Temporary protective conductive layer

Industry

CPC
H05K2203/1388

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/1388Temporary protective conductive layer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Flexible circuit board and display device
- Patent number 11,204,659
- Issue date Dec 21, 2021
- WUHAN TIANMA MICRO-ELECTRONICS CO., LTD.
- Ning Xu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Embedded printed circuit board
- Patent number 9,629,248
- Issue date Apr 18, 2017
- LG Innotek Co., Ltd
- Deok Soon Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of etching metal layer
- Patent number 9,150,969
- Issue date Oct 6, 2015
- Tokyo Electron Limited
- Eiichi Nishimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic component built-in substrate and method of manufacturing...
- Patent number 8,309,860
- Issue date Nov 13, 2012
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making an embedded structure
- Patent number 8,191,248
- Issue date Jun 5, 2012
- Unimicron Technology Corp.
- Yi-Chun Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of printed circuit board
- Patent number 8,187,479
- Issue date May 29, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Myung-Sam Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing copper-clad laminate for VOP application
- Patent number 7,807,215
- Issue date Oct 5, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Jong Jin Lee
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and apparatus for fabricating circuit-forming-substrate and...
- Patent number 6,838,164
- Issue date Jan 4, 2005
- Matsushita Electric Industrial Co., Ltd.
- Shigeru Yamane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for fabricating circuit-forming-substrate and...
- Patent number 6,814,836
- Issue date Nov 9, 2004
- Matsushita Electric Industrial, Co., Ltd.
- Shigeru Yamane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing process for printed wiring board
- Patent number 6,716,572
- Issue date Apr 6, 2004
- Mitsui Mining & Smelting Co., Ltd.
- Takuya Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for fabricating circuit-forming-substrate and...
- Patent number 6,409,869
- Issue date Jun 25, 2002
- Matsushita Electric Industrial Co., Ltd.
- Shigeru Yamane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming via holes in a insulation film and method of cutt...
- Patent number 5,628,926
- Issue date May 13, 1997
- NEC Corporation
- Haba Belgacem
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit manufacture
- Patent number 5,609,746
- Issue date Mar 11, 1997
- International Computers Limited
- Simon Farrar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating conductive structures on substrates
- Patent number 5,399,239
- Issue date Mar 21, 1995
- Ceridian Corporation
- Deepak K. Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of external circuitization of a circuit panel
- Patent number 5,158,645
- Issue date Oct 27, 1992
- International Business Machines, Inc.
- Kathleen L. Covert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Neutralizing chloride ions in via holes in multilayer printed circu...
- Patent number 4,398,993
- Issue date Aug 16, 1983
- International Business Machines Corporation
- David W. Hume
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for the production of through holes in a laminate
- Patent number 4,023,998
- Issue date May 17, 1977
- Perstorp AB
- Kjell A. Cederberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for manufacturing base material for printed circuits
- Patent number 3,948,701
- Issue date Apr 6, 1976
- AEG-Isolier-und Kunststoff GmbH
- Helmut Fasbender
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3457638
- Patent number 3,457,638
- Issue date Jul 29, 1969
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3208921
- Patent number 3,208,921
- Issue date Sep 28, 1965
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE CIRCUIT BOARD AND DISPLAY DEVICE
- Publication number 20210132718
- Publication date May 6, 2021
- Wuhan Tianma Micro-Electronics Co., Ltd.
- Ning XU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF ETCHING METAL LAYER
- Publication number 20140251945
- Publication date Sep 11, 2014
- TOKYO ELECTRON LIMITED
- Eiichi NISHIMURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING A METAL CLAD LAMINATE
- Publication number 20120192417
- Publication date Aug 2, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Myung-Sam Kang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
EMBEDDED STRUCTURE OF CIRCUIT BOARD
- Publication number 20120160551
- Publication date Jun 28, 2012
- Yi-Chun Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110056732
- Publication date Mar 10, 2011
- Atsuhiro Uratsuji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing a metal clad laminate
- Publication number 20110036486
- Publication date Feb 17, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Myung-Sam Kang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20100230142
- Publication date Sep 16, 2010
- UBE INDUSTRIES, LTD.
- Keita Bamba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT BUILT-IN SUBSTRATE AND METHOD OF MANUFACTURING...
- Publication number 20100101849
- Publication date Apr 29, 2010
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED STRUCTURE AND METHOD FOR MAKING THE SAME
- Publication number 20100065324
- Publication date Mar 18, 2010
- Yi-Chun Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal clad laminate and manufacturing method thereof
- Publication number 20090324992
- Publication date Dec 31, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Myung-Sam Kang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD
- Publication number 20090321387
- Publication date Dec 31, 2009
- Samsung Electro-Mechanics CO., LTD.
- Myung-Sam KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090288870
- Publication date Nov 26, 2009
- Shinko Electric Industries Co., Ltd.
- Hitoshi KONDO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing copper-clad laminate for VOP application
- Publication number 20080073025
- Publication date Mar 27, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Jong Jin Lee
- B32 - LAYERED PRODUCTS
Information Patent Application
Method and apparatus for fabricating circuit-forming-substrate and...
- Publication number 20020112815
- Publication date Aug 22, 2002
- Matsushita Electric Industrial Co., Ltd.
- Shigeru Yamane
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Method and apparatus for fabricating circuit-forming-substrate and...
- Publication number 20020112822
- Publication date Aug 22, 2002
- Matsushita Electric Industrial Co., Ltd.
- Shigeru Yamane
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Manufacturing process for printed wiring board
- Publication number 20020081530
- Publication date Jun 27, 2002
- MITSUI MINING AND SMELTING CO., LTD
- Takuya Yamamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
METHOD AND APPARATUS FOR FABRICATING CIRCUIT-FORMING-SUBSTRATE AND...
- Publication number 20020040758
- Publication date Apr 11, 2002
- SHIGERU YAMANE
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Temporary protective conductive layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Flexible circuit board and display device

Embedded printed circuit board

Method of etching metal layer

Electronic component built-in substrate and method of manufacturing...

Method for making an embedded structure

Manufacturing method of printed circuit board

Method of manufacturing copper-clad laminate for VOP application

Method and apparatus for fabricating circuit-forming-substrate and...

Method and apparatus for fabricating circuit-forming-substrate and...

Manufacturing process for printed wiring board

Method and apparatus for fabricating circuit-forming-substrate and...

Method of forming via holes in a insulation film and method of cutt...

Printed circuit manufacture

Method of fabricating conductive structures on substrates

Method of external circuitization of a circuit panel

Neutralizing chloride ions in via holes in multilayer printed circu...

Method for the production of through holes in a laminate

Process for manufacturing base material for printed circuits

3457638

3208921

Patents Applicationslast 30 patents

FLEXIBLE CIRCUIT BOARD AND DISPLAY DEVICE

METHOD OF ETCHING METAL LAYER

METHOD OF MANUFACTURING A METAL CLAD LAMINATE

EMBEDDED STRUCTURE OF CIRCUIT BOARD

FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

Method of manufacturing a metal clad laminate

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

ELECTRONIC COMPONENT BUILT-IN SUBSTRATE AND METHOD OF MANUFACTURING...

EMBEDDED STRUCTURE AND METHOD FOR MAKING THE SAME

Metal clad laminate and manufacturing method thereof

MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Method of manufacturing copper-clad laminate for VOP application

Method and apparatus for fabricating circuit-forming-substrate and...

Method and apparatus for fabricating circuit-forming-substrate and...

Manufacturing process for printed wiring board

METHOD AND APPARATUS FOR FABRICATING CIRCUIT-FORMING-SUBSTRATE AND...