
- Publication number 20230363093
- Publication date Nov 9, 2023
- NVIDIA Corp.
- MingYi Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKABLE VIA PACKAGE AND METHOD
- Publication number 20230354523
- Publication date Nov 2, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL CONNECTION BETWEEN PRINTED CIRCUIT BOARD AND BASE PLATE WIT...
- Publication number 20230352861
- Publication date Nov 2, 2023
- Vitesco Technologies USA, LLC
- Uwe Stephan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE ENCLOSURE FOR AN ELECTRONIC DEVICE
- Publication number 20230345614
- Publication date Oct 26, 2023
- Western Digital Technologies, Inc.
- Chun Sean Lau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Surface mounted components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device and manufacturing method thereof

High frequency and high power thin film component

Component and method for manufacturing a component

Electronic assembly and method for thermal balancing of surfacemoun...

Wiring board and method for manufacturing wiring board

Conformal wearable battery and system

Photosensitive assembly, camera module and manufacturing method the...

Ceramic electronic component, circuit substrate arrangement, and me...

Packaging design for a flow sensor and methods of manufacturing the...

Printed circuit board with embedded coil and position sensor

Control device and manufacturing method of control device

Hybrid transformers for power supplies

High speed, efficient SiC power module

Power semiconductor module arrangement and method for producing a p...

Optical light emitting device, manufacturing method thereof, and op...

Stackable via package and method

Method for removing electronic components connected to a circuit board

Transfer printing high-precision devices

Protective enclosure for an electronic device

Reflow furnace

Ceramic-based circuit board assemblies formed using metal nanoparti...

Integrating system in package (SiP) with input/output (IO) board fo...

Power supply apparatus

Circuit board assembly having circuit board with adjacent chips imm...

Electrical arrangements for sensor assemblies in electromagnetic na...

Electronic component, electric device including the same, and bondi...

Method of manufacturing a three-dimensional electronic module havin...

Method for manufacturing wiring board with a meandering shape section

Fixing belt of wearable device, method for manufacturing the same,...

Printing components to substrate posts

Patents Applicationslast 30 patents

ELECTRICAL CIRCUIT FORMING METHOD AND ELECTRICAL CIRCUIT FORMING AP...

CIRCUIT-FORMING METHOD AND CIRCUIT-FORMING APPARATUS

SUBSTRATELESS HYBRID POWER MODULE ASSEMBLY AND METHOD FOR FABRICATI...

HIGH SPEED, EFFICIENT SIC POWER MODULE

PACKAGING DESIGN FOR A FLOW SENSOR AND METHODS OF MANUFACTURING THE...

CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCU...

HYBRID TRANSFORMERS FOR POWER SUPPLIES

PRINTING COMPONENTS TO SUBSTRATE POSTS

REFLOW FURNACE

BGA Element Self-Alignment Structure and Alignment Method

TRANSFER PRINTING HIGH-PRECISION DEVICES

CERAMIC-BASED CIRCUIT BOARD ASSEMBLIES FORMED USING METAL NANOPARTI...

ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...

SURFACE MOUNT CONSTRUCTED MILLIMETER WAVE TRANSCEIVER DEVICE AND ME...

Conformal Wearable Battery

LIGHT-EMITTING DIODE ARRAY WITH PRECISE POSITION ASSEMBLY FOR AUTOM...

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

SELF-EQUALIZING FRAME FOR THERMAL MANAGEMENT DEVICE PRELOAD

PIN-FIN COOLING FOR PRINTED CIRCUIT BOARDS (PCBS)

OPTICAL LIGHT EMITTING DEVICE, MANUFACTURING METHOD THEREOF, AND OP...

Conformal Wearable Battery

METHOD OF PRODUCING CIRCUITS OF SUBSTRATE OF DISPLAY DEVICE

Battery Management System

ELECTRONIC ASSEMBLY AND METHOD FOR THERMAL BALANCING OF SURFACEMOUN...

CIRCUIT BOARD AND ELECTRONIC-COMPONENT-EQUIPPED CIRCUIT BOARD

INTERLACED CROSSTALK CONTROLLED TRACES, VIAS, AND CAPACITORS

POWER REGULATOR INTERFACES FOR INTEGRATED CIRCUITS

STACKABLE VIA PACKAGE AND METHOD

THERMAL CONNECTION BETWEEN PRINTED CIRCUIT BOARD AND BASE PLATE WIT...

PROTECTIVE ENCLOSURE FOR AN ELECTRONIC DEVICE