the bump connector being smaller than the bonding area

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H01L2224/16014

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/16014the bump connector being smaller than the bonding area

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device assembly with die support structures
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- Micron Technology, Inc.
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
Die attached leveling control by metal stopper bumps
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
3D image sensor
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Information Patent Grant
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Information Patent Grant
Semiconductor device assembly with die support structures
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Information Patent Grant
Electronic element and electronic device comprising the same
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Information Patent Grant
Bump bonded cryogenic chip carrier
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Information Patent Grant
Bump bonded cryogenic chip carrier
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Information Patent Grant
Interconnect bump structures for photo detectors
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- Sensors Unlimited, Inc.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit device and method for manufacturing electronic c...
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- Issue date Jun 9, 2020
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- Shoichi Miyahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density package interconnects
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- Issue date May 19, 2020
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Chip, flexible display panel and display device
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Semiconductor device including conductive bump interconnections
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Information Patent Grant
High density package interconnects
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- Issue date Feb 12, 2019
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Information Patent Grant
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Information Patent Grant
Integrated device package comprising photo sensitive fill between a...
- Patent number 10,037,941
- Issue date Jul 31, 2018
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- Vladimir Noveski
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Patents Applicationslast 30 patents

Information Patent Application
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DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
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ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND ELECTRONIC COMPONEN...
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- H01 - BASIC ELECTRIC ELEMENTS

the bump connector being smaller than the bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device assembly with die support structures

Semiconductor package

Power amplifier module

Semiconductor package

Display device and method of providing the same

Die attached leveling control by metal stopper bumps

Electronic device package and method of manufacturing the same

3D image sensor

Semiconductor package using core material for reverse reflow

Semiconductor package and method for manufacturing the same

Package structure and method for connecting components

Electronic circuit connection method and electronic circuit

3D image sensor

Interconnect bump structures for photo detectors

Semiconductor device assembly with die support structures

Electronic element and electronic device comprising the same

Bump bonded cryogenic chip carrier

Bump bonded cryogenic chip carrier

Interconnect bump structures for photo detectors

Electronic circuit device and method for manufacturing electronic c...

High density package interconnects

Chip, flexible display panel and display device

Flip chip

Semiconductor package device and method of manufacturing the same

Semiconductor devices including stacked semiconductor chips

Electronic device and semiconductor device

Semiconductor device including conductive bump interconnections

High density package interconnects

Semiconductor devices including stacked semiconductor chips

Integrated device package comprising photo sensitive fill between a...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

PAD AND PACKAGE INCLUDING SAME

ELECTRONIC COMPONENT PACKAGE, CIRCUIT MODULE AND METHOD FOR PRODUCI...

EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH R...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

CHIP PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF, AND ELECTRONIC...

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

FAN-OUT PACKAGE HAVING BALL GRID ARRAY SUBSTRATE WITH SIGNAL AND PO...

SYSTEMS AND METHODS FOR REDUCING DIE SLIP DURING GROUP BONDING

SEMICONDUCTOR DEVICE WITH A POLYMER LAYER

SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT

SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROV...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER

TESTING A SEMICONDUCTOR DIE USING TEMPORARY TEST PADS APPLIED TO CO...

SEMICONDUCTOR PACKAGE

LITHOGRAPHY PILLAR PROCESS FOR EMBEDDED BRIDGE SCALING

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE SHAPES

SEMICONDUCTOR PACKAGE

DISPLAY DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE WITH WETTABLE SIDE SURFACE AND MANUFACTURING METH...

DISPLAY PANEL, DISPLAY DEVICE INCLUDING THE SAME, AND METHOD OF MAN...

DISPLAY DEVICE AND METHOD OF PROVIDING THE SAME

ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND ELECTRONIC COMPONEN...