the additional leads being a tape carrier or flat leads

Industry

CPC
H01L23/49524

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49524the additional leads being a tape carrier or flat leads

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 12,354,934
- Issue date Jul 8, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Siang Miang Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacture
- Patent number 12,347,751
- Issue date Jul 1, 2025
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package assemblies with direct leadframe attac...
- Patent number 12,315,826
- Issue date May 27, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor chip having power tran...
- Patent number 12,308,356
- Issue date May 20, 2025
- Renesas Electronics Corporation
- Toshiyuki Hata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual cool power module with stress buffer layer
- Patent number 12,300,689
- Issue date May 13, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jonghwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture for a cascode semiconductor device
- Patent number 12,293,961
- Issue date May 6, 2025
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin semiconductor packaging unit having a plurality of bridging la...
- Patent number 12,288,737
- Issue date Apr 29, 2025
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package having an embedded inlay
- Patent number 12,283,538
- Issue date Apr 22, 2025
- Infineon Technologies AG
- Marcus Boehm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe spacer for double-sided power module
- Patent number 12,278,158
- Issue date Apr 15, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Tzu-Hsuan Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided coolable semiconductor package
- Patent number 12,266,586
- Issue date Apr 1, 2025
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a metal clip and related methods of ma...
- Patent number 12,266,628
- Issue date Apr 1, 2025
- Infineon Technologies AG
- Engku Izyan Munirah E Afandi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with wettable flank and related methods
- Patent number 12,243,810
- Issue date Mar 4, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hui Min Ler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with vertical passive components
- Patent number 12,230,615
- Issue date Feb 18, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Jiraphat Charoenratpratoom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,176,271
- Issue date Dec 24, 2024
- Rohm Co., Ltd.
- Atsushi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with wettable flank
- Patent number 12,176,272
- Issue date Dec 24, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hui Min Ler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connection member, electrical connection structure, and...
- Patent number 12,176,315
- Issue date Dec 24, 2024
- Hitachi Metals, Ltd.
- Junya Nishina
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadframe, encapsulated package with punched lead and sawn side fla...
- Patent number 12,165,959
- Issue date Dec 10, 2024
- Infineon Technologies AG
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection arrangements for integrated lateral diffusion field effe...
- Patent number 12,159,815
- Issue date Dec 3, 2024
- Silanna Pte Ltd
- Shanghui Larry Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 12,142,551
- Issue date Nov 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor package with connection lug
- Patent number 12,125,772
- Issue date Oct 22, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,119,290
- Issue date Oct 15, 2024
- Rohm Co., Ltd.
- Takumi Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked transistor chip package with source coupling
- Patent number 12,094,807
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with reduced thermal resistance for improved h...
- Patent number 12,087,672
- Issue date Sep 10, 2024
- Kabushiki Kaisha Toshiba
- Daisuke Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a plurality of offsets in leads suppor...
- Patent number 12,087,676
- Issue date Sep 10, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jae Min Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method of the semiconductor de...
- Patent number 12,074,129
- Issue date Aug 27, 2024
- Rohm Co., Ltd.
- Takukazu Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach surface copper layer with protective layer for microelec...
- Patent number 12,074,096
- Issue date Aug 27, 2024
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and semiconductor arrangement having thermally conduct...
- Patent number 12,068,213
- Issue date Aug 20, 2024
- Infineon Technologies AG
- Thai Kee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,068,229
- Issue date Aug 20, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method for semiconductor device
- Patent number 12,062,634
- Issue date Aug 13, 2024
- Rohm Co., Ltd.
- Kazunori Fuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three level interconnect clip
- Patent number 12,057,376
- Issue date Aug 6, 2024
- Infineon Technologies AG
- Azlina Kassim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Embedded Power Semiconductor Package with Sidewall Contacts
- Publication number 20250226293
- Publication date Jul 10, 2025
- INFINEON TECHNOLOGIES AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER STAGE DEVICE CLIP
- Publication number 20250210579
- Publication date Jun 26, 2025
- NEXPERIA B.V.
- Dolores Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK AND RELATED METHODS
- Publication number 20250201675
- Publication date Jun 19, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hui Min LER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250201679
- Publication date Jun 19, 2025
- DENSO CORPORATION
- Mitsuki KAWANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead Frame
- Publication number 20250183128
- Publication date Jun 5, 2025
- NEXPERIA B.V.
- Shun Tik Yeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250183099
- Publication date Jun 5, 2025
- Advanced Semiconductor Engineering, Inc.
- Yi-Hung HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250167079
- Publication date May 22, 2025
- Mitsubishi Electric Corporation
- Ryoji MURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF ABSORBING COVER INTEGRATED IN MMIC PACKAGES
- Publication number 20250149473
- Publication date May 8, 2025
- Qorvo US, Inc.
- Soack-Dae Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME
- Publication number 20250140657
- Publication date May 1, 2025
- IDEAL SEMICONDUCTOR DEVICES, INC.
- Ryan Thorpe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES
- Publication number 20250140659
- Publication date May 1, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250125207
- Publication date Apr 17, 2025
- Fuji Electric Co., Ltd.
- Toshio DENTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK
- Publication number 20250118635
- Publication date Apr 10, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hui Min LER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250112134
- Publication date Apr 3, 2025
- Mitsubishi Electric Corporation
- Yoshihisa UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE HAVING A SOLDER BLEED OUT PREVENTION LAY...
- Publication number 20250105102
- Publication date Mar 27, 2025
- INFINEON TECHNOLOGIES AG
- Roman Künstler-Boschke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
- Publication number 20250096085
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Soyoung LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL PACKAGE SWITCHING POWER DEVICE
- Publication number 20250079268
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONIC SYSTEM HAVING A POWER SEMICONDUCTOR MODULE AND A C...
- Publication number 20250070104
- Publication date Feb 27, 2025
- INFINEON TECHNOLOGIES AG
- Tomas Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING COMPONENTS FOR SEMICONDU...
- Publication number 20250062196
- Publication date Feb 20, 2025
- Vishay Silliconix LLC
- Lim CHEE CHIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe, Encapsulated Package with Punched Lead and Sawn Side Fla...
- Publication number 20250054843
- Publication date Feb 13, 2025
- INFINEON TECHNOLOGIES AG
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH LEAD LOCK
- Publication number 20250038077
- Publication date Jan 30, 2025
- TEXAS INSTRUMENTS INCORPORATED
- CHU-YUN LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE DEVICE
- Publication number 20250022846
- Publication date Jan 16, 2025
- FORCE MOS TECHNOLOGY CO., LTD.
- YUAN-SHUN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429139
- Publication date Dec 26, 2024
- ROHM CO., LTD.
- Tomoki FUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429138
- Publication date Dec 26, 2024
- ROHM CO., LTD.
- Tomoki FUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...
- Publication number 20240429135
- Publication date Dec 26, 2024
- NEXPERIA B.V.
- Vegneswary Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...
- Publication number 20240421045
- Publication date Dec 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE HAVING A METALLIC CLIP WITH ULTRASONICAL...
- Publication number 20240404982
- Publication date Dec 5, 2024
- INFINEON TECHNOLOGIES AG
- Marian Sebastian Broll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240387442
- Publication date Nov 21, 2024
- Mitsubishi Electric Corporation
- Kensuke TAKEUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND METHOD...
- Publication number 20240312968
- Publication date Sep 19, 2024
- RENESAS ELECTRONICS CORPORATION
- Toshiyuki HATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME ASSEMBLY FOR A SEMICONDUCTOR DEVICE
- Publication number 20240258207
- Publication date Aug 1, 2024
- NEXPERIA B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE ASSEMBLIES WITH DIRECT LEADFRAME ATTAC...
- Publication number 20240250042
- Publication date Jul 25, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS

the additional leads being a tape carrier or flat leads

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing a semiconductor device

Semiconductor device and a method of manufacture

Semiconductor device package assemblies with direct leadframe attac...

Semiconductor device including semiconductor chip having power tran...

Dual cool power module with stress buffer layer

Method of manufacture for a cascode semiconductor device

Thin semiconductor packaging unit having a plurality of bridging la...

Molded semiconductor package having an embedded inlay

Leadframe spacer for double-sided power module

Double-sided coolable semiconductor package

Semiconductor package having a metal clip and related methods of ma...

Semiconductor package with wettable flank and related methods

Semiconductor packages with vertical passive components

Semiconductor device

Semiconductor package with wettable flank

Electrical connection member, electrical connection structure, and...

Leadframe, encapsulated package with punched lead and sawn side fla...

Connection arrangements for integrated lateral diffusion field effe...

Package including multiple semiconductor devices

Method of forming a semiconductor package with connection lug

Semiconductor device

Stacked transistor chip package with source coupling

Semiconductor device with reduced thermal resistance for improved h...

Semiconductor devices having a plurality of offsets in leads suppor...

Semiconductor device and fabrication method of the semiconductor de...

Die attach surface copper layer with protective layer for microelec...

Chip package and semiconductor arrangement having thermally conduct...

Semiconductor device

Semiconductor device and production method for semiconductor device

Three level interconnect clip

Patents Applicationslast 30 patents

Embedded Power Semiconductor Package with Sidewall Contacts

POWER STAGE DEVICE CLIP

SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK AND RELATED METHODS

SEMICONDUCTOR DEVICE

Lead Frame

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

RF ABSORBING COVER INTEGRATED IN MMIC PACKAGES

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME

PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES

SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR DEVICE HAVING A SOLDER BLEED OUT PREVENTION LAY...

CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME

DUAL PACKAGE SWITCHING POWER DEVICE

POWER ELECTRONIC SYSTEM HAVING A POWER SEMICONDUCTOR MODULE AND A C...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING COMPONENTS FOR SEMICONDU...

Leadframe, Encapsulated Package with Punched Lead and Sawn Side Fla...

ELECTRONIC DEVICE WITH LEAD LOCK

MULTI-CHIP PACKAGE DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...

DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...

POWER SEMICONDUCTOR MODULE HAVING A METALLIC CLIP WITH ULTRASONICAL...

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND METHOD...

LEAD FRAME ASSEMBLY FOR A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE PACKAGE ASSEMBLIES WITH DIRECT LEADFRAME ATTAC...