the bump connector connecting between the body and an opposite side of the item with respect to the body

Industry

CPC
H01L2224/1624

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/1624the bump connector connecting between the body and an opposite side of the item with respect to the body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated chip for standard logic performance improvement having a...
- Patent number 12,142,569
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with pre-reflowed solder
- Patent number 12,132,027
- Issue date Oct 29, 2024
- Texas Instruments Incorporated
- James Raymond Maliclic Baello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package structure with reduced vertical stress regions
- Patent number 12,131,982
- Issue date Oct 29, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Tae Kyung Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for an improved integrated circuit package
- Patent number 12,119,263
- Issue date Oct 15, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with solder on pillar
- Patent number 12,107,062
- Issue date Oct 1, 2024
- Texas Instruments Incorporated
- Rafael Jose Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for stacking substrates and method for the same
- Patent number 12,100,667
- Issue date Sep 24, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die attach surface copper layer with protective layer for microelec...
- Patent number 12,074,096
- Issue date Aug 27, 2024
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,057,378
- Issue date Aug 6, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Gi Jeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,046,549
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Maiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with electroplated pillars
- Patent number 12,027,483
- Issue date Jul 2, 2024
- Texas Instruments Incorporated
- Arvin Cedric Quiambao Mallari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including a base and a lid disposed over the base...
- Patent number 12,002,780
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,990,385
- Issue date May 21, 2024
- Advanced Semiconductor Engineering, Inc.
- Li-Chieh Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplets with connection posts
- Patent number 11,990,438
- Issue date May 21, 2024
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC die and heat spreaders with solderable thermal interface structu...
- Patent number 11,984,377
- Issue date May 14, 2024
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a light emitting device
- Patent number 11,984,545
- Issue date May 14, 2024
- SHENZHEN JUFEI OPTOELECTRONICS CO., LTD.
- Naoyuki Urasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,967,577
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Yosui Futamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component apparatus having a first lead frame and a seco...
- Patent number 11,955,410
- Issue date Apr 9, 2024
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip packaged devices with thermal pad
- Patent number 11,955,456
- Issue date Apr 9, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for thin film capacitor integration
- Patent number 11,948,871
- Issue date Apr 2, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an interdigitated mold arrangement
- Patent number 11,942,384
- Issue date Mar 26, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package assembly
- Patent number 11,929,308
- Issue date Mar 12, 2024
- Texas Instruments Incorporated
- Steffany Ann Lacierda Moreno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land structure for semiconductor package and method therefor
- Patent number 11,908,779
- Issue date Feb 20, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Kyoung Yeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light-emitting device including a reflector layer hav...
- Patent number 11,908,977
- Issue date Feb 20, 2024
- Samsung Electronics Co., Ltd.
- JungSung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with plurality of leads and sealing resin
- Patent number 11,908,777
- Issue date Feb 20, 2024
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for power supply module
- Patent number 11,887,942
- Issue date Jan 30, 2024
- Hefei Silergy Semiconductor Technology Co., Ltd.
- Ke Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
- Patent number 11,881,476
- Issue date Jan 23, 2024
- Semtech Corporation
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a packaged semiconductor device having enhanced w...
- Patent number 11,862,539
- Issue date Jan 2, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits with conductive bumps having a profile with a w...
- Patent number 11,855,027
- Issue date Dec 26, 2023
- Texas Instruments Incorporated
- Jose Daniel Carlos Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip with a vertical connector
- Patent number 11,854,947
- Issue date Dec 26, 2023
- Texas Instruments Incorporated
- Abram M. Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite wafer, semiconductor device and electronic component
- Patent number 11,848,237
- Issue date Dec 19, 2023
- Infineon Technologies AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240387333
- Publication date Nov 21, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Gi Jeong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240379507
- Publication date Nov 14, 2024
- ROHM CO., LTD.
- Akinori NII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH CONDUCTIVE POSTS HAVING ROUGH SIDEWALLS
- Publication number 20240363570
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jose Daniel Carlos Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240363572
- Publication date Oct 31, 2024
- ROHM CO., LTD.
- Akinori NII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME SUBSTRATE HAVING CIRCUITRY ON DUAL DIELECTRIC LAYERS AND...
- Publication number 20240363499
- Publication date Oct 31, 2024
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-PACKAGE INTERCONNECT TO FACILITATE THERMAL CONDUCTION
- Publication number 20240355700
- Publication date Oct 24, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Siraj Akhtar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGE WITH AN INTERCHANGEABLE LEADFRAME
- Publication number 20240339382
- Publication date Oct 10, 2024
- TEXAS INSTRUMENTS INCORPORATED
- YOU CHYE HOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20240312878
- Publication date Sep 19, 2024
- ROHM CO., LTD.
- Hiroaki AOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240304560
- Publication date Sep 12, 2024
- DENSO CORPORATION
- Kazuki KUWATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE PACKAGE STRUCTURE
- Publication number 20240282739
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- KUEI-SUNG CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH VERTICALLY STACKED PASSIVE COMPONENT
- Publication number 20240258288
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS INTEGRATION OF DEVICE DIE HAVING BSPDN
- Publication number 20240243062
- Publication date Jul 18, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS THEREOF
- Publication number 20240242999
- Publication date Jul 18, 2024
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Jeffrey Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20240222256
- Publication date Jul 4, 2024
- Shinko Electric Industries Co., Ltd.
- Kenichi Koi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-TOOL AND MULTI-DIRECTIONAL PACKAGE SINGULATION
- Publication number 20240222144
- Publication date Jul 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo C. MOLINA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240213223
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Jaemok JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adaptive Flip Chip Bonding for Semiconductor Packages
- Publication number 20240213035
- Publication date Jun 27, 2024
- INFINEON TECHNOLOGIES AG
- Chew Yeek Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING SAME
- Publication number 20240213200
- Publication date Jun 27, 2024
- Rohm Co., Ltd.
- Reona TAKEOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...
- Publication number 20240203839
- Publication date Jun 20, 2024
- Amkor Technology Singapore Holding Pte. Ltd
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR THIN FILM CAPACITOR INTEGRATION
- Publication number 20240194574
- Publication date Jun 13, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAND STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD THEREFOR
- Publication number 20240194572
- Publication date Jun 13, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Kyoung Yeon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20240186233
- Publication date Jun 6, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPLETS WITH CONNECTION POSTS
- Publication number 20240170430
- Publication date May 23, 2024
- X Display Company Technology Limited
- Carl Prevatte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240170382
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Juhyeon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID-REPELLING COATING FOR UNDERFILL BLEED OUT CONTROL
- Publication number 20240145422
- Publication date May 2, 2024
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STR...
- Publication number 20240113005
- Publication date Apr 4, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIGHTLY-COUPLED RANDOM ACCESS MEMORY INTERFACE SHIM DIE
- Publication number 20240088084
- Publication date Mar 14, 2024
- Micron Technology, Inc.
- Ameen D. Akel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH PLURALITY OF LEADS AND SEALING RESIN
- Publication number 20240038635
- Publication date Feb 1, 2024
- Rohm Co., Ltd.
- Mamoru YAMAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240038709
- Publication date Feb 1, 2024
- ROHM CO., LTD.
- Kenji FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD FLAT NO-LEAD (QFN) PACKAGE WITHOUT LEADFRAME AND DIRECT CONTAC...
- Publication number 20240030113
- Publication date Jan 25, 2024
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS

the bump connector connecting between the body and an opposite side of the item with respect to the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated chip for standard logic performance improvement having a...

Semiconductor device assembly with pre-reflowed solder

Electronic package structure with reduced vertical stress regions

Methods and apparatus for an improved integrated circuit package

Semiconductor device with solder on pillar

Apparatus for stacking substrates and method for the same

Die attach surface copper layer with protective layer for microelec...

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor device

Packaged semiconductor device with electroplated pillars

Package structure including a base and a lid disposed over the base...

Electronic device

Chiplets with connection posts

IC die and heat spreaders with solderable thermal interface structu...

Method of manufacturing a light emitting device

Semiconductor device and method for manufacturing the same

Electronic component apparatus having a first lead frame and a seco...

Flip chip packaged devices with thermal pad

Process for thin film capacitor integration

Semiconductor package having an interdigitated mold arrangement

Flip chip package assembly

Land structure for semiconductor package and method therefor

Semiconductor light-emitting device including a reflector layer hav...

Semiconductor package with plurality of leads and sealing resin

Package structure for power supply module

Semiconductor device and method of stacking semiconductor die for s...

Method of forming a packaged semiconductor device having enhanced w...

Integrated circuits with conductive bumps having a profile with a w...

Integrated circuit chip with a vertical connector

Composite wafer, semiconductor device and electronic component

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUITS WITH CONDUCTIVE POSTS HAVING ROUGH SIDEWALLS

SEMICONDUCTOR DEVICE

LEAD FRAME SUBSTRATE HAVING CIRCUITRY ON DUAL DIELECTRIC LAYERS AND...

DIE-PACKAGE INTERCONNECT TO FACILITATE THERMAL CONDUCTION

MOLDED PACKAGE WITH AN INTERCHANGEABLE LEADFRAME

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD OF FORMING THE PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE PACKAGE WITH VERTICALLY STACKED PASSIVE COMPONENT

HETEROGENEOUS INTEGRATION OF DEVICE DIE HAVING BSPDN

SEMICONDUCTOR PACKAGES AND METHODS THEREOF

ELECTRONIC APPARATUS

MULTI-TOOL AND MULTI-DIRECTIONAL PACKAGE SINGULATION

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

Adaptive Flip Chip Bonding for Semiconductor Packages

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING SAME

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

PROCESS FOR THIN FILM CAPACITOR INTEGRATION

LAND STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD THEREFOR

PACKAGING STRUCTURE AND PACKAGING METHOD

CHIPLETS WITH CONNECTION POSTS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

LIQUID-REPELLING COATING FOR UNDERFILL BLEED OUT CONTROL

HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STR...

TIGHTLY-COUPLED RANDOM ACCESS MEMORY INTERFACE SHIM DIE

SEMICONDUCTOR PACKAGE WITH PLURALITY OF LEADS AND SEALING RESIN

SEMICONDUCTOR DEVICE

QUAD FLAT NO-LEAD (QFN) PACKAGE WITHOUT LEADFRAME AND DIRECT CONTAC...