the bump connector connecting bonding areas being not aligned with respect to each other

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H01L2224/16105

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/16105the bump connector connecting bonding areas being not aligned with respect to each other

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Patents Grantslast 30 patents

Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Application
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Information Patent Application
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- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Yun Tu
- H01 - BASIC ELECTRIC ELEMENTS

the bump connector connecting bonding areas being not aligned with respect to each other

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and a method of manufacturing thereof

Electronic device package and method of manufacturing the same

Multi-die package with bridge layer

Semiconductor device and a method of manufacturing thereof

Method and device for producing and filling containers

Surface mounting semiconductor components

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing thereof

Printed wiring board, printed circuit board, and electronic device

Contact structures with porous networks for solder connections, and...

Bonded semiconductor package and related methods

Semiconductor device and method of manufacturing the same

Display device and method of manufacturing the same

Methods for making multi-die package with bridge layer

Photodetector-arrays and methods of fabrication thereof

Semiconductor device and a method of manufacturing thereof

Printed wiring board, printed circuit board, and electronic device

Combing bump structure and manufacturing method thereof

Semiconductor package

Display device and method of manufacturing the same

Semiconductor device and a method of manufacturing the same

3D-joining of microelectronic components with conductively self-adj...

Vertical shielding and interconnect for SIP modules

Method of manufacturing electronic component module and electronic...

Semiconductor device and a method of manufacturing thereof

Semiconductor chip having a dense arrangement of contact terminals

Combing bump structure and manufacturing method thereof

Integrated circuit packaging substrate, semiconductor package, and...

Optimized solder pads for microelectronic components

Microelectronic element with bond elements to encapsulation surface

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

ELECTRONIC DEVICE

MICRO LED DISPLAY PANEL

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

BONDED SEMICONDUCTOR PACKAGE AND RELATED METHODS

Methods for Making Multi-Die Package With Bridge Layer

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

COMBING BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF

SURFACE MOUNTING SEMICONDUCTOR COMPONENTS

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Method of Manufacturing Connector Structures of Integrated Circuits

OPTIMIZED SOLDER PADS FOR MICROELECTRONIC COMPONENTS

Display Device and Method of Manufacturing the Same

RADIATION DETECTOR ELEMENT

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Semiconductor Chip Assembly and Method for Manufacturing the Same

Micro-Spring Chip Attachment Using Solder-Based Interconnect Struct...

RELIABLE DEVICE ASSEMBLY

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

INTEGRATED CIRCUIT STACK WITH LOW PROFILE CONTACTS

Bonding Structures and Methods of Forming the Same

Connector Structures of Integrated Circuits