Temperature range 100 C=<T<150 C, 373.15 K =< T < 423.15K

Industry

CPC
H01L2924/20104

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/20104Temperature range 100 C=<T<150 C, 373.15 K =< T < 423.15K

Industries

Patents Grantslast 30 patents

Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for fabricating hybrid bonded structure
- Patent number 12,021,103
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer and integrated circuit including redistributio...
- Patent number 12,021,046
- Issue date Jun 25, 2024
- STMicroelectronics S.r.l.
- Paolo Colpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low warpage curing methodology by inducing curvature
- Patent number 11,929,260
- Issue date Mar 12, 2024
- Applied Materials, Inc.
- Fang Jie Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated copper bonding wire, wire bonding structure, semic...
- Patent number 11,876,066
- Issue date Jan 16, 2024
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding structures and semiconductor devices including the same
- Patent number 11,804,462
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a redistribution layer, redistribution laye...
- Patent number 11,469,194
- Issue date Oct 11, 2022
- STMicroelectronics S.r.l.
- Paolo Colpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,456,264
- Issue date Sep 27, 2022
- Renesas Electronics Corporation
- Yoshiaki Sato
- G11 - INFORMATION STORAGE
Information Patent Grant
Hybrid bonded structure
- Patent number 11,437,422
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for connecting components
- Patent number 11,355,472
- Issue date Jun 7, 2022
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary bonding scheme
- Patent number 11,328,972
- Issue date May 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state storage device
- Patent number 11,201,100
- Issue date Dec 14, 2021
- Global Unichip Corporation
- Yu-Ting Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free solder joining of electronic structures
- Patent number 11,043,468
- Issue date Jun 22, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,004,817
- Issue date May 11, 2021
- SOCIONEXT INC.
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 10,998,284
- Issue date May 4, 2021
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Flip chip bonding method
- Patent number 10,910,339
- Issue date Feb 2, 2021
- Samsung Electronics Co., Ltd.
- Hwail Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film for semiconductor
- Patent number 10,865,329
- Issue date Dec 15, 2020
- LG Chem, Ltd.
- Hee Jung Kim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Non-porous copper to copper interconnect
- Patent number 10,804,241
- Issue date Oct 13, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition for semiconductor, adhesive film for semicondu...
- Patent number 10,759,971
- Issue date Sep 1, 2020
- LG Chem, Ltd.
- Hee Jung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonded cryogenic chip carrier
- Patent number 10,734,567
- Issue date Aug 4, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonded cryogenic chip carrier
- Patent number 10,727,391
- Issue date Jul 28, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonded structure
- Patent number 10,672,820
- Issue date Jun 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of determining curing conditions, method of producing circui...
- Patent number 10,658,329
- Issue date May 19, 2020
- Sony Corporation
- Takeshi Ichimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dye and pry process for removing quad flat no-lead packages and bot...
- Patent number 10,593,601
- Issue date Mar 17, 2020
- International Business Machines Corporation
- Tim A. Bartsch
- G01 - MEASURING TESTING
Information Patent Grant
Lead-free solder joining of electronic structures
- Patent number 10,586,782
- Issue date Mar 10, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-porous copper to copper interconnect
- Patent number 10,553,555
- Issue date Feb 4, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive particle, and connection material, connection structure,...
- Patent number 10,412,838
- Issue date Sep 10, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
No clean flux composition and methods for use thereof
- Patent number 10,350,713
- Issue date Jul 16, 2019
- International Business Machines Corporation
- Victor Alvarez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,312,216
- Issue date Jun 4, 2019
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,297,568
- Issue date May 21, 2019
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING HYBRID BONDED STRUCTURE
- Publication number 20240313026
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240164118
- Publication date May 16, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuaki TSUCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING METHOD
- Publication number 20240038705
- Publication date Feb 1, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yunzhi LING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CU-CU DIRECT WELDING FOR PACKAGING APPLICATION IN SEMICONDUCTOR IND...
- Publication number 20240021574
- Publication date Jan 18, 2024
- The University of Hong Kong
- Mingxin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE DIRECT BONDING
- Publication number 20230361074
- Publication date Nov 9, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONN...
- Publication number 20230230950
- Publication date Jul 20, 2023
- NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
- Yuechen WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYE...
- Publication number 20230005848
- Publication date Jan 5, 2023
- STMicroelectronics S.r.l.
- Paolo COLPANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING HYBRID BONDED STRUCTURE
- Publication number 20220359601
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING STRUCTURES AND SEMICONDUCTOR DEVICES INCLUDING THE SAME
- Publication number 20220077100
- Publication date Mar 10, 2022
- Samsung Electronics Co., Ltd.
- Kunmo CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDED STRUCTURE
- Publication number 20200295070
- Publication date Sep 17, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES
- Publication number 20200161272
- Publication date May 21, 2020
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-POROUS COPPER TO COPPER INTERCONNECT
- Publication number 20200098723
- Publication date Mar 26, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP BONDING METHOD
- Publication number 20200058615
- Publication date Feb 20, 2020
- Samsung Electronics Co., Ltd.
- HWAIL JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYE...
- Publication number 20200051935
- Publication date Feb 13, 2020
- STMicroelectronics S.r.l.
- Michele MOLGG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DETERMINING CURING CONDITIONS, METHOD OF PRODUCING CIRCUI...
- Publication number 20190267348
- Publication date Aug 29, 2019
- SONY CORPORATION
- Takeshi Ichimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR CONNECTING COMPONENTS
- Publication number 20190252345
- Publication date Aug 15, 2019
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVER FILM AND APPLICATION THEREOF
- Publication number 20190244927
- Publication date Aug 8, 2019
- TAIFLEX SCIENTIFIC CO., LTD.
- Sheng-Chin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDED STRUCTURE
- Publication number 20190157333
- Publication date May 23, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Temporary Bonding Scheme
- Publication number 20190139850
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP BONDED CRYOGENIC CHIP CARRIER
- Publication number 20190131509
- Publication date May 2, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP BONDED CRYOGENIC CHIP CARRIER
- Publication number 20190103541
- Publication date Apr 4, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-POROUS COPPER TO COPPER INTERCONNECT
- Publication number 20190067239
- Publication date Feb 28, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES
- Publication number 20190006312
- Publication date Jan 3, 2019
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENT BONDING OF WAFERS
- Publication number 20190006313
- Publication date Jan 3, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL NANORIBBON ARRAY (VERNA) THERMAL INTERFACE MATERIALS WITH...
- Publication number 20180342405
- Publication date Nov 29, 2018
- Northrop Grumman Systems Corporation
- John A. Starkovich
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE BUMP INTERCONNECTIONS
- Publication number 20180337161
- Publication date Nov 22, 2018
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING DIE BONDING FILM
- Publication number 20180294242
- Publication date Oct 11, 2018
- FURUKAWA ELECTRIC CO., LTD.
- Naoaki MIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF INTERCONNECT FOR HIGH DENSITY 2.5D AND 3D INTEGRATION
- Publication number 20180286826
- Publication date Oct 4, 2018
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20180182733
- Publication date Jun 28, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180122760
- Publication date May 3, 2018
- SOCIONEXT INC.
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS

Temperature range 100 C=<T<150 C, 373.15 K =< T < 423.15K

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low pressure sintering powder

Method for fabricating hybrid bonded structure

Redistribution layer and integrated circuit including redistributio...

Low warpage curing methodology by inducing curvature

Palladium-coated copper bonding wire, wire bonding structure, semic...

Hybrid bonding structures and semiconductor devices including the same

Method of manufacturing a redistribution layer, redistribution laye...

Method of manufacturing semiconductor device

Hybrid bonded structure

Package structure and method for connecting components

Temporary bonding scheme

Solid-state storage device

Lead-free solder joining of electronic structures

Semiconductor device and method for manufacturing the same

Low pressure sintering powder

Flip chip bonding method

Adhesive film for semiconductor

Non-porous copper to copper interconnect

Adhesive composition for semiconductor, adhesive film for semicondu...

Bump bonded cryogenic chip carrier

Bump bonded cryogenic chip carrier

Hybrid bonded structure

Method of determining curing conditions, method of producing circui...

Dye and pry process for removing quad flat no-lead packages and bot...

Lead-free solder joining of electronic structures

Non-porous copper to copper interconnect

Conductive particle, and connection material, connection structure,...

No clean flux composition and methods for use thereof

Systems and methods for bonding semiconductor elements

Systems and methods for bonding semiconductor elements

Patents Applicationslast 30 patents

METHOD FOR FABRICATING HYBRID BONDED STRUCTURE

SEMICONDUCTOR DEVICE

SUBSTRATE BONDING METHOD

CU-CU DIRECT WELDING FOR PACKAGING APPLICATION IN SEMICONDUCTOR IND...

LOW TEMPERATURE DIRECT BONDING

SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONN...

METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYE...

METHOD FOR FABRICATING HYBRID BONDED STRUCTURE

HYBRID BONDING STRUCTURES AND SEMICONDUCTOR DEVICES INCLUDING THE SAME

HYBRID BONDED STRUCTURE

LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES

NON-POROUS COPPER TO COPPER INTERCONNECT

FLIP CHIP BONDING METHOD

METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYE...

METHOD OF DETERMINING CURING CONDITIONS, METHOD OF PRODUCING CIRCUI...

PACKAGE STRUCTURE AND METHOD FOR CONNECTING COMPONENTS

COVER FILM AND APPLICATION THEREOF

HYBRID BONDED STRUCTURE

Temporary Bonding Scheme

BUMP BONDED CRYOGENIC CHIP CARRIER

BUMP BONDED CRYOGENIC CHIP CARRIER

NON-POROUS COPPER TO COPPER INTERCONNECT

LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES

METHOD FOR PERMANENT BONDING OF WAFERS

VERTICAL NANORIBBON ARRAY (VERNA) THERMAL INTERFACE MATERIALS WITH...

SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE BUMP INTERCONNECTIONS

ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING DIE BONDING FILM

METHODS OF INTERCONNECT FOR HIGH DENSITY 2.5D AND 3D INTEGRATION

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME