Testing of devices without physical removal from the circuit of which they form part

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G01R31/27

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GPHYSICS G01Measuring instruments G01RMEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES G01R31/00Arrangements for testing electric properties Arrangements for locating electric faults Arrangements for electrical testing characterised by what is being tested not provided for elsewhere

Current Industry

G01R31/27Testing of devices without physical removal from the circuit of which they form part

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Display panel and burn-in test method of the display panel
- Patent number 12,203,972
- Issue date Jan 21, 2025
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Jida Hou
- G01 - MEASURING TESTING
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,170,253
- Issue date Dec 17, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
GaN reliability built-in self test (BIST) apparatus and method for...
- Patent number 12,163,995
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Ann Lai
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Ultrasonic testing device and ultrasonic testing method
- Patent number 12,153,021
- Issue date Nov 26, 2024
- National University Corporation Toyohashi University of Technology
- Naohiro Hozumi
- G01 - MEASURING TESTING
Information Patent Grant
Dual mode current and temperature sensing for SiC devices
- Patent number 12,132,104
- Issue date Oct 29, 2024
- Infineon Technologies AG
- Dethard Peters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Virtual quality control interpolation and process feedback in the p...
- Patent number 12,105,137
- Issue date Oct 1, 2024
- SanDisk Technologies LLC
- Yusuke Ikawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,074,121
- Issue date Aug 27, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package test apparatus and method
- Patent number 12,072,370
- Issue date Aug 27, 2024
- Samsung Electronics Co., Ltd.
- Sung Ok Kim
- G01 - MEASURING TESTING
Information Patent Grant
Diagnosis circuit of parallel-structure MOSFETs including MUX and d...
- Patent number 12,061,224
- Issue date Aug 13, 2024
- LG ENERGY SOLUTION, LTD.
- Lyang Wook Jo
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and method for managing power of test circuits
- Patent number 12,007,429
- Issue date Jun 11, 2024
- IC ANALYTICA, LLC
- Patrick G. Drennan
- G01 - MEASURING TESTING
Information Patent Grant
Test method for tolerance against the hot carrier effect
- Patent number 11,953,542
- Issue date Apr 9, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yifei Pan
- G11 - INFORMATION STORAGE
Information Patent Grant
Electronic device for managing degree of degradation
- Patent number 11,946,967
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Dong-Uk Ryu
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power semi-conductor module, mask, measurement method, computer sof...
- Patent number 11,927,619
- Issue date Mar 12, 2024
- Mitsubishi Electric Corporation
- Nicolas Degrenne
- G01 - MEASURING TESTING
Information Patent Grant
Testing module and testing method using the same
- Patent number 11,906,573
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao Chen
- G01 - MEASURING TESTING
Information Patent Grant
Method for checking a semiconductor switch for a fault
- Patent number 11,881,848
- Issue date Jan 23, 2024
- Webasto SE
- Philipp Eck
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
SiC device having a dual mode sense terminal, electronic systems fo...
- Patent number 11,799,026
- Issue date Oct 24, 2023
- Infineon Technologies AG
- Dethard Peters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory system tester using test pad real time monitoring
- Patent number 11,763,908
- Issue date Sep 19, 2023
- Micron Technology, Inc.
- Andrea Vigilante
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuitry for electrical redundancy in bonded structures
- Patent number 11,721,653
- Issue date Aug 8, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Javier A. DeLACruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing module and testing method using the same
- Patent number 11,693,045
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao Chen
- G01 - MEASURING TESTING
Information Patent Grant
Opto electrical test measurement system for integrated photonic dev...
- Patent number 11,680,870
- Issue date Jun 20, 2023
- STMicroelectronics (Crolles 2) SAS
- Philippe Grosse
- G01 - MEASURING TESTING
Information Patent Grant
GaN reliability built-in self test (BIST) apparatus and method for...
- Patent number 11,680,978
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Ann Lai
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Signal transmission circuit device, semiconductor device, method an...
- Patent number 11,658,659
- Issue date May 23, 2023
- Rohm Co., Ltd.
- Daiki Yanagishima
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Internal failure detection of an external failure detection system...
- Patent number 11,635,341
- Issue date Apr 25, 2023
- DISTRAN AG
- Florian Perrodin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 11,626,372
- Issue date Apr 11, 2023
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test apparatus for semiconductor package
- Patent number 11,609,244
- Issue date Mar 21, 2023
- TSE CO., LTD.
- Chang Su Oh
- G01 - MEASURING TESTING
Information Patent Grant
System and method of preparing integrated circuits for backside pro...
- Patent number 11,605,525
- Issue date Mar 14, 2023
- FEI Company
- James Vickers
- G01 - MEASURING TESTING
Information Patent Grant
Testing module and testing method using the same
- Patent number 11,585,846
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao Chen
- G01 - MEASURING TESTING
Information Patent Grant
Probe card for characterizing processes of submicron semiconductor...
- Patent number 11,579,171
- Issue date Feb 14, 2023
- Meta Platforms Technologies, LLC
- Christopher Percival
- G02 - OPTICS
Information Patent Grant
Test board and semiconductor device test system including the same
- Patent number 11,579,183
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Minseok Hong
- G01 - MEASURING TESTING
Information Patent Grant
Probe card for efficient screening of highly-scaled monolithic semi...
- Patent number 11,579,182
- Issue date Feb 14, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRESS CALIBRATION METHOD, CORRESPONDING ELECTRONIC DEVICE
- Publication number 20250027985
- Publication date Jan 23, 2025
- STMicroelectronics International N.V.
- G01 - MEASURING TESTING
Information Patent Application
MEASURING ARRANGEMENT FOR EXAMINING A LIGHT-EMITTING DIODE ASSEMBLY...
- Publication number 20240353485
- Publication date Oct 24, 2024
- ams-OSRAM International GmbH
- Stefan Kerscher
- G01 - MEASURING TESTING
Information Patent Application
Arrangement For Monitoring the Condition of a Power Semiconductor M...
- Publication number 20240280627
- Publication date Aug 22, 2024
- ABB Schweiz AG
- Mikko Kohvakka
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR SWITCH ASSEMBLY HAVING A MONITORING FUNCTION, ENERGY...
- Publication number 20240241170
- Publication date Jul 18, 2024
- ROBERT BOSCH GmbH
- Siegbert Sautter
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD OF MONITORING A HEALTH STATE OF A POWER SEMICONDUCTOR DEVICE
- Publication number 20240192263
- Publication date Jun 13, 2024
- Rolls-Royce plc
- Mohamed Sathik MOHAMED HALICK
- G01 - MEASURING TESTING
Information Patent Application
DISPLAY PANEL AND BURN-IN TEST METHOD OF THE DISPLAY PANEL
- Publication number 20240168081
- Publication date May 23, 2024
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Jida HOU
- G01 - MEASURING TESTING
Information Patent Application
CIRCUITRY FOR ELECTRICAL REDUNDANCY IN BONDED STRUCTURES
- Publication number 20240162178
- Publication date May 16, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240142511
- Publication date May 2, 2024
- Fuji Electric Co., Ltd.
- Yuki KUMAZAWA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
TESTING MODULE AND TESTING METHOD USING THE SAME
- Publication number 20240133942
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao Chen
- G01 - MEASURING TESTING
Information Patent Application
DIAGNOSIS AND PROGNOSIS OF IGBT MODULES
- Publication number 20240118333
- Publication date Apr 11, 2024
- ABB Schweiz AG
- Aleksi Vulli
- G01 - MEASURING TESTING
Information Patent Application
EVALUATION CIRCUIT, SEMICONDUCTOR DEVICE, AND EVALUATION METHOD
- Publication number 20240110967
- Publication date Apr 4, 2024
- WINBOND ELECTRONICS CORP.
- Taihei SHIDO
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT THAT MITIGATES INDUCTIVE-INDUCED VOLTAGE DROOP
- Publication number 20240085965
- Publication date Mar 14, 2024
- SambaNova Systems, Inc.
- Darshan GANDHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT THAT MITIGATES INDUCTIVE-INDUCED VOLTAGE OVERSHOOT
- Publication number 20240085967
- Publication date Mar 14, 2024
- SambaNova Systems, Inc.
- Darshan GANDHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Dual Mode Current and Temperature Sensing for SiC Devices
- Publication number 20230420559
- Publication date Dec 28, 2023
- INFINEON TECHNOLOGIES AG
- Dethard Peters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUITRY FOR ELECTRICAL REDUNDANCY IN BONDED STRUCTURES
- Publication number 20230395544
- Publication date Dec 7, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAN RELIABILITY BUILT-IN SELF TEST (BIST) APPARATUS AND METHOD FOR...
- Publication number 20230280391
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Ann LAI
- G01 - MEASURING TESTING
Information Patent Application
SIGNAL TRANSMISSION CIRCUIT DEVICE, SEMICONDUCTOR DEVICE, METHOD AN...
- Publication number 20230253963
- Publication date Aug 10, 2023
- Rohm Co., Ltd.
- Daiki Yanagishima
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20230223361
- Publication date Jul 13, 2023
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF TESTING THE SAME
- Publication number 20230176108
- Publication date Jun 8, 2023
- Samsung Electronics Co.,Ltd.
- SEUNGHYUN CHO
- G01 - MEASURING TESTING
Information Patent Application
CIRCUITS AND TECHNIQUES FOR PREDICTING END OF LIFE BASED ON IN SITU...
- Publication number 20230168295
- Publication date Jun 1, 2023
- INFINEON TECHNOLOGIES AG
- Georg Georgakos
- G01 - MEASURING TESTING
Information Patent Application
A TESTING MODULE AND TESTING METHOD USING THE SAME
- Publication number 20230168296
- Publication date Jun 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao Chen
- G01 - MEASURING TESTING
Information Patent Application
TEST METHOD FOR TOLERANCE AGAINST THE HOT CARRIER EFFECT
- Publication number 20230068128
- Publication date Mar 2, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yifei PAN
- G11 - INFORMATION STORAGE
Information Patent Application
APPARATUS AND METHOD FOR MANAGING POWER OF TEST CIRCUITS
- Publication number 20220413037
- Publication date Dec 29, 2022
- IC ANALYTICA, LLC
- Patrick G. DRENNAN
- G01 - MEASURING TESTING
Information Patent Application
VIRTUAL QUALITY CONTROL INTERPOLATION AND PROCESS FEEDBACK IN THE P...
- Publication number 20220413036
- Publication date Dec 29, 2022
- SANDISK TECHNOLOGIES LLC
- Yusuke Ikawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TESTING MODULE AND TESTING METHOD USING THE SAME
- Publication number 20220381817
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao Chen
- G01 - MEASURING TESTING
Information Patent Application
TESTING APPARATUS AND ITS ELEMENT PICKUP MODULE
- Publication number 20220291256
- Publication date Sep 15, 2022
- Global Unichip Corporation
- Chih-Chieh LIAO
- G01 - MEASURING TESTING
Information Patent Application
SiC Device Having a Dual Mode Sense Terminal, Electronic Systems fo...
- Publication number 20220271156
- Publication date Aug 25, 2022
- Dethard Peters
- G01 - MEASURING TESTING
Information Patent Application
Diagnosis Circuit of Parallel-Structure Mosfets Including Mux and D...
- Publication number 20220229104
- Publication date Jul 21, 2022
- LG ENERGY SOLUTION, LTD.
- Lyang Wook Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CHECKING A SEMICONDUCTOR SWITCH FOR A FAULT
- Publication number 20220158633
- Publication date May 19, 2022
- Webasto SE
- Philipp ECK
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
TESTING AN INTEGRATED CAPACITOR
- Publication number 20220113346
- Publication date Apr 14, 2022
- SEMTECH CORPORATION
- Jonah Edward NUTTGENS
- H01 - BASIC ELECTRIC ELEMENTS

Testing of devices without physical removal from the circuit of which they form part

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display panel and burn-in test method of the display panel

Metal-free frame design for silicon bridges for semiconductor packages

GaN reliability built-in self test (BIST) apparatus and method for...

Ultrasonic testing device and ultrasonic testing method

Dual mode current and temperature sensing for SiC devices

Virtual quality control interpolation and process feedback in the p...

Metal-free frame design for silicon bridges for semiconductor packages

Semiconductor package test apparatus and method

Diagnosis circuit of parallel-structure MOSFETs including MUX and d...

Apparatus and method for managing power of test circuits

Test method for tolerance against the hot carrier effect

Electronic device for managing degree of degradation

Power semi-conductor module, mask, measurement method, computer sof...

Testing module and testing method using the same

Method for checking a semiconductor switch for a fault

SiC device having a dual mode sense terminal, electronic systems fo...

Memory system tester using test pad real time monitoring

Circuitry for electrical redundancy in bonded structures

Testing module and testing method using the same

Opto electrical test measurement system for integrated photonic dev...

GaN reliability built-in self test (BIST) apparatus and method for...

Signal transmission circuit device, semiconductor device, method an...

Internal failure detection of an external failure detection system...

Metal-free frame design for silicon bridges for semiconductor packages

Test apparatus for semiconductor package

System and method of preparing integrated circuits for backside pro...

Testing module and testing method using the same

Probe card for characterizing processes of submicron semiconductor...

Test board and semiconductor device test system including the same

Probe card for efficient screening of highly-scaled monolithic semi...

Patents Applicationslast 30 patents

STRESS CALIBRATION METHOD, CORRESPONDING ELECTRONIC DEVICE

MEASURING ARRANGEMENT FOR EXAMINING A LIGHT-EMITTING DIODE ASSEMBLY...

Arrangement For Monitoring the Condition of a Power Semiconductor M...

SEMICONDUCTOR SWITCH ASSEMBLY HAVING A MONITORING FUNCTION, ENERGY...

METHOD OF MONITORING A HEALTH STATE OF A POWER SEMICONDUCTOR DEVICE

DISPLAY PANEL AND BURN-IN TEST METHOD OF THE DISPLAY PANEL

CIRCUITRY FOR ELECTRICAL REDUNDANCY IN BONDED STRUCTURES

SEMICONDUCTOR DEVICE

TESTING MODULE AND TESTING METHOD USING THE SAME

DIAGNOSIS AND PROGNOSIS OF IGBT MODULES

EVALUATION CIRCUIT, SEMICONDUCTOR DEVICE, AND EVALUATION METHOD

INTEGRATED CIRCUIT THAT MITIGATES INDUCTIVE-INDUCED VOLTAGE DROOP

INTEGRATED CIRCUIT THAT MITIGATES INDUCTIVE-INDUCED VOLTAGE OVERSHOOT

Dual Mode Current and Temperature Sensing for SiC Devices

CIRCUITRY FOR ELECTRICAL REDUNDANCY IN BONDED STRUCTURES

GAN RELIABILITY BUILT-IN SELF TEST (BIST) APPARATUS AND METHOD FOR...

SIGNAL TRANSMISSION CIRCUIT DEVICE, SEMICONDUCTOR DEVICE, METHOD AN...

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE AND METHOD OF TESTING THE SAME

CIRCUITS AND TECHNIQUES FOR PREDICTING END OF LIFE BASED ON IN SITU...

A TESTING MODULE AND TESTING METHOD USING THE SAME

TEST METHOD FOR TOLERANCE AGAINST THE HOT CARRIER EFFECT

APPARATUS AND METHOD FOR MANAGING POWER OF TEST CIRCUITS

VIRTUAL QUALITY CONTROL INTERPOLATION AND PROCESS FEEDBACK IN THE P...

TESTING MODULE AND TESTING METHOD USING THE SAME

TESTING APPARATUS AND ITS ELEMENT PICKUP MODULE

SiC Device Having a Dual Mode Sense Terminal, Electronic Systems fo...

Diagnosis Circuit of Parallel-Structure Mosfets Including Mux and D...

METHOD FOR CHECKING A SEMICONDUCTOR SWITCH FOR A FAULT

TESTING AN INTEGRATED CAPACITOR