the additional leads being a tape carrier or flat leads

Industry

CPC
H01L23/49524

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49524the additional leads being a tape carrier or flat leads

Industries

Patents Grantslast 30 patents

Information Patent Grant
Lead frame assembly for a semiconductor device
- Patent number 11,973,009
- Issue date Apr 30, 2024
- Nexperia B.V.
- Ricardo Lagmay Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,973,016
- Issue date Apr 30, 2024
- Infineon Technologies Austria AG
- Elvir Kahrimanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power module
- Patent number 11,973,064
- Issue date Apr 30, 2024
- Robert Bosch GmbH
- Christian Marc Lautensack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for thin film capacitor integration
- Patent number 11,948,871
- Issue date Apr 2, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,935,820
- Issue date Mar 19, 2024
- Sansha Electric Manufacturing Co., Ltd.
- Tomohiro Yamanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of lead frames for cooling a power device
- Patent number 11,929,307
- Issue date Mar 12, 2024
- Hitachi Astemo, Ltd.
- Yusuke Takagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a carrier, semiconductor chip packages...
- Patent number 11,915,999
- Issue date Feb 27, 2024
- Infineon Technologies AG
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,908,778
- Issue date Feb 20, 2024
- Denso Corporation
- Hiroshi Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with plurality of leads and sealing resin
- Patent number 11,908,777
- Issue date Feb 20, 2024
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High current packages with reduced solder layer count
- Patent number 11,901,271
- Issue date Feb 13, 2024
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package assemblies with direct leadframe attac...
- Patent number 11,901,309
- Issue date Feb 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having outer terminal portions with conductive...
- Patent number 11,887,915
- Issue date Jan 30, 2024
- Amkor Technology Japan, Inc.
- Masafumi Suzuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a metallization structure
- Patent number 11,876,041
- Issue date Jan 16, 2024
- Infineon Technologies Austria AG
- Oliver Blank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip with a vertical connector
- Patent number 11,854,947
- Issue date Dec 26, 2023
- Texas Instruments Incorporated
- Abram M. Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,842,949
- Issue date Dec 12, 2023
- Rohm Co., Ltd.
- Atsushi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double side heat dissipation for silicon chip package
- Patent number 11,842,952
- Issue date Dec 12, 2023
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe spacer for double-sided power module
- Patent number 11,830,784
- Issue date Nov 28, 2023
- Semiconductor Components Industries, LLC
- Tzu-Hsuan Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with plurality of leads and sealing resin
- Patent number 11,804,422
- Issue date Oct 31, 2023
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and power converter
- Patent number 11,784,105
- Issue date Oct 10, 2023
- Mitsubishi Electric Corporation
- Hodaka Rokubuichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a metal clip with a solder volume balan...
- Patent number 11,769,748
- Issue date Sep 26, 2023
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 11,764,135
- Issue date Sep 19, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Siang Miang Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module including lead frame unit connecting first substrate a...
- Patent number 11,756,867
- Issue date Sep 12, 2023
- LG Electronics Inc.
- Siho Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split tie bar for clip stability
- Patent number 11,742,318
- Issue date Aug 29, 2023
- Texas Instruments Incorporated
- Dolores Babaran Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,735,505
- Issue date Aug 22, 2023
- Kabushiki Kaisha Toshiba
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,728,253
- Issue date Aug 15, 2023
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,715,676
- Issue date Aug 1, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Kenji Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structures and methods of manufacture
- Patent number 11,710,686
- Issue date Jul 25, 2023
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer interconnection ribbon
- Patent number 11,705,387
- Issue date Jul 18, 2023
- Infineon Technologies AG
- Emil Lamco Jocson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module for PCB embedding, power electronic asse...
- Patent number 11,699,640
- Issue date Jul 11, 2023
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a plurality of offsets in leads suppor...
- Patent number 11,694,946
- Issue date Jul 4, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Jae Min Bae
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING COMPON...
- Publication number 20240145355
- Publication date May 2, 2024
- STMicroelectronics S.r.l
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING SUCH SEMICONDUC...
- Publication number 20240145354
- Publication date May 2, 2024
- NEXPERIA B.V.
- Arnel Taduran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
- Publication number 20240128166
- Publication date Apr 18, 2024
- Mitsubishi Electric Corporation
- Hiroyuki MASUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR...
- Publication number 20240112990
- Publication date Apr 4, 2024
- Rohm Co., Ltd.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240105562
- Publication date Mar 28, 2024
- Kabushiki Kaisha Toshiba
- Taira Tabakoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME SPACER FOR DOUBLE-SIDED POWER MODULE
- Publication number 20240096734
- Publication date Mar 21, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Tzu-Hsuan CHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCED STRESS CLIP FOR SEMICONDUCTOR DIE
- Publication number 20240096765
- Publication date Mar 21, 2024
- NEXPERIA B.V.
- Homer Gler Malveda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, CHIP SYSTEM, METHOD OF FORMING A CHIP PACKAGE, AND ME...
- Publication number 20240087992
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Ke Yan Tean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240088086
- Publication date Mar 14, 2024
- Kabushiki Kaisha Toshiba
- Masatoshi ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240079368
- Publication date Mar 7, 2024
- Kabushiki Kaisha Toshiba
- Satoshi HATTORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240079296
- Publication date Mar 7, 2024
- ROHM CO., LTD.
- Takumi KANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240055330
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Younghwan PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A METAL CLIP AND RELATED METHODS OF MA...
- Publication number 20240055387
- Publication date Feb 15, 2024
- INFINEON TECHNOLOGIES AG
- Engku Izyan Munirah E Afandi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240055328
- Publication date Feb 15, 2024
- ROHM CO., LTD.
- Atsushi YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH PLURALITY OF LEADS AND SEALING RESIN
- Publication number 20240038635
- Publication date Feb 1, 2024
- Rohm Co., Ltd.
- Mamoru YAMAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20240040702
- Publication date Feb 1, 2024
- HITACHI,ASTEMO, LTD.
- Takeshi TOKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240006368
- Publication date Jan 4, 2024
- ROHM CO., LTD.
- Takumi KANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20230411257
- Publication date Dec 21, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Siang Miang YEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230402348
- Publication date Dec 14, 2023
- Rohm Co., Ltd.
- Yosui FUTAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE HAVING AN EMBEDDED INLAY
- Publication number 20230369177
- Publication date Nov 16, 2023
- Marcus Boehm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH HIGH DRAFT ANGLE PACKAGE STRUCTURE
- Publication number 20230361008
- Publication date Nov 9, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Wei Fen Sueann Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MARKING A SEMICONDUCTOR PACKAGE
- Publication number 20230352422
- Publication date Nov 2, 2023
- Infineon Technologies Austria AG
- Hwee Yin Low
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230352376
- Publication date Nov 2, 2023
- Rohm Co., Ltd.
- Takumi KANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20230352374
- Publication date Nov 2, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Min BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230335475
- Publication date Oct 19, 2023
- Rohm Co., Ltd.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURE
- Publication number 20230317576
- Publication date Oct 5, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Stephen ST. GERMAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AN...
- Publication number 20230307326
- Publication date Sep 28, 2023
- Mitsubishi Electric Corporation
- Takatoshi YASUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230307329
- Publication date Sep 28, 2023
- Kabushiki Kaisha Toshiba
- Atsushi TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONIC ASSEMBLY AND POWER MODULE FOR EMBEDDING IN A PRINT...
- Publication number 20230282553
- Publication date Sep 7, 2023
- INFINEON TECHNOLOGIES AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL COOL POWER MODULE WITH STRESS BUFFER LAYER
- Publication number 20230253393
- Publication date Aug 10, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jonghwan BAEK
- H01 - BASIC ELECTRIC ELEMENTS

the additional leads being a tape carrier or flat leads

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Lead frame assembly for a semiconductor device

Semiconductor device

Semiconductor power module

Process for thin film capacitor integration

Semiconductor device

Plurality of lead frames for cooling a power device

Semiconductor device having a carrier, semiconductor chip packages...

Semiconductor module

Semiconductor package with plurality of leads and sealing resin

High current packages with reduced solder layer count

Semiconductor device package assemblies with direct leadframe attac...

Semiconductor device having outer terminal portions with conductive...

Semiconductor device having a metallization structure

Integrated circuit chip with a vertical connector

Semiconductor device

Double side heat dissipation for silicon chip package

Leadframe spacer for double-sided power module

Semiconductor package with plurality of leads and sealing resin

Semiconductor device and power converter

Semiconductor device having a metal clip with a solder volume balan...

Method of manufacturing a semiconductor device

Power module including lead frame unit connecting first substrate a...

Split tie bar for clip stability

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor package structures and methods of manufacture

Multi-layer interconnection ribbon

Power semiconductor module for PCB embedding, power electronic asse...

Semiconductor devices having a plurality of offsets in leads suppor...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING COMPON...

SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING SUCH SEMICONDUC...

SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR...

SEMICONDUCTOR DEVICE

LEADFRAME SPACER FOR DOUBLE-SIDED POWER MODULE

REDUCED STRESS CLIP FOR SEMICONDUCTOR DIE

CHIP PACKAGE, CHIP SYSTEM, METHOD OF FORMING A CHIP PACKAGE, AND ME...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR PACKAGE HAVING A METAL CLIP AND RELATED METHODS OF MA...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE WITH PLURALITY OF LEADS AND SEALING RESIN

POWER SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

MOLDED SEMICONDUCTOR PACKAGE HAVING AN EMBEDDED INLAY

ELECTRONIC DEVICE WITH HIGH DRAFT ANGLE PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD FOR MARKING A SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AN...

SEMICONDUCTOR DEVICE

POWER ELECTRONIC ASSEMBLY AND POWER MODULE FOR EMBEDDING IN A PRINT...

DUAL COOL POWER MODULE WITH STRESS BUFFER LAYER