the bonding area connecting to a bonding area protruding from the surface of the body

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H01L2224/08148

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/08148the bonding area connecting to a bonding area protruding from the surface of the body

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,142,544
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Taehwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged multi-chip semiconductor devices and methods of fabricatin...
- Patent number 12,132,019
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding method and semiconductor chip structure
- Patent number 12,119,315
- Issue date Oct 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic sense amplifier supply voltage for power and die size reduc...
- Patent number 11,978,516
- Issue date May 7, 2024
- SANDISK TECHNOLOGIES LLC
- Yanjie Wang
- G11 - INFORMATION STORAGE
Information Patent Grant
Display device having pixels with the same active layer and method...
- Patent number 11,942,025
- Issue date Mar 26, 2024
- Samsung Display Co., Ltd.
- Jin Wan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature hybrid bonding
- Patent number 11,911,839
- Issue date Feb 27, 2024
- Advanced Micro Devices, Inc.
- Priyal Shah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
- Patent number 11,881,476
- Issue date Jan 23, 2024
- Semtech Corporation
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,869,870
- Issue date Jan 9, 2024
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device
- Patent number 11,862,235
- Issue date Jan 2, 2024
- RAMBUS INC.
- Frederick A. Ware
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with air gap
- Patent number 11,830,837
- Issue date Nov 28, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,823,980
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged multi-chip semiconductor devices and methods of fabricatin...
- Patent number 11,552,033
- Issue date Jan 10, 2023
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device
- Patent number 11,489,008
- Issue date Nov 1, 2022
- Toyoda Gosei Co., Ltd.
- Koichi Goshonoo
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,488,930
- Issue date Nov 1, 2022
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,462,496
- Issue date Oct 4, 2022
- Kioxia Corporation
- Masayoshi Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bonding semiconductor structures and semiconductor devi...
- Patent number 11,450,637
- Issue date Sep 20, 2022
- Yangtze Memory Technologies Co., Ltd.
- Di Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die containing silicon nitride stress compensating re...
- Patent number 11,430,745
- Issue date Aug 30, 2022
- SanDisk Technologies LLC
- Chen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
- Patent number 11,373,990
- Issue date Jun 28, 2022
- Semtech Corporation
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device with chip-to-chip bonding structure
- Patent number 11,374,016
- Issue date Jun 28, 2022
- SK hynix Inc.
- Sung Lae Oh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package with air gap and manufacturing method thereof
- Patent number 11,302,662
- Issue date Apr 12, 2022
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly containing laterally bonded bonding pads and method...
- Patent number 11,239,204
- Issue date Feb 1, 2022
- SanDisk Technologies LLC
- Chen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,211,339
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device
- Patent number 11,170,842
- Issue date Nov 9, 2021
- RAMBUS INC.
- Frederick A. Ware
- G11 - INFORMATION STORAGE
Information Patent Grant
Back biasing of FD-SOI circuit blocks
- Patent number 11,127,738
- Issue date Sep 21, 2021
- Xcelsis Corporation
- Javier A. Delacruz
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 10,910,341
- Issue date Feb 2, 2021
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, 3DIC structure and method of fabricating t...
- Patent number 10,886,245
- Issue date Jan 5, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for bonding conductive layers exposed from sur...
- Patent number 10,840,204
- Issue date Nov 17, 2020
- TOSHIBA MEMORY CORPORATION
- Atsuko Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanowire enabled substrate bonding and electrical contact formation
- Patent number 10,833,048
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Li-Wen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging through pre-formed metal pins
- Patent number 10,734,345
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical chip interposer and method of making a chip assembly conta...
- Patent number 10,700,028
- Issue date Jun 30, 2020
- SanDisk Technologies LLC
- Akio Nishida
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method
- Publication number 20240413012
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVED BONDING STRUCTURES FOR SEMICONDUCTOR DEVICES AND METHODS O...
- Publication number 20240321817
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240265854
- Publication date Aug 8, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jin Wan KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
ELECTRICAL CONNECTION AND FORMING METHOD THEREOF
- Publication number 20240234351
- Publication date Jul 11, 2024
- National Yang Ming Chiao Tung University
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY STACK STRUCTURE INCLUDING POWER DISTRIBUTION STRUCTURES AND...
- Publication number 20240213219
- Publication date Jun 27, 2024
- SK HYNIX INC.
- Je Min BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE
- Publication number 20240203483
- Publication date Jun 20, 2024
- Rambus Inc.
- Frederick A. Ware
- G11 - INFORMATION STORAGE
Information Patent Application
INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES
- Publication number 20240194657
- Publication date Jun 13, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240170455
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Yonghoe CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240170464
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Chajea JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240145366
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Dongjoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION AND FORMING METHOD THEREOF
- Publication number 20240136313
- Publication date Apr 25, 2024
- National Yang Ming Chiao Tung University
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240128135
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- GYOSOO CHOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICALLY INTERCONNECTED SEMICONDUC...
- Publication number 20240120317
- Publication date Apr 11, 2024
- Western Digital Technologies, Inc.
- Cheng-Hsiung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240096717
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- AE-NEE JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240071995
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Raeyoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH VOLUMETRICALLY-EXPANDED SIDE-CONNECTED IN...
- Publication number 20240071970
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240072003
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MANUFACTURED THROUGH A THERMOCOMPRESSION PROC...
- Publication number 20240063167
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED DEBUGGING ELEMENTS FOR INTEGRATED CIRCUITS AND METHODS FOR D...
- Publication number 20240055407
- Publication date Feb 15, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Thomas Workman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240055406
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Yeongseon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240038739
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Jongwon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20240030187
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240021591
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- Taeyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC TERM...
- Publication number 20240021628
- Publication date Jan 18, 2024
- Shenzhen china Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Zhuhui LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH PACKAGE STRUCTURE
- Publication number 20230395466
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Haklay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR CONSTRUCTION OF HYBRID-BONDED SEMICONDUCTOR DIE ASSEMBLIES...
- Publication number 20230395545
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACKING STRUCTURE, SEMICONDUCTOR PACKAGE AND FORMATION METHOD...
- Publication number 20230369156
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Chun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230369172
- Publication date Nov 16, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DIAMOND SUBSTRATE FOR THERMAL MANAGEMENT
- Publication number 20230317692
- Publication date Oct 5, 2023
- Raytheon Company
- Jarrod Vaillancourt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20230230945
- Publication date Jul 20, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS

the bonding area connecting to a bonding area protruding from the surface of the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Packaged multi-chip semiconductor devices and methods of fabricatin...

Chip bonding method and semiconductor chip structure

Dynamic sense amplifier supply voltage for power and die size reduc...

Display device having pixels with the same active layer and method...

Low temperature hybrid bonding

Semiconductor device and method of stacking semiconductor die for s...

Bonding process with inhibited oxide formation

Stacked semiconductor device

Semiconductor package with air gap

Package structure and manufacturing method thereof

Packaged multi-chip semiconductor devices and methods of fabricatin...

Light-emitting device

Bonding process with inhibited oxide formation

Semiconductor device

Methods for bonding semiconductor structures and semiconductor devi...

Semiconductor die containing silicon nitride stress compensating re...

Semiconductor device and method of stacking semiconductor die for s...

Semiconductor memory device with chip-to-chip bonding structure

Semiconductor package with air gap and manufacturing method thereof

Bonded assembly containing laterally bonded bonding pads and method...

Semiconductor device

Stacked semiconductor device

Back biasing of FD-SOI circuit blocks

Bonding process with inhibited oxide formation

Semiconductor structure, 3DIC structure and method of fabricating t...

Semiconductor device for bonding conductive layers exposed from sur...

Nanowire enabled substrate bonding and electrical contact formation

Packaging through pre-formed metal pins

Vertical chip interposer and method of making a chip assembly conta...

Patents Applicationslast 30 patents

Semiconductor Device and Method

IMPROVED BONDING STRUCTURES FOR SEMICONDUCTOR DEVICES AND METHODS O...

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRICAL CONNECTION AND FORMING METHOD THEREOF

MEMORY STACK STRUCTURE INCLUDING POWER DISTRIBUTION STRUCTURES AND...

STACKED SEMICONDUCTOR DEVICE

INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

ELECTRICAL CONNECTION AND FORMING METHOD THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING VERTICALLY INTERCONNECTED SEMICONDUC...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH VOLUMETRICALLY-EXPANDED SIDE-CONNECTED IN...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE MANUFACTURED THROUGH A THERMOCOMPRESSION PROC...

BONDED DEBUGGING ELEMENTS FOR INTEGRATED CIRCUITS AND METHODS FOR D...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR PACKAGE

DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC TERM...

HIGH BANDWIDTH PACKAGE STRUCTURE

MODULAR CONSTRUCTION OF HYBRID-BONDED SEMICONDUCTOR DIE ASSEMBLIES...

DIE STACKING STRUCTURE, SEMICONDUCTOR PACKAGE AND FORMATION METHOD...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

INTEGRATED DIAMOND SUBSTRATE FOR THERMAL MANAGEMENT

PACKAGE STRUCTURE AND METHOD FOR FORMING SAME