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H01L2224/48221

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48221the body and the item being stacked

Industries

Patents Grantslast 30 patents

Information Patent Grant
Signal routing between memory die and logic die
- Patent number 12,165,696
- Issue date Dec 10, 2024
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Memory device for wafer-on-wafer formed memory and logic
- Patent number 12,112,792
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Glen E. Hush
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Signal routing between memory die and logic die for mode based oper...
- Patent number 12,112,793
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer-on-wafer formed memory and logic for genomic annotations
- Patent number 11,915,742
- Issue date Feb 27, 2024
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package structure and methods of manufacturing the same
- Patent number 11,658,170
- Issue date May 23, 2023
- Advanced Semiconductor Engineering, Inc.
- Wei Tsung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Straight wirebonding of silicon dies
- Patent number 11,456,272
- Issue date Sep 27, 2022
- Western Digital Technologies, Inc.
- Kirubakaran Periyannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assemblies and cooling structures having metalized exte...
- Patent number 11,121,060
- Issue date Sep 14, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Yuji Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,101,204
- Issue date Aug 24, 2021
- Shindengen Electric Manufacturing Co., Ltd.
- Yoshihisa Ieiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packages and methods for forming the same
- Patent number 10,950,563
- Issue date Mar 16, 2021
- Shunsin Technology (Zhong Shan) Limited
- Wang-Lai Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip packages and methods for forming the same
- Patent number 10,867,942
- Issue date Dec 15, 2020
- Shunsin Technology (Zhong Shan) Limited
- Wang-Lai Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor package structure
- Patent number 10,825,851
- Issue date Nov 3, 2020
- KINGPAK TECHNOLOGY INC.
- Sheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packages and methods for forming the same
- Patent number 10,818,619
- Issue date Oct 27, 2020
- Shunsin Technology (Zhong Shan) Limited
- Wang-Lai Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip packages and methods for forming the same
- Patent number 10,770,417
- Issue date Sep 8, 2020
- Shunsin Technology (Zhong Shan) Limited
- Wang-Lai Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronics assemblies and cooling structures having metalized exte...
- Patent number 10,615,100
- Issue date Apr 7, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Yuji Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,553,523
- Issue date Feb 4, 2020
- Shindengen Electric Manufacturing Co., Ltd.
- Yoshihiro Kamiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,510,725
- Issue date Dec 17, 2019
- TOSHIBA MEMORY CORPORATION
- Kazushige Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rectangular semiconductor package and a method of manufacturing the...
- Patent number 10,269,718
- Issue date Apr 23, 2019
- WALTON ADVANCED ENGINEERING INC.
- Hong Chi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic-packaged semiconductor device having wires with polymerized...
- Patent number 10,199,348
- Issue date Feb 5, 2019
- Texas Instruments Incorporated
- Rongwei Zhang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor power device including adjacent thermal substrate for...
- Patent number 10,141,238
- Issue date Nov 27, 2018
- Integra Technologies, Inc.
- William Veitschegger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with thermal dissipation structure and method for form...
- Patent number 9,870,975
- Issue date Jan 16, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC carrier of semiconductor package and manufacturing method thereof
- Patent number 9,806,012
- Issue date Oct 31, 2017
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,337,172
- Issue date May 10, 2016
- Panasonic Corporation
- Shigefumi Dohi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-floor type MEMS microphone
- Patent number 9,319,772
- Issue date Apr 19, 2016
- Merry Electronics (Shenzhen) Co., Ltd.
- Jen-Yi Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device assemblies including face-to-face semiconducto...
- Patent number 9,269,695
- Issue date Feb 23, 2016
- Micron Technology, Inc.
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing a semiconductor device
- Patent number 8,592,260
- Issue date Nov 26, 2013
- Nitto Denko Corporation
- Masami Oikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device assemblies including face-to-face semiconducto...
- Patent number 8,384,200
- Issue date Feb 26, 2013
- Micron Technology, Inc.
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition, film-like adhesive, adhesive sheet and semico...
- Patent number 8,373,283
- Issue date Feb 12, 2013
- Hitachi Chemical Company, Ltd.
- Takashi Masuko
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for packaging semiconductor dies having through-silicon vias
- Patent number 8,124,458
- Issue date Feb 28, 2012
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Yuan Su
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for packaging semiconductor dies having through-silicon vias
- Patent number 7,825,517
- Issue date Nov 2, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Yuan Su
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device having an improved connection arrangement betw...
- Patent number 5,777,391
- Issue date Jul 7, 1998
- Hitachi, Ltd.
- Atsushi Nakamura
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE FOR MODE BASED OPER...
- Publication number 20250006251
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC
- Publication number 20240420757
- Publication date Dec 19, 2024
- Micron Technology, Inc.
- Glen E. Hush
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240304579
- Publication date Sep 12, 2024
- Macronix International Co., Ltd.
- Dai-Ying LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light-Receiving Element and Light Receiving Circuit
- Publication number 20240222532
- Publication date Jul 4, 2024
- Nippon Telegraph and Telephone Corporation
- Atsushi Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF
- Publication number 20240153833
- Publication date May 9, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES, ASSEMBLIES, AND ASSOCIATED METHODS
- Publication number 20240072002
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Raj K. Bansal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240072020
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- JAE CHOON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20240047407
- Publication date Feb 8, 2024
- STMicroelectronics (Grenoble 2) SAS
- Younes BOUTALEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240021550
- Publication date Jan 18, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240021551
- Publication date Jan 18, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230411341
- Publication date Dec 21, 2023
- SONY GROUP CORPORATION
- Koichi ONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSS STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS
- Publication number 20230378128
- Publication date Nov 23, 2023
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS
- Publication number 20230378129
- Publication date Nov 23, 2023
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH EMBEDDED BATTERY AND METHOD THEREFOR
- Publication number 20230343683
- Publication date Oct 26, 2023
- NXP USA, Inc.
- Stephen Ryan Hooper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER COMPONENT FOR ELECTRIC OR HYBRID AIRCRAFT
- Publication number 20230343676
- Publication date Oct 26, 2023
- Airbus SAS
- Gowtham GALLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION PACKAGE WITH HIGH THERMAL CONDUCTIVITY
- Publication number 20230317568
- Publication date Oct 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Daiki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR USING SPACER-ON-SPACER DESIGN FOR SOLDER...
- Publication number 20230207488
- Publication date Jun 29, 2023
- Micron Technology, Inc.
- Faxing Che
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...
- Publication number 20230154888
- Publication date May 18, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Jon W. Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMORY DIE AND LOGIC DIE WITH WAFER-ON-WAFER BOND
- Publication number 20230048103
- Publication date Feb 16, 2023
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY AND MANUFACTURING METHOD
- Publication number 20230014357
- Publication date Jan 19, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Xiaofei SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT OPTICAL PACKAGE
- Publication number 20220392820
- Publication date Dec 8, 2022
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME
- Publication number 20220310576
- Publication date Sep 29, 2022
- Advanced Semiconductor Engineering, Inc.
- Wei Tsung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, ELECTRONIC APPARATUS, AND METHOD FOR MANUFAC...
- Publication number 20220208718
- Publication date Jun 30, 2022
- Sony Semiconductor Solutions Corporation
- YASUSHI OTSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRAIGHT WIREBONDING OF SILICON DIES
- Publication number 20220084979
- Publication date Mar 17, 2022
- Western Digital Technologies, Inc.
- Kirubakaran Periyannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20210167003
- Publication date Jun 3, 2021
- SHINDENGEN ELECTRIC MAUFACTURING CO., LTD.
- Yoshihisa Ieiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20200388585
- Publication date Dec 10, 2020
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- WANG-LAI YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20200335462
- Publication date Oct 22, 2020
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- WANG-LAI YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONICS ASSEMBLIES AND COOLING STRUCTURES HAVING METALIZED EXTE...
- Publication number 20200194342
- Publication date Jun 18, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Yuji Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING FILM AND TAPE FOR WAFER PROCESSING
- Publication number 20190273062
- Publication date Sep 5, 2019
- FURUKAWA ELECTRIC CO., LTD.
- Hidemichi FUJIWARA
- B32 - LAYERED PRODUCTS
Information Patent Application
CHIP PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20190172805
- Publication date Jun 6, 2019
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- WANG-LAI YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY

the body and the item being stacked

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Signal routing between memory die and logic die

Memory device for wafer-on-wafer formed memory and logic

Signal routing between memory die and logic die for mode based oper...

Wafer-on-wafer formed memory and logic for genomic annotations

Semiconductor package structure and methods of manufacturing the same

Straight wirebonding of silicon dies

Electronics assemblies and cooling structures having metalized exte...

Semiconductor module

Chip packages and methods for forming the same

Chip packages and methods for forming the same

Sensor package structure

Chip packages and methods for forming the same

Chip packages and methods for forming the same

Electronics assemblies and cooling structures having metalized exte...

Semiconductor device

Semiconductor device

Rectangular semiconductor package and a method of manufacturing the...

Plastic-packaged semiconductor device having wires with polymerized...

Semiconductor power device including adjacent thermal substrate for...

Chip package with thermal dissipation structure and method for form...

IC carrier of semiconductor package and manufacturing method thereof

Semiconductor device

Multi-floor type MEMS microphone

Semiconductor device assemblies including face-to-face semiconducto...

Process for producing a semiconductor device

Semiconductor device assemblies including face-to-face semiconducto...

Adhesive composition, film-like adhesive, adhesive sheet and semico...

Method for packaging semiconductor dies having through-silicon vias

Method for packaging semiconductor dies having through-silicon vias

Semiconductor device having an improved connection arrangement betw...

Patents Applicationslast 30 patents

SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE FOR MODE BASED OPER...

MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

Light-Receiving Element and Light Receiving Circuit

PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF

SEMICONDUCTOR DEVICES, ASSEMBLIES, AND ASSOCIATED METHODS

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT PACKAGE

BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

CROSS STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS

THROUGH STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS

SEMICONDUCTOR DEVICE WITH EMBEDDED BATTERY AND METHOD THEREFOR

POWER COMPONENT FOR ELECTRIC OR HYBRID AIRCRAFT

ISOLATION PACKAGE WITH HIGH THERMAL CONDUCTIVITY

METHODS AND APPARATUS FOR USING SPACER-ON-SPACER DESIGN FOR SOLDER...

METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...

MEMORY DIE AND LOGIC DIE WITH WAFER-ON-WAFER BOND

SEMICONDUCTOR PACKAGE ASSEMBLY AND MANUFACTURING METHOD

INTEGRATED CIRCUIT OPTICAL PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE, ELECTRONIC APPARATUS, AND METHOD FOR MANUFAC...

STRAIGHT WIREBONDING OF SILICON DIES

SEMICONDUCTOR MODULE

CHIP PACKAGES AND METHODS FOR FORMING THE SAME

CHIP PACKAGES AND METHODS FOR FORMING THE SAME

ELECTRONICS ASSEMBLIES AND COOLING STRUCTURES HAVING METALIZED EXTE...

JOINING FILM AND TAPE FOR WAFER PROCESSING

CHIP PACKAGES AND METHODS FOR FORMING THE SAME