the bump connector being disposed in a recess of the surface

Industry

CPC
H01L2224/13021

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13021the bump connector being disposed in a recess of the surface

Industries

Patents Grantslast 30 patents

Information Patent Grant
Board unit and semiconductor device
- Patent number 12,080,677
- Issue date Sep 3, 2024
- Kioxia Corporation
- Katsuya Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit package
- Patent number 12,068,297
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor schottky rectifier device
- Patent number 12,051,728
- Issue date Jul 30, 2024
- Diodes Incorporated
- Kolins Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 12,035,472
- Issue date Jul 9, 2024
- Amkor Technology Singapore Holding Ptd. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal pads between stacked semiconductor dies and associated syst...
- Patent number 12,033,980
- Issue date Jul 9, 2024
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,002,775
- Issue date Jun 4, 2024
- Innolux Corporation
- Maggy Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,996,401
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro light emitting diode display panel, manufacturing method ther...
- Patent number 11,978,840
- Issue date May 7, 2024
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Xueru Mei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor Schottky rectifier device
- Patent number 11,916,117
- Issue date Feb 27, 2024
- Diodes Incorporated
- Kolins Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bump of a semiconductor device and fabricating method th...
- Patent number 11,837,562
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector structure and method of forming same
- Patent number 11,824,026
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having through silicon vias and manufacturing...
- Patent number 11,817,427
- Issue date Nov 14, 2023
- LONGITUDE LICENSING LIMITED
- Ryohei Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming package structure
- Patent number 11,817,437
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device having a dummy section
- Patent number 11,798,847
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Osamu Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 11,791,286
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Youn-ji Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display panel, display panel, and display...
- Patent number 11,776,942
- Issue date Oct 3, 2023
- Shanghai Tianma Micro-Electronics Co., Ltd.
- Canyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure, packaging structure and manufacturing method for ch...
- Patent number 11,769,745
- Issue date Sep 26, 2023
- BOE Technology Group Co., Ltd.
- Zongmin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,769,743
- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Gayoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,735,542
- Issue date Aug 22, 2023
- Samsung Electronics Co., Ltd.
- Taeho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 11,700,692
- Issue date Jul 11, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,688,707
- Issue date Jun 27, 2023
- Samsung Electronics Co., Ltd.
- Joonho Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making wafer level chip scale pa...
- Patent number 11,676,938
- Issue date Jun 13, 2023
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,640,958
- Issue date May 2, 2023
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding element and method for manufacturing the same
- Patent number 11,621,241
- Issue date Apr 4, 2023
- NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- Han-Wen Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming bonding structures by using template layer as templates
- Patent number 11,594,484
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,587,897
- Issue date Feb 21, 2023
- Samsung Electronics Co., Ltd.
- Joongwon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor Schottky rectifier device
- Patent number 11,527,627
- Issue date Dec 13, 2022
- Diodes Incorporated
- Kolins Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structure and electronic device comprising the same
- Patent number 11,488,916
- Issue date Nov 1, 2022
- Innolux Corporation
- Maggy Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including dummy bump
- Patent number 11,450,632
- Issue date Sep 20, 2022
- Samsung Electronics Co., Ltd.
- Taeho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a semiconductor device bonded to a cir...
- Patent number 11,387,183
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SURFACE FINISHES FOR CONTACTS AND FIDUCIAL MARKERS ON INTEGRATED CI...
- Publication number 20240387396
- Publication date Nov 21, 2024
- Intel Corporation
- Jung Kyu Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALL-INORGANIC UP-CONVERSION DISPLAY
- Publication number 20240387494
- Publication date Nov 21, 2024
- National Tsing-Hua University
- Meng-Chyi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTEGRATED CIRCUIT PACKAGES
- Publication number 20240363610
- Publication date Oct 31, 2024
- Taiwan Semiconductor Mamufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...
- Publication number 20240347511
- Publication date Oct 17, 2024
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE
- Publication number 20240332157
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Sangjin Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...
- Publication number 20240332033
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Michele DERAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR PACKAGE WITH LIGHT SHIELDING MATERIAL
- Publication number 20240332328
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Hui-Tzu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING STACKED INDUCTORS WITH LOW OR NO MUTUA...
- Publication number 20240321730
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Hsiao-Tsung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE HAVING PLUGGED UP PORES IN AN ISLAND OR A PROTUBE...
- Publication number 20240321946
- Publication date Sep 26, 2024
- Murata Manufacturing Co., Ltd.
- Florent LALLEMAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20240297132
- Publication date Sep 5, 2024
- InnoLux Corporation
- Maggy HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DISPLAY DRIVER INCLUDING THE SAME
- Publication number 20240290769
- Publication date Aug 29, 2024
- LX Semicon Co., Ltd.
- Cheong Sik YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240290677
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Gyuseong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240282736
- Publication date Aug 22, 2024
- Japan Display Inc.
- Yoichi KAMIJO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DELAMINATION REDUCTION MECHANISM AND METH...
- Publication number 20240282733
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240274559
- Publication date Aug 15, 2024
- Innolux Corporation
- Chia-Ping Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240243028
- Publication date Jul 18, 2024
- Innolux Corporation
- Ming-Chih Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240243086
- Publication date Jul 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Sheng-Hsiang HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240162402
- Publication date May 16, 2024
- AUO Corporation
- Chia-Hui Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE, METHOD OF MANUFACTURING THE SAME AND TILED DISPLAY...
- Publication number 20240153966
- Publication date May 9, 2024
- SAMSUNG DISPLAY CO., LTD.
- Se Hun CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL HYBRID BONDED RF SWITCH WITH REDISTRIBUTION LAYER
- Publication number 20240153893
- Publication date May 9, 2024
- Qorvo US, Inc.
- Michael Carroll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ADVANCED PAD STRUCTURE AND METHOD FOR FOR...
- Publication number 20240153897
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING LAYER AND...
- Publication number 20240145404
- Publication date May 2, 2024
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240128218
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layer-By-Layer Formation Of Through-Substrate Via
- Publication number 20240120257
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240113089
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK REDISTRIBUTION LAYER FEATURES
- Publication number 20240088074
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Feng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240055385
- Publication date Feb 15, 2024
- WISTRON NEWEB CORPORATION
- KUO-HUA HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240047605
- Publication date Feb 8, 2024
- Japan Display Inc.
- Kazuyuki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL
- Publication number 20240038947
- Publication date Feb 1, 2024
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Qiang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240038550
- Publication date Feb 1, 2024
- InnoLux Corporation
- Chin-Lung TING
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

the bump connector being disposed in a recess of the surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Board unit and semiconductor device

Hybrid integrated circuit package

Semiconductor schottky rectifier device

Stackable via package and method

Thermal pads between stacked semiconductor dies and associated syst...

Electronic device

Packaged die and RDL with bonding structures therebetween

Micro light emitting diode display panel, manufacturing method ther...

Semiconductor Schottky rectifier device

Conductive bump of a semiconductor device and fabricating method th...

Connector structure and method of forming same

Semiconductor device having through silicon vias and manufacturing...

Method of forming package structure

Method for manufacturing a semiconductor device having a dummy section

Semiconductor device and semiconductor package

Method for manufacturing display panel, display panel, and display...

Chip structure, packaging structure and manufacturing method for ch...

Semiconductor package

Semiconductor package

Stackable via package and method

Semiconductor package

Semiconductor device and method of making wafer level chip scale pa...

Packaged die and RDL with bonding structures therebetween

Bonding element and method for manufacturing the same

Forming bonding structures by using template layer as templates

Semiconductor device

Semiconductor Schottky rectifier device

Conductive structure and electronic device comprising the same

Semiconductor package including dummy bump

Semiconductor package having a semiconductor device bonded to a cir...

Patents Applicationslast 30 patents

SURFACE FINISHES FOR CONTACTS AND FIDUCIAL MARKERS ON INTEGRATED CI...

ALL-INORGANIC UP-CONVERSION DISPLAY

HYBRID INTEGRATED CIRCUIT PACKAGES

THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...

SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...

OPTICAL SENSOR PACKAGE WITH LIGHT SHIELDING MATERIAL

INTEGRATED DEVICE COMPRISING STACKED INDUCTORS WITH LOW OR NO MUTUA...

INTEGRATED DEVICE HAVING PLUGGED UP PORES IN AN ISLAND OR A PROTUBE...

SUBSTRATE ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND DISPLAY DRIVER INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH DELAMINATION REDUCTION MECHANISM AND METH...

ELECTRONIC DEVICE

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

DISPLAY DEVICE

DISPLAY DEVICE, METHOD OF MANUFACTURING THE SAME AND TILED DISPLAY...

WAFER-LEVEL HYBRID BONDED RF SWITCH WITH REDISTRIBUTION LAYER

SEMICONDUCTOR DEVICE WITH ADVANCED PAD STRUCTURE AND METHOD FOR FOR...

CHIP PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING LAYER AND...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Layer-By-Layer Formation Of Through-Substrate Via

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

THICK REDISTRIBUTION LAYER FEATURES

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

DISPLAY PANEL

METHOD FOR MANUFACTURING ELECTRONIC DEVICE