3208921

Information

• Patent Grant
• 3208921

• References
• Source

• Patent Number

  3,208,921

• Date Filed

  Not available

• Date Issued

  Tuesday, September 28, 1965
  59 years ago

• CPC

  • H05K3/108 - by semi-additive methods; masks therefor
  • H05K3/428 - initial plating of through-holes in substrates having a metal pattern
  • H05K2201/0347 - Overplating
  • H05K2203/0542 - Continuous temporary metal layer over metal pattern
  • H05K2203/0723 - Electroplating
  • H05K2203/1388 - Temporary protective conductive layer

• US Classifications

  • 205 - Electrolysis: processes, compositions used therein, and methods of preparing the compositions