Temperature control

Industry

CPC
B81B7/0083

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B7/00Micro-structural systems; Auxiliary parts of micro-structural devices or systems

Current Industry

B81B7/0083Temperature control

Industries

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Patents Grantslast 30 patents

Information Patent Grant
MEMS resonator system
- Patent number 11,987,495
- Issue date May 21, 2024
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked-die MEMS resonator
- Patent number 11,708,264
- Issue date Jul 25, 2023
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fluidic chip
- Patent number 11,477,857
- Issue date Oct 18, 2022
- CELL ID PTE LTD
- Lye Hock Sim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked-die MEMS resonator
- Patent number 11,370,656
- Issue date Jun 28, 2022
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fluid propelling apparatus including a heat sink
- Patent number 11,235,574
- Issue date Feb 1, 2022
- Hewlett-Packard Development Company, L.P.
- Garrett E. Clark
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing of integrated circuit resonator
- Patent number 10,913,655
- Issue date Feb 9, 2021
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical system apparatus with heater
- Patent number 10,843,919
- Issue date Nov 24, 2020
- Industrial Technology Research Institute
- Peng-Jen Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fluidic chip
- Patent number 10,750,577
- Issue date Aug 18, 2020
- CELL ID PTE LTD
- Lye Hock Sim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure for micromechanical resonator
- Patent number 10,723,617
- Issue date Jul 28, 2020
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Digital PCR device
- Patent number 10,638,547
- Issue date Apr 28, 2020
- CELL ID PTE LTD
- Lye Hock Sim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low-profile stacked-die MEMS resonator system
- Patent number 10,287,162
- Issue date May 14, 2019
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked-die MEMS resonator system
- Patent number 9,821,998
- Issue date Nov 21, 2017
- SiTime Corpoaration
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low-profile stacked-die MEMS resonator system
- Patent number 9,371,221
- Issue date Jun 21, 2016
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked die package for MEMS resonator system
- Patent number 8,669,664
- Issue date Mar 11, 2014
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked die package for MEMS resonator system
- Patent number 8,324,729
- Issue date Dec 4, 2012
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked die package for MEMS resonator system
- Patent number 8,022,554
- Issue date Sep 20, 2011
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20250019229
- Publication date Jan 16, 2025
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20230391611
- Publication date Dec 7, 2023
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20220356059
- Publication date Nov 10, 2022
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FLUID PROPELLING APPARATUS INCLUDING A HEAT SINK
- Publication number 20220111645
- Publication date Apr 14, 2022
- Hewlett-Packard Development Company, L.P.
- Garrett E. Clark
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20210179421
- Publication date Jun 17, 2021
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LOW-PROFILE STACKED-DIE MEMS RESONATOR SYSTEM
- Publication number 20200385261
- Publication date Dec 10, 2020
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FLUIDIC CHIP
- Publication number 20200305241
- Publication date Sep 24, 2020
- Cell ID Pte Ltd
- Lye Hock SIM
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Package Structure For Micromechanical Resonator
- Publication number 20190292043
- Publication date Sep 26, 2019
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FLUID PROPELLING APPARATUS INCLUDING A HEAT SINK
- Publication number 20180319655
- Publication date Nov 8, 2018
- Hewlett-Packard Development Company, L.P.
- Garrett E. Clark
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LOW-PROFILE STACKED-DIE MEMS RESONATOR SYSTEM
- Publication number 20180155186
- Publication date Jun 7, 2018
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIGITAL PCR DEVICE
- Publication number 20180035490
- Publication date Feb 1, 2018
- Cell ID Pte Ltd
- Lye Hock SIM
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED-DIE MEMS RESONATOR SYSTEM
- Publication number 20170029269
- Publication date Feb 2, 2017
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR ARRANGEMENT WITH THERMAL INSULATION CONFIGURATION
- Publication number 20150274513
- Publication date Oct 1, 2015
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Projector, Oscillating Mirror Element Unit and Headup Display
- Publication number 20150253568
- Publication date Sep 10, 2015
- Funai Electric Co., Ltd.
- Tomohiro KOBAYASHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS GAS SENSING DEVICE
- Publication number 20150210532
- Publication date Jul 30, 2015
- SENSOR TEK Co., Ltd.
- Mao-Chen LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LOW-PROFILE STACKED-DIE MEMS RESONATOR SYSTEM
- Publication number 20150123220
- Publication date May 7, 2015
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR
- Publication number 20140191342
- Publication date Jul 10, 2014
- HITACHI AUTOMOTIVE SYSTEMS, LTD.
- Ichiro Ohsaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Stacked Die Package for MEMS Resonator System
- Publication number 20130075853
- Publication date Mar 28, 2013
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Stacked Die Package for MEMS Resonator System
- Publication number 20110227175
- Publication date Sep 22, 2011
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED DIE PACKAGE FOR MEMS RESONATOR SYSTEM
- Publication number 20070290364
- Publication date Dec 20, 2007
- Pavan GUPTA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Circuit encapsulation technique utilizing electroplating
- Publication number 20020185712
- Publication date Dec 12, 2002
- Brian Stark
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Temperature control

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

MEMS resonator system

Stacked-die MEMS resonator

Fluidic chip

Stacked-die MEMS resonator

Fluid propelling apparatus including a heat sink

Manufacturing of integrated circuit resonator

Microelectromechanical system apparatus with heater

Fluidic chip

Package structure for micromechanical resonator

Digital PCR device

Low-profile stacked-die MEMS resonator system

Stacked-die MEMS resonator system

Low-profile stacked-die MEMS resonator system

Stacked die package for MEMS resonator system

Stacked die package for MEMS resonator system

Stacked die package for MEMS resonator system

Patents Applicationslast 30 patents

STACKED-DIE MEMS RESONATOR

STACKED-DIE MEMS RESONATOR

STACKED-DIE MEMS RESONATOR

FLUID PROPELLING APPARATUS INCLUDING A HEAT SINK

STACKED-DIE MEMS RESONATOR

LOW-PROFILE STACKED-DIE MEMS RESONATOR SYSTEM

FLUIDIC CHIP

Package Structure For Micromechanical Resonator

FLUID PROPELLING APPARATUS INCLUDING A HEAT SINK

LOW-PROFILE STACKED-DIE MEMS RESONATOR SYSTEM

DIGITAL PCR DEVICE

STACKED-DIE MEMS RESONATOR SYSTEM

SEMICONDUCTOR ARRANGEMENT WITH THERMAL INSULATION CONFIGURATION

Projector, Oscillating Mirror Element Unit and Headup Display

MEMS GAS SENSING DEVICE

LOW-PROFILE STACKED-DIE MEMS RESONATOR SYSTEM

MEMS SENSOR

Stacked Die Package for MEMS Resonator System

Stacked Die Package for MEMS Resonator System

STACKED DIE PACKAGE FOR MEMS RESONATOR SYSTEM

Circuit encapsulation technique utilizing electroplating