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SEMICONDUCTOR PACKAGE
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Publication number 20240072020
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Publication date Feb 29, 2024
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Samsung Electronics Co., Ltd.
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JAE CHOON KIM
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H01 - BASIC ELECTRIC ELEMENTS
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INTEGRATED CIRCUIT PACKAGE
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Publication number 20240047407
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Publication date Feb 8, 2024
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STMicroelectronics (Grenoble 2) SAS
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Younes BOUTALEB
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H01 - BASIC ELECTRIC ELEMENTS
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INTEGRATED CIRCUIT OPTICAL PACKAGE
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Publication number 20220392820
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Publication date Dec 8, 2022
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STMicroelectronics (Grenoble 2) SAS
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Romain COFFY
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H01 - BASIC ELECTRIC ELEMENTS
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STRAIGHT WIREBONDING OF SILICON DIES
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Publication number 20220084979
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Publication date Mar 17, 2022
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Western Digital Technologies, Inc.
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Kirubakaran Periyannan
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR MODULE
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Publication number 20210167003
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Publication date Jun 3, 2021
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SHINDENGEN ELECTRIC MAUFACTURING CO., LTD.
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Yoshihisa Ieiri
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20190088625
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Publication date Mar 21, 2019
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Toshiba Memory Corporation
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Kazushige KAWASAKI
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G11 - INFORMATION STORAGE
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SEMICONDUCTOR DEVICE
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Publication number 20180269132
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Publication date Sep 20, 2018
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SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
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Yoshihiro KAMIYAMA
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H01 - BASIC ELECTRIC ELEMENTS
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