Tape automated bonding [TAB] connectors

Industry

CPC
H01L2224/50

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/50Tape automated bonding [TAB] connectors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic component, electric device including the same, and bondi...
- Patent number 11,979,987
- Issue date May 7, 2024
- Samsung Display Co., Ltd.
- Han-Sung Bae
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method for manufacturing mounting structure for electronic componen...
- Patent number 11,881,470
- Issue date Jan 23, 2024
- Japan Aviation Electronics Industry, Limited
- Ryosuke Mitsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,874,569
- Issue date Jan 16, 2024
- Samsung Display Co., Ltd.
- Han Ho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, electric device including the same, and bondi...
- Patent number 11,696,402
- Issue date Jul 4, 2023
- Samsung Display Co., Ltd.
- Han-Sung Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, electric device including the same, and bondi...
- Patent number 11,457,531
- Issue date Sep 27, 2022
- Samsung Display Co., Ltd.
- Han-Sung Bae
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Display device
- Patent number 11,347,120
- Issue date May 31, 2022
- Samsung Display Co., Ltd.
- Han Ho Park
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Image pickup apparatus, endoscope, and method for manufacturing ima...
- Patent number 11,134,829
- Issue date Oct 5, 2021
- Olympus Corporation
- Takuro Suyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on film and display device including the same
- Patent number 10,971,438
- Issue date Apr 6, 2021
- LG Display Co., Ltd.
- Jihun Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 10,782,573
- Issue date Sep 22, 2020
- Samsung Display Co., Ltd.
- Han Ho Park
- G02 - OPTICS
Information Patent Grant
Display device
- Patent number 10,747,038
- Issue date Aug 18, 2020
- Samsung Display Co., Ltd.
- Hae-Kwan Seo
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Power electronics assembly having an adhesion layer, and method for...
- Patent number 10,665,562
- Issue date May 26, 2020
- Semikron Elektronik GmbH & Co. KG
- Ulrich Sagebaum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, electric device including the same, and bondi...
- Patent number 10,306,763
- Issue date May 28, 2019
- Samsung Display Co., Ltd.
- Han-Sung Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 10,303,017
- Issue date May 28, 2019
- Samsung Display Co., Ltd.
- Han Ho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete flexible interconnects for modules of integrated circuits
- Patent number 10,297,572
- Issue date May 21, 2019
- MC10, Inc.
- Mitul Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for remapping a packaged extracted die
- Patent number 10,177,054
- Issue date Jan 8, 2019
- Global Circuit Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency (RF) devices
- Patent number 10,147,698
- Issue date Dec 4, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage devices
- Patent number 10,068,828
- Issue date Sep 4, 2018
- Samsung Electronics Co., Ltd.
- Min-Young Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, electric device including the same, and bondi...
- Patent number 9,974,175
- Issue date May 15, 2018
- Samsung Display Co., Ltd.
- Han-Sung Bae
- G02 - OPTICS
Information Patent Grant
Display panel, electronic device including the same, and bonding me...
- Patent number 9,894,792
- Issue date Feb 13, 2018
- Samsung Display Co., Ltd.
- Han Sung Bae
- G02 - OPTICS
Information Patent Grant
Semiconductor module, bonding jig, and manufacturing method of semi...
- Patent number 9,881,890
- Issue date Jan 30, 2018
- Olympus Corporation
- Kazuaki Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit leads in packaging for radio frequency devices
- Patent number 9,824,995
- Issue date Nov 21, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connecting member and display device including the same
- Patent number 9,812,800
- Issue date Nov 7, 2017
- Samsung Display Co., Ltd.
- Cheong Hun Lee
- G02 - OPTICS
Information Patent Grant
Electromagnetic wall in millimeter-wave cavity
- Patent number 9,741,666
- Issue date Aug 22, 2017
- MACOM Technology Solutions Holdings, Inc.
- Emmanuelle R. O. Convert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die wirebond packages with elongated windows
- Patent number 9,633,975
- Issue date Apr 25, 2017
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple die face-down stacking for two or more die
- Patent number 9,437,579
- Issue date Sep 6, 2016
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die wirebond packages with elongated windows
- Patent number 9,318,467
- Issue date Apr 19, 2016
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame strips with electrical isolation of die paddles
- Patent number 9,263,419
- Issue date Feb 16, 2016
- Infineon Technologies AG
- Nee Wan Khoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame strips with support members
- Patent number 9,171,766
- Issue date Oct 27, 2015
- Infineon Technologies AG
- Carlo Baterna Marbella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for semiconductor device including guide rings and manufact...
- Patent number 9,018,041
- Issue date Apr 28, 2015
- Samsung Electronics Co., Ltd.
- Han-shin Youn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple die face-down stacking for two or more die
- Patent number 9,013,033
- Issue date Apr 21, 2015
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...
- Publication number 20240284594
- Publication date Aug 22, 2024
- SAMSUNG DISPLAY CO., LTD.
- Han-Sung BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING MOUNTING STRUCTURE FOR ELECTRONIC COMPONEN...
- Publication number 20210193612
- Publication date Jun 24, 2021
- Japan Aviation Electronics Industry, Limited
- Ryosuke MITSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20190278125
- Publication date Sep 12, 2019
- SAMSUNG DISPLAY CO., LTD.
- Han Ho PARK
- G02 - OPTICS
Information Patent Application
ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...
- Publication number 20180263116
- Publication date Sep 13, 2018
- SAMSUNG DISPLAY CO., LTD.
- Han-Sung BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICES
- Publication number 20180158752
- Publication date Jun 7, 2018
- Samsung Electronics Co., Ltd.
- MIN-YOUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20180149901
- Publication date May 31, 2018
- SAMSUNG DISPLAY CO., LTD.
- Han Ho PARK
- G02 - OPTICS
Information Patent Application
CHIP-ON FILM AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20180151536
- Publication date May 31, 2018
- LG Display Co., Ltd.
- Jihun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Remapping a Packaged Extracted Die
- Publication number 20180061724
- Publication date Mar 1, 2018
- Global Circuit Innovations Inc.
- Erick Merle Spory
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLEXIBLE CIRCUIT LEADS IN PACKAGING FOR RADIO FREQUENCY DEVICES AND...
- Publication number 20180019222
- Publication date Jan 18, 2018
- NXP USA, Inc.
- LAKSHMINARAYAN VISWANATHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...
- Publication number 20140332984
- Publication date Nov 13, 2014
- Teiichi Inada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Lead Frame Strips with Support Members
- Publication number 20140327004
- Publication date Nov 6, 2014
- Carlo Baterna Marbella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE WIREBOND PACKAGES WITH ELONGATED WINDOWS
- Publication number 20140217617
- Publication date Aug 7, 2014
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR SEMICONDUCTOR DEVICE INCLUDING GUIDE RINGS AND MANUFACT...
- Publication number 20140051243
- Publication date Feb 20, 2014
- Samsung Electronics Co., Ltd.
- Han-shin YOUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID DISCHARGE HEAD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130293636
- Publication date Nov 7, 2013
- Keisuke Iinuma
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20130214404
- Publication date Aug 22, 2013
- Toyota Jidosha Kabushiki Kaisha
- Norimune ORIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE DIE FACE-DOWN STACKING FOR TWO OR MORE DIE
- Publication number 20130127062
- Publication date May 23, 2013
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR DEVICE
- Publication number 20130093083
- Publication date Apr 18, 2013
- Elpida Memory, Inc.
- Dai SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE DIE FACE-DOWN STACKING FOR TWO OR MORE DIE
- Publication number 20120267798
- Publication date Oct 25, 2012
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD ARRAY PROCESS METHOD TO ENCAPSULATE SUBSTRATE CUT EDGES
- Publication number 20120270368
- Publication date Oct 25, 2012
- Kuo-Yuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD ARRAY PROCESS METHOD TO PREVENT EXPOSURE OF SUBSTRATE PERIPHERIES
- Publication number 20120264257
- Publication date Oct 18, 2012
- Kuo-Yuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC INTEGRATION DOUBLE-ENDED CONVERTER
- Publication number 20120241959
- Publication date Sep 27, 2012
- Huawei Technologies Co., Ltd
- Leif Bergstedt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH PLANK STACK OF SEMICONDUCTOR DIES
- Publication number 20120211878
- Publication date Aug 23, 2012
- Oracle International Corporation
- Darko R. Popovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID DISCHARGE HEAD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120188311
- Publication date Jul 26, 2012
- Canon Kabushiki Kaisha
- Keisuke Iinuma
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...
- Publication number 20120080808
- Publication date Apr 5, 2012
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Package For Semiconductor Device Including Guide Rings And Manufact...
- Publication number 20120074566
- Publication date Mar 29, 2012
- Samsung Electronics Co., Ltd.
- HanShin Youn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...
- Publication number 20110187006
- Publication date Aug 4, 2011
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method for Connecting a Die Assembly to a Substrate in an Integrate...
- Publication number 20110097848
- Publication date Apr 28, 2011
- Alvin Seah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND PACKAGE WITH MICRO BGA CONFIGURATION
- Publication number 20110062577
- Publication date Mar 17, 2011
- Ching-Wei HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...
- Publication number 20110021005
- Publication date Jan 27, 2011
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR DEVICE IN WHICH CIRC...
- Publication number 20100224984
- Publication date Sep 9, 2010
- Elpida Memory, Inc.
- Dai SASAKI
- H01 - BASIC ELECTRIC ELEMENTS

Tape automated bonding [TAB] connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic component, electric device including the same, and bondi...

Method for manufacturing mounting structure for electronic componen...

Display device

Electronic component, electric device including the same, and bondi...

Electronic component, electric device including the same, and bondi...

Display device

Image pickup apparatus, endoscope, and method for manufacturing ima...

Chip-on film and display device including the same

Display device

Display device

Power electronics assembly having an adhesion layer, and method for...

Electronic component, electric device including the same, and bondi...

Display device

Discrete flexible interconnects for modules of integrated circuits

Method for remapping a packaged extracted die

Radio frequency (RF) devices

Semiconductor storage devices

Electronic component, electric device including the same, and bondi...

Display panel, electronic device including the same, and bonding me...

Semiconductor module, bonding jig, and manufacturing method of semi...

Flexible circuit leads in packaging for radio frequency devices

Conductive connecting member and display device including the same

Electromagnetic wall in millimeter-wave cavity

Multi-die wirebond packages with elongated windows

Multiple die face-down stacking for two or more die

Multi-die wirebond packages with elongated windows

Lead frame strips with electrical isolation of die paddles

Lead frame strips with support members

Package for semiconductor device including guide rings and manufact...

Multiple die face-down stacking for two or more die

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...

METHOD FOR MANUFACTURING MOUNTING STRUCTURE FOR ELECTRONIC COMPONEN...

DISPLAY DEVICE

ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...

SEMICONDUCTOR STORAGE DEVICES

DISPLAY DEVICE

CHIP-ON FILM AND DISPLAY DEVICE INCLUDING THE SAME

Method for Remapping a Packaged Extracted Die

FLEXIBLE CIRCUIT LEADS IN PACKAGING FOR RADIO FREQUENCY DEVICES AND...

ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...

Lead Frame Strips with Support Members

MULTI-DIE WIREBOND PACKAGES WITH ELONGATED WINDOWS

PACKAGE FOR SEMICONDUCTOR DEVICE INCLUDING GUIDE RINGS AND MANUFACT...

LIQUID DISCHARGE HEAD AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR MODULE

MULTIPLE DIE FACE-DOWN STACKING FOR TWO OR MORE DIE

SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR DEVICE

MULTIPLE DIE FACE-DOWN STACKING FOR TWO OR MORE DIE

MOLD ARRAY PROCESS METHOD TO ENCAPSULATE SUBSTRATE CUT EDGES

MOLD ARRAY PROCESS METHOD TO PREVENT EXPOSURE OF SUBSTRATE PERIPHERIES

MAGNETIC INTEGRATION DOUBLE-ENDED CONVERTER

CHIP PACKAGE WITH PLANK STACK OF SEMICONDUCTOR DIES

LIQUID DISCHARGE HEAD AND METHOD FOR MANUFACTURING THE SAME

ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...

Package For Semiconductor Device Including Guide Rings And Manufact...

ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...

Method for Connecting a Die Assembly to a Substrate in an Integrate...

SUBSTRATE AND PACKAGE WITH MICRO BGA CONFIGURATION

ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...

SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR DEVICE IN WHICH CIRC...