the bump connector being disposed on at least two separate bonding areas

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CPC
H01L2224/13028

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13028the bump connector being disposed on at least two separate bonding areas

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Board unit and semiconductor device
- Patent number 12,080,677
- Issue date Sep 3, 2024
- Kioxia Corporation
- Katsuya Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with package-level configurability
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- Issue date Dec 19, 2023
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
WLCSP package with different solder volumes
- Patent number 11,581,280
- Issue date Feb 14, 2023
- STMicroelectronics Pte Ltd
- David Gani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed UBM and mixed pitch on a single die
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- Issue date Mar 8, 2022
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mounting semiconductor components
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- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with package-level configurability
- Patent number 10,930,645
- Issue date Feb 23, 2021
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed UBM and mixed pitch on a single die
- Patent number 10,818,623
- Issue date Oct 27, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with package-level configurability
- Patent number 10,580,767
- Issue date Mar 3, 2020
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split ball grid array pad for multi-chip modules
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- Issue date Nov 19, 2019
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated delay modules
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- Issue date Oct 22, 2019
- KUMU Networks, Inc.
- Wilhelm Steffen Hahn
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Information Patent Grant
Semiconductor device package with a conductive post
- Patent number 10,446,411
- Issue date Oct 15, 2019
- Advanced Semiconductor Engineering, Inc.
- Tien-Szu Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices with package-level configurability
- Patent number 10,312,232
- Issue date Jun 4, 2019
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed UBM and mixed pitch on a single die
- Patent number 10,249,586
- Issue date Apr 2, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die having a split solder pad
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- Issue date Jan 29, 2019
- EM Microelectronic-Marin SA
- Christoph Kuratli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with package-level configurability
- Patent number 10,128,229
- Issue date Nov 13, 2018
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip scale package and manufacturing method thereof
- Patent number 9,941,240
- Issue date Apr 10, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor device with through-substrate v...
- Patent number 9,870,988
- Issue date Jan 16, 2018
- AMS AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for routing die signals using external interco...
- Patent number 9,871,012
- Issue date Jan 16, 2018
- QUALCOMM Incorporated
- Vaishnav Srinivas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array system
- Patent number 9,867,295
- Issue date Jan 9, 2018
- Dell Products L.P.
- Bhavesh Patel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bumps bonds formed as metal line interconnects in a semiconductor d...
- Patent number 9,812,380
- Issue date Nov 7, 2017
- Microchip Technology Incorporated
- Greg Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level device and method with cantilever pillar structure
- Patent number 9,806,047
- Issue date Oct 31, 2017
- Maxim Integrated Products, Inc.
- Karthik Thambidurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor device with through-substrate v...
- Patent number 9,773,729
- Issue date Sep 26, 2017
- AMS AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with through-substrate via covered by a solder...
- Patent number 9,735,101
- Issue date Aug 15, 2017
- AMS AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,589,921
- Issue date Mar 7, 2017
- PS4 Luxco S.A.R.L.
- Mitsuaki Katagiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with through-substrate via covered by a solder...
- Patent number 9,553,039
- Issue date Jan 24, 2017
- AMS AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with bumps and display device module incorpora...
- Patent number 9,385,096
- Issue date Jul 5, 2016
- SYNAPTICS DISPLAY DEVICES GK
- Hisao Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure of semiconductor package, method for fabricating...
- Patent number 9,269,670
- Issue date Feb 23, 2016
- SK Hynix Inc.
- Seong Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures, architectures, systems, methods, algorithms and softwar...
- Patent number 8,963,342
- Issue date Feb 24, 2015
- Marvell International Ltd.
- Tyson Leistiko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure of semiconductor package, method for fabricating...
- Patent number 8,766,457
- Issue date Jul 1, 2014
- SK Hynix Inc.
- Seong Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for detecting solder wetting of pedestal sid...
- Patent number 8,629,557
- Issue date Jan 14, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED DEVICE HAVING AN INTEGRATED PASSIVE DEVICE WITH WAFER LEVE...
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- H01 - BASIC ELECTRIC ELEMENTS
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INTEGRATED DEVICE COMPRISING ELONGATED PADS
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- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED SIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240128142
- Publication date Apr 18, 2024
- JCET GROUP CO., LTD.
- Shuo Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE INCLUDING A WIRING PAD AND METHOD FOR MANUFACTURING...
- Publication number 20230207573
- Publication date Jun 29, 2023
- SAMSUNG DISPLAY CO., LTD.
- JI WOONG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD UNIT AND SEMICONDUCTOR DEVICE
- Publication number 20230086136
- Publication date Mar 23, 2023
- KIOXIA Corporation
- Katsuya MURAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WLCSP PACKAGE WITH DIFFERENT SOLDER VOLUMES
- Publication number 20210202419
- Publication date Jul 1, 2021
- STMicroelectronics Pte Ltd
- David GANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL CONFIGURABILITY
- Publication number 20210175228
- Publication date Jun 10, 2021
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL CONFIGURABILITY
- Publication number 20200152620
- Publication date May 14, 2020
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPILT PAD FOR PACKAGE ROUTING AND ELECTRICAL PERFORMANCE IMPROVEMENT
- Publication number 20200111758
- Publication date Apr 9, 2020
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL CONFIGURABILITY
- Publication number 20190148359
- Publication date May 16, 2019
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL CONFIGURABILITY
- Publication number 20190148358
- Publication date May 16, 2019
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED UBM AND MIXED PITCH ON A SINGLE DIE
- Publication number 20180331056
- Publication date Nov 15, 2018
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNTING SEMICONDUCTOR COMPONENTS
- Publication number 20180211935
- Publication date Jul 26, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-KAI LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING A SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE V...
- Publication number 20170365551
- Publication date Dec 21, 2017
- ams AG
- Cathal CASSIDY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160027754
- Publication date Jan 28, 2016
- PS4 LUXCO S.A.R.L.
- Mitsuaki Katagiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH BUMPS AND DISPLAY DEVICE MODULE INCORPORA...
- Publication number 20140361429
- Publication date Dec 11, 2014
- Renesas SP Drivers Inc.
- Hisao Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA COVERED BY A SOLDER...
- Publication number 20140339698
- Publication date Nov 20, 2014
- ams AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...
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- SK HYNIX INC.
- Seong Cheol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING A STRUCTURE FOR RESUMING CONTACT
- Publication number 20140183778
- Publication date Jul 3, 2014
- STMicroelectronics (Crolles 2) SAS
- Jean-Philippe COLONNA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ROUTING DIE SIGNALS USING EXTERNAL INTERCO...
- Publication number 20140061642
- Publication date Mar 6, 2014
- QUALCOMM Incorporated
- Vaishnav Srinivas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM DEVICE
- Publication number 20130292819
- Publication date Nov 7, 2013
- NOVATEK MICROELECTRONICS CORP.
- Chiao-Ling Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP DEVICE WITH FRAGMENTED SOLDER STRUCTURE PADS
- Publication number 20130256871
- Publication date Oct 3, 2013
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR DETECTING SOLDER WETTING OF PEDESTAL SID...
- Publication number 20130234315
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- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING OFFSET PASSIVATION TO REDUCE ELECTRO...
- Publication number 20120292779
- Publication date Nov 22, 2012
- International Business Machines Corporation
- MARIO J. INTERRANTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...
- Publication number 20120139126
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- Hynix Semiconductor Inc.
- Seong Cheol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALPHA PARTICLE BLOCKING WIRE STRUCTURE AND METHOD FABRICATING SAME
- Publication number 20120028458
- Publication date Feb 2, 2012
- Cyril Cabral, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods Providing Arrangements of Vias
- Publication number 20110193212
- Publication date Aug 11, 2011
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
First-level interconnects with slender columns, and processes of fo...
- Publication number 20110122592
- Publication date May 26, 2011
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBINATION VIA AND PAD STRUCTURE FOR IMPROVED SOLDER BUMP ELECTROM...
- Publication number 20100032835
- Publication date Feb 11, 2010
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A BASE
- Publication number 20090181497
- Publication date Jul 16, 2009
- FUJITSU LIMITED
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS

the bump connector being disposed on at least two separate bonding areas

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Board unit and semiconductor device

Semiconductor devices with package-level configurability

WLCSP package with different solder volumes

Mixed UBM and mixed pitch on a single die

Surface mounting semiconductor components

Semiconductor devices with package-level configurability

Mixed UBM and mixed pitch on a single die

Semiconductor devices with package-level configurability

Split ball grid array pad for multi-chip modules

Integrated delay modules

Semiconductor device package with a conductive post

Semiconductor devices with package-level configurability

Mixed UBM and mixed pitch on a single die

Integrated circuit die having a split solder pad

Semiconductor devices with package-level configurability

Semiconductor chip scale package and manufacturing method thereof

Method of producing a semiconductor device with through-substrate v...

Method and apparatus for routing die signals using external interco...

Ball grid array system

Bumps bonds formed as metal line interconnects in a semiconductor d...

Wafer level device and method with cantilever pillar structure

Method of producing a semiconductor device with through-substrate v...

Semiconductor device with through-substrate via covered by a solder...

Semiconductor device

Semiconductor device with through-substrate via covered by a solder...

Semiconductor device with bumps and display device module incorpora...

Bonding structure of semiconductor package, method for fabricating...

Structures, architectures, systems, methods, algorithms and softwar...

Bonding structure of semiconductor package, method for fabricating...

Structures and methods for detecting solder wetting of pedestal sid...

Patents Applicationslast 30 patents

PACKAGED DEVICE HAVING AN INTEGRATED PASSIVE DEVICE WITH WAFER LEVE...

INTEGRATED DEVICE COMPRISING ELONGATED PADS

DOUBLE-SIDED SIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

DISPLAY DEVICE INCLUDING A WIRING PAD AND METHOD FOR MANUFACTURING...

BOARD UNIT AND SEMICONDUCTOR DEVICE

WLCSP PACKAGE WITH DIFFERENT SOLDER VOLUMES

SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL CONFIGURABILITY

SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL CONFIGURABILITY

SPILT PAD FOR PACKAGE ROUTING AND ELECTRICAL PERFORMANCE IMPROVEMENT

SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL CONFIGURABILITY

SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL CONFIGURABILITY

MIXED UBM AND MIXED PITCH ON A SINGLE DIE

SURFACE MOUNTING SEMICONDUCTOR COMPONENTS

METHOD OF PRODUCING A SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE V...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH BUMPS AND DISPLAY DEVICE MODULE INCORPORA...

SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA COVERED BY A SOLDER...

BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...

METHOD FOR MAKING A STRUCTURE FOR RESUMING CONTACT

METHOD AND APPARATUS FOR ROUTING DIE SIGNALS USING EXTERNAL INTERCO...

CHIP-ON-FILM DEVICE

SEMICONDUCTOR CHIP DEVICE WITH FRAGMENTED SOLDER STRUCTURE PADS

STRUCTURES AND METHODS FOR DETECTING SOLDER WETTING OF PEDESTAL SID...

SEMICONDUCTOR STRUCTURE HAVING OFFSET PASSIVATION TO REDUCE ELECTRO...

BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...

ALPHA PARTICLE BLOCKING WIRE STRUCTURE AND METHOD FABRICATING SAME

Systems and Methods Providing Arrangements of Vias

First-level interconnects with slender columns, and processes of fo...

COMBINATION VIA AND PAD STRUCTURE FOR IMPROVED SOLDER BUMP ELECTROM...

METHOD FOR PROCESSING A BASE