Tantalum [Ta] as principal constituent

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H01L2224/13681

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13681Tantalum [Ta] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Industrial chip scale package for microelectronic device
- Patent number 11,749,616
- Issue date Sep 5, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming post-passivation interconnect structure
- Patent number 11,257,775
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 10,818,629
- Issue date Oct 27, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Advanced through substrate via metallization in three dimensional s...
- Patent number 10,396,013
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced through substrate via metallization in three dimensional s...
- Patent number 10,396,012
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming post-passivation interconnect structure
- Patent number 10,340,240
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 10,103,121
- Issue date Oct 16, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Visibility event navigation method and system
- Patent number 9,916,763
- Issue date Mar 13, 2018
- PRIMAL SPACE SYSTEMS, INC.
- Barry L. Jenkins
- G05 - CONTROLLING REGULATING
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 9,842,819
- Issue date Dec 12, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 9,698,088
- Issue date Jul 4, 2017
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming post-passivation interconnect structure
- Patent number 9,620,469
- Issue date Apr 11, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a conducting contact on a conducting element
- Patent number 9,224,708
- Issue date Dec 29, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean-Philippe Colonna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective layer for protecting TSV tips during thermo-compressive...
- Patent number 8,723,330
- Issue date May 13, 2014
- Texas Instruments Incorporated
- Jeffrey A West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV pillar as an interconnecting structure
- Patent number 8,691,691
- Issue date Apr 8, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective layer for protecting TSV tips during thermo-compressive...
- Patent number 8,623,763
- Issue date Jan 7, 2014
- Texas Instruments Incorporated
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional (3D) integrated circuit with enhanced copper-to-c...
- Patent number 8,546,956
- Issue date Oct 1, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional (3D) integrated circuit with enhanced copper-to-c...
- Patent number 8,431,436
- Issue date Apr 30, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding semiconductor devices
- Patent number 7,186,637
- Issue date Mar 6, 2007
- Intel Corporation
- Grant Kloster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming dual height solder interconnections
- Patent number 5,251,806
- Issue date Oct 12, 1993
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder mass having conductive encapsulating arrangement
- Patent number 5,130,779
- Issue date Jul 14, 1992
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE
- Publication number 20240162163
- Publication date May 16, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM
- Publication number 20200273354
- Publication date Aug 27, 2020
- PRIMAL SPACE SYSTEMS, INC.
- Barry L. JENKINS
- G05 - CONTROLLING REGULATING
Information Patent Application
VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM
- Publication number 20190236964
- Publication date Aug 1, 2019
- PRIMAL SPACE SYSTEMS, INC.
- Barry L. JENKINS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TALL AND FINE PITCH INTERCONNECTS
- Publication number 20190013287
- Publication date Jan 10, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM
- Publication number 20180268724
- Publication date Sep 20, 2018
- PRIMAL SPACE SYSTEMS, INC.
- Barry L. JENKINS
- G08 - SIGNALLING
Information Patent Application
Tall and Fine Pitch Interconnects
- Publication number 20180096960
- Publication date Apr 5, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TALL AND FINE PITCH INTERCONNECTS
- Publication number 20170053886
- Publication date Feb 23, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Batch-Packaging Low Pin Count Embedded Semi...
- Publication number 20160005705
- Publication date Jan 7, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Mutsumi Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE LAYER FOR PROTECTING TSV TIPS DURING THERMO-COMPRESSIVE...
- Publication number 20130249098
- Publication date Sep 26, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...
- Publication number 20130200520
- Publication date Aug 8, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...
- Publication number 20130113106
- Publication date May 9, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chips and Semiconductor Packages and Methods of Fabri...
- Publication number 20130075905
- Publication date Mar 28, 2013
- SAMSUNG ELECTRONICS CO., LTD.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV PILLAR AS AN INTERCONNECTING STRUCTURE
- Publication number 20130026606
- Publication date Jan 31, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE LAYER FOR PROTECTING TSV TIPS DURING THERMO-COMPRESSIVE...
- Publication number 20120306085
- Publication date Dec 6, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20120299197
- Publication date Nov 29, 2012
- Samsung Electronics Co., Ltd.
- Heungkyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP AND SEMICONDUCTOR DEVICE HAVING THE SAME
- Publication number 20120205797
- Publication date Aug 16, 2012
- Hynix Semiconductor Inc.
- Jin Ho BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of bonding semiconductor devices
- Publication number 20050025942
- Publication date Feb 3, 2005
- Grant Kloster
- H01 - BASIC ELECTRIC ELEMENTS

Tantalum [Ta] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Industrial chip scale package for microelectronic device

Mechanisms for forming post-passivation interconnect structure

Tall and fine pitch interconnects

Advanced through substrate via metallization in three dimensional s...

Advanced through substrate via metallization in three dimensional s...

Mechanisms for forming post-passivation interconnect structure

Tall and fine pitch interconnects

Visibility event navigation method and system

Tall and fine pitch interconnects

Semiconductor packages

Mechanisms for forming post-passivation interconnect structure

Method for manufacturing a conducting contact on a conducting element

Protective layer for protecting TSV tips during thermo-compressive...

TSV pillar as an interconnecting structure

Protective layer for protecting TSV tips during thermo-compressive...

Three-dimensional (3D) integrated circuit with enhanced copper-to-c...

Three-dimensional (3D) integrated circuit with enhanced copper-to-c...

Method of bonding semiconductor devices

Method of forming dual height solder interconnections

Solder mass having conductive encapsulating arrangement

Patents Applicationslast 30 patents

INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE

VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM

VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM

TALL AND FINE PITCH INTERCONNECTS

VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM

Tall and Fine Pitch Interconnects

TALL AND FINE PITCH INTERCONNECTS

Structure and Method of Batch-Packaging Low Pin Count Embedded Semi...

PROTECTIVE LAYER FOR PROTECTING TSV TIPS DURING THERMO-COMPRESSIVE...

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...

Semiconductor Chips and Semiconductor Packages and Methods of Fabri...

TSV PILLAR AS AN INTERCONNECTING STRUCTURE

PROTECTIVE LAYER FOR PROTECTING TSV TIPS DURING THERMO-COMPRESSIVE...

SEMICONDUCTOR PACKAGES

BUMP AND SEMICONDUCTOR DEVICE HAVING THE SAME

Method of bonding semiconductor devices