3457638

Information

• Patent Grant
• 3457638

• References
• Source

• Patent Number

  3,457,638

• Date Filed

  Not available

• Date Issued

  Tuesday, July 29, 1969
  55 years ago

• CPC

  • H05K3/428 - initial plating of through-holes in substrates having a metal pattern
  • H05K3/427 - initial plating of through-holes in metal-clad substrates
  • H05K3/243 - characterised by selective plating
  • H05K2201/0166 - Polymeric layer used for special processing
  • H05K2201/09736 - Varying thickness of a single conductor Conductors in the same plane having different thicknesses
  • H05K2203/0143 - Using a roller Specific shape thereof Providing locally adhesive portions thereon
  • H05K2203/0542 - Continuous temporary metal layer over metal pattern
  • H05K2203/0565 - Resist used only for applying catalyst, not for plating itself
  • H05K2203/0577 - Double layer of resist having the same pattern
  • H05K2203/1383 - Temporary protective insulating layer
  • H05K2203/1388 - Temporary protective conductive layer
  • H05K2203/1415 - Applying catalyst after applying plating resist
  • Y10T29/49165 - by forming conductive walled aperture in base

• US Classifications

  • 029 - Metal working
  • 174 - Electricity: conductors and insulators
  • 205 - Electrolysis: processes, compositions used therein, and methods of preparing the compositions
  • 216 - Etching a substrate: processes
  • 427 - Coating processes