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the bonding area connecting to a bonding area disposed in a recess of the surface of the item

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  • CPC
  • H01L2224/08257
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/08257the bonding area connecting to a bonding area disposed in a recess of the surface of the item
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Patents Grantslast 30 patents

  • Information Patent Grant

    Low temperature bonded structures
    • Patent number 12,046,571
    • Issue date Jul 23, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Low temperature bonded structures
    • Patent number 11,515,279
    • Issue date Nov 29, 2022
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Low temperature bonded structures
    • Patent number 10,790,262
    • Issue date Sep 29, 2020
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Small footprint semiconductor package
    • Patent number 9,666,557
    • Issue date May 30, 2017
    • Infineon Technologies AG
    • Tian San Tan
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents