the bonding area being at least partially embedded in the surface of the body

Industry

CPC
H01L2224/08112

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/08112the bonding area being at least partially embedded in the surface of the body

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method for forming a three-dimensional (3D) memory device having bo...
- Patent number 12,080,697
- Issue date Sep 3, 2024
- Yangtze Memory Technologies Co., Ltd.
- Shiqi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,948,881
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via connection to wiring in a semiconductor device
- Patent number 11,923,291
- Issue date Mar 5, 2024
- Kioxia Corporation
- Atsushi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,830,838
- Issue date Nov 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded three-dimensional memory devices having bonding layers
- Patent number 11,450,653
- Issue date Sep 20, 2022
- Yangtze Memory Technologies Co., Ltd.
- Shiqi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,264,345
- Issue date Mar 1, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded three-dimensional memory devices and methods for forming the...
- Patent number 11,233,041
- Issue date Jan 25, 2022
- Yangtze Memory Technologies Co., Ltd.
- Shiqi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,069,614
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor structure
- Patent number 10,692,809
- Issue date Jun 23, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and manufacturing method thereof
- Patent number 10,128,182
- Issue date Nov 13, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having gaps within the conductive parts
- Patent number 10,090,351
- Issue date Oct 2, 2018
- TOSHIBA MEMORY CORPORATION
- Hiroaki Ashidate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a low-adhesive bond substrate pair
- Patent number 9,679,867
- Issue date Jun 13, 2017
- Kabushiki Kaisha Toshiba
- Hiroaki Ashidate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer arrangement, a method for testing a wafer, and a method for p...
- Patent number 9,627,341
- Issue date Apr 18, 2017
- Infineon Technologies Dresden GmbH
- Peter Brockhaus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing a semiconductor d...
- Patent number 9,613,930
- Issue date Apr 4, 2017
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having substrate with embedded metal trace overlapped by la...
- Patent number 9,559,076
- Issue date Jan 31, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip stack with electrically insulating walls
- Patent number 9,418,976
- Issue date Aug 16, 2016
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, imaging device and semiconductor device manuf...
- Patent number 9,343,498
- Issue date May 17, 2016
- Olympus Corporation
- Haruhisa Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having substrate with embedded metal trace overlapped by la...
- Patent number 9,305,890
- Issue date Apr 5, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for hybrid wafer bonding
- Patent number 8,802,538
- Issue date Aug 12, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for low temperature wafer bonding and bonded structure
- Patent number 8,802,541
- Issue date Aug 12, 2014
- Lexvu Opto Microelectronics Technology (Shanghai) Ltd
- Zhiwei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic chip, component containing such a chip and manufact...
- Patent number 8,716,843
- Issue date May 6, 2014
- STMicroelectronics S.A.
- Laurent Gay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical assembly
- Patent number 8,508,952
- Issue date Aug 13, 2013
- Gemalto SA
- Beatrice Bonvalot
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Process to allow electrical and mechanical connection of an electri...
- Patent number 8,429,813
- Issue date Apr 30, 2013
- Gemalto SA
- Beatrice Bonvalot
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
Reducing warpage in a package of stacked integrated circuit dies
- Publication number 20250029948
- Publication date Jan 23, 2025
- Marvell Asia Pte Ltd.
- Runzi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20250015038
- Publication date Jan 9, 2025
- STMicroelectronics International N.V.
- Pierangelo MAGNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA DEVICE AND METHOD OF MANUFACTURING ANTENNA DEVICE
- Publication number 20240363994
- Publication date Oct 31, 2024
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Compartment Shielding fo...
- Publication number 20240321845
- Publication date Sep 26, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240304579
- Publication date Sep 12, 2024
- Macronix International Co., Ltd.
- Dai-Ying LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240274541
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-HSUAN TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH R...
- Publication number 20240250009
- Publication date Jul 25, 2024
- QUALCOMM Incorporated
- Seongryul Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20240243085
- Publication date Jul 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF ASSEMBLING SAME
- Publication number 20240194560
- Publication date Jun 13, 2024
- Western Digital Technologies, Inc.
- Chee Seng Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240194626
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- SOOJEOUNG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRUCIFORM BONDING STRUCTURE FOR 3D-IC
- Publication number 20240128216
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20240088093
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240079362
- Publication date Mar 7, 2024
- SK HYNIX INC.
- Jin Won PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240072020
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- JAE CHOON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCT...
- Publication number 20240063181
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240021577
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING ALIGNED FRONT-END INTERFACE CONTACTS A...
- Publication number 20230395569
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20230395536
- Publication date Dec 7, 2023
- Murata Manufacturing Co., Ltd.
- Naohide TOMITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM PACKAGE AND PACKAGE MODULE INCLUDING THE SAME
- Publication number 20230369265
- Publication date Nov 16, 2023
- Samsung Electronics Co., Ltd.
- Narae SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE
- Publication number 20230282625
- Publication date Sep 7, 2023
- MEDIATEK INC.
- Ta-Jen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20230215827
- Publication date Jul 6, 2023
- MURATA MANUFACTURING CO., LTD.
- Kiyohiro KASHIUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230197553
- Publication date Jun 22, 2023
- Samsung Electronics Co., Ltd.
- KYUNGDON MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20220254746
- Publication date Aug 11, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. ENQUIST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE, PACKAGING STRUCTURE AND MANUFACTURING METHOD OF CHI...
- Publication number 20220223560
- Publication date Jul 14, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Zengyan FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE...
- Publication number 20220068905
- Publication date Mar 3, 2022
- Yangtze Memory Technologies Co., Ltd.
- Shiqi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20210335708
- Publication date Oct 28, 2021
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- HSI-KUEI CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210265265
- Publication date Aug 26, 2021
- KIOXIA Corporation
- Atsushi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210257324
- Publication date Aug 19, 2021
- Samsung Electronics Co., Ltd.
- SOOJEOUNG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE...
- Publication number 20210134778
- Publication date May 6, 2021
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Shiqi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE...
- Publication number 20210134779
- Publication date May 6, 2021
- Yangtze Memory Technologies Co., Ltd.
- Shiqi Huang
- H01 - BASIC ELECTRIC ELEMENTS

the bonding area being at least partially embedded in the surface of the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for forming a three-dimensional (3D) memory device having bo...

Semiconductor structure

Via connection to wiring in a semiconductor device

Conductive barrier direct hybrid bonding

Bonded three-dimensional memory devices having bonding layers

Conductive barrier direct hybrid bonding

Bonded three-dimensional memory devices and methods for forming the...

Semiconductor package structure

Manufacturing method for semiconductor structure

Semiconductor package structure and manufacturing method thereof

Semiconductor device having gaps within the conductive parts

Semiconductor device having a low-adhesive bond substrate pair

Wafer arrangement, a method for testing a wafer, and a method for p...

Semiconductor device and method for manufacturing a semiconductor d...

Package having substrate with embedded metal trace overlapped by la...

Chip stack with electrically insulating walls

Semiconductor device, imaging device and semiconductor device manuf...

Package having substrate with embedded metal trace overlapped by la...

Methods for hybrid wafer bonding

Method for low temperature wafer bonding and bonded structure

Microelectronic chip, component containing such a chip and manufact...

Electrical assembly

Process to allow electrical and mechanical connection of an electri...

Patents Applicationslast 30 patents

Reducing warpage in a package of stacked integrated circuit dies

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

ANTENNA DEVICE AND METHOD OF MANUFACTURING ANTENNA DEVICE

Semiconductor Device and Method of Forming Compartment Shielding fo...

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH R...

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

MEMORY DEVICE AND METHOD OF ASSEMBLING SAME

SEMICONDUCTOR PACKAGE

CRUCIFORM BONDING STRUCTURE FOR 3D-IC

Integrated Circuit Packages and Methods of Forming the Same

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCT...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICES HAVING ALIGNED FRONT-END INTERFACE CONTACTS A...

RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE

FILM PACKAGE AND PACKAGE MODULE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE

ELECTRONIC COMPONENT

SEMICONDUCTOR PACKAGE

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

CHIP STRUCTURE, PACKAGING STRUCTURE AND MANUFACTURING METHOD OF CHI...

BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE...

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE...

BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE...