the bump connector connecting one bonding area to at least two respective bonding areas

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CPC
H01L2224/16106

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/16106the bump connector connecting one bonding area to at least two respective bonding areas

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor substrate, semiconductor package including semiconduc...
- Patent number 11,769,700
- Issue date Sep 26, 2023
- SK hynix Inc.
- Bok Gyu Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with bridge layer
- Patent number 11,476,125
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mounting semiconductor components
- Patent number 11,101,238
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, method for manufacturing semiconductor chip, in...
- Patent number 10,658,321
- Issue date May 19, 2020
- Kabushiki Kaisha Toshiba
- Hidekazu Inoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making multi-die package with bridge layer
- Patent number 10,643,861
- Issue date May 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Expanded head pillar for bump bonds
- Patent number 10,636,758
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical shielding and interconnect for SIP modules
- Patent number 10,292,258
- Issue date May 14, 2019
- Apple Inc.
- Lan H. Hoang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Integrated circuit die having a split solder pad
- Patent number 10,192,798
- Issue date Jan 29, 2019
- EM Microelectronic-Marin SA
- Christoph Kuratli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having a dense arrangement of contact terminals
- Patent number 10,090,251
- Issue date Oct 2, 2018
- Infineon Technologies AG
- Peter Ossimitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip scale package and manufacturing method thereof
- Patent number 9,941,240
- Issue date Apr 10, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor device with through-substrate v...
- Patent number 9,870,988
- Issue date Jan 16, 2018
- AMS AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array system
- Patent number 9,867,295
- Issue date Jan 9, 2018
- Dell Products L.P.
- Bhavesh Patel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 9,818,681
- Issue date Nov 14, 2017
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Machida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level device and method with cantilever pillar structure
- Patent number 9,806,047
- Issue date Oct 31, 2017
- Maxim Integrated Products, Inc.
- Karthik Thambidurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor device with through-substrate v...
- Patent number 9,773,729
- Issue date Sep 26, 2017
- AMS AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with through-substrate via covered by a solder...
- Patent number 9,735,101
- Issue date Aug 15, 2017
- AMS AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with bridge layer and method for making the same
- Patent number 9,640,521
- Issue date May 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with through-substrate via covered by a solder...
- Patent number 9,553,039
- Issue date Jan 24, 2017
- AMS AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,437,490
- Issue date Sep 6, 2016
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device and semiconductor light emittin...
- Patent number 9,406,635
- Issue date Aug 2, 2016
- Samsung Electronics Co., Ltd.
- Ju Heon Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, imaging device and semiconductor device manuf...
- Patent number 9,343,498
- Issue date May 17, 2016
- Olympus Corporation
- Haruhisa Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of connecting a semiconductor package to a board
- Patent number 9,343,397
- Issue date May 17, 2016
- Infineon Technologies AG
- Carlo Marbella
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Snubber circuit and method of using bipolar junction transistor in...
- Patent number 9,196,574
- Issue date Nov 24, 2015
- FSP TECHNOLOGY INC.
- Kuo-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for generating die identification by measuring whether circu...
- Patent number 9,196,549
- Issue date Nov 24, 2015
- United Microelectronics Corp.
- Kuang-Hui Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level device packaging
- Patent number 9,117,715
- Issue date Aug 25, 2015
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Yat Kit Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for obtaining three-dimensional actin structures and uses th...
- Patent number 9,070,702
- Issue date Jun 30, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean-Christophe Gabriel
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Snubber circuit and method of using bipolar junction transistor in...
- Patent number 8,941,962
- Issue date Jan 27, 2015
- FSP Technology Inc.
- Kuo-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump for semiconductor package, semiconductor package having bump,...
- Patent number 8,823,183
- Issue date Sep 2, 2014
- SK Hynix Inc.
- Ki Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder interconnect on IC chip
- Patent number 8,742,582
- Issue date Jun 3, 2014
- Megit Acquisition Corp.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization structure over passivation layer for IC chip
- Patent number 8,067,837
- Issue date Nov 29, 2011
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY SUBSTRATE AND DISPLAY DEVICE
- Publication number 20220216183
- Publication date Jul 7, 2022
- BOE TECHNOLOGY GROUP CO., LTD.
- Mingxing WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUC...
- Publication number 20210280476
- Publication date Sep 9, 2021
- SK HYNIX INC.
- Bok Gyu MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Making Multi-Die Package With Bridge Layer
- Publication number 20200266074
- Publication date Aug 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDED HEAD PILLAR FOR BUMP BONDS
- Publication number 20200258856
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNTING SEMICONDUCTOR COMPONENTS
- Publication number 20180211935
- Publication date Jul 26, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-KAI LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING A SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE V...
- Publication number 20170365551
- Publication date Dec 21, 2017
- ams AG
- Cathal CASSIDY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA COVERED BY A SOLDER...
- Publication number 20170025351
- Publication date Jan 26, 2017
- ams AG
- Cathal CASSIDY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Configured for Connection to a Board
- Publication number 20160329292
- Publication date Nov 10, 2016
- INFINEON TECHNOLOGIES AG
- Carlo Marbella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND SEMICONDUCTOR LIGHT EMITTIN...
- Publication number 20160056118
- Publication date Feb 25, 2016
- Samsung Electronics Co., Ltd.
- Ju Heon YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA COVERED BY A SOLDER...
- Publication number 20140339698
- Publication date Nov 20, 2014
- ams AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, MULTICORE PROCESSOR APPARATUS, AND METHOD FOR M...
- Publication number 20140252606
- Publication date Sep 11, 2014
- Takashi Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL DEVICE PACKAGING
- Publication number 20140021596
- Publication date Jan 23, 2014
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Yat Kit Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM DEVICE
- Publication number 20130292819
- Publication date Nov 7, 2013
- NOVATEK MICROELECTRONICS CORP.
- Chiao-Ling Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING E...
- Publication number 20130077275
- Publication date Mar 28, 2013
- RENESAS ELECTRONICS CORPORATION
- Shuuichi Kariyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SNUBBER CIRCUIT AND METHOD OF USING BIPOLAR JUNCTION TRANSISTOR IN...
- Publication number 20130063852
- Publication date Mar 14, 2013
- FSP TECHNOLOGY INC.
- Kuo-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SNUBBER CIRCUIT AND METHOD OF USING BIPOLAR JUNCTION TRANSISTOR IN...
- Publication number 20130063853
- Publication date Mar 14, 2013
- Kuo-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR STRUCTURE AND RELATED TRANSISTOR PACKAGING METHOD THEREOF
- Publication number 20130062785
- Publication date Mar 14, 2013
- Kuo-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE HAVING BUMP,...
- Publication number 20120091584
- Publication date Apr 19, 2012
- Hynix Semiconductor Inc.
- Ki Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES, ELECTRONIC DEVICES AND ELECTRONIC SYSTEMS E...
- Publication number 20120068350
- Publication date Mar 22, 2012
- Samsung Electronics Co., Ltd.
- Tong-Suk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER INTERCONNECT ON IC CHIP
- Publication number 20120025378
- Publication date Feb 2, 2012
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTED BODY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100224986
- Publication date Sep 9, 2010
- PANASONIC CORPORATION
- Toshiyuki Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mounted Body and Method for Manufacturing the Same
- Publication number 20080251894
- Publication date Oct 16, 2008
- Matsushita Electric Industrial Co., Ltd.
- Toshiyuki Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE
- Publication number 20080156521
- Publication date Jul 3, 2008
- Kabushiki Kaisha Toshiba
- Jun Karasawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Solder interconnect on IC chip
- Publication number 20060125094
- Publication date Jun 15, 2006
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit component and mounting method thereof
- Publication number 20060108607
- Publication date May 25, 2006
- Yasuhiro Teshima
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Ground pad structure for preventing solder extrusion and semiconduc...
- Publication number 20050023704
- Publication date Feb 3, 2005
- Siliconware Precision Industries Co., Ltd.
- Ying-Ren Lin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Connection of integrated circuit to a substrate
- Publication number 20040036181
- Publication date Feb 26, 2004
- Harry Hedler
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor packaging structure, packaging board and inspection m...
- Publication number 20020125043
- Publication date Sep 12, 2002
- Yuichi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate on which ball grid array type electrical part is mounted...
- Publication number 20010023782
- Publication date Sep 27, 2001
- Taisuke Nakamura
- H01 - BASIC ELECTRIC ELEMENTS

the bump connector connecting one bonding area to at least two respective bonding areas

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor substrate, semiconductor package including semiconduc...

Multi-die package with bridge layer

Surface mounting semiconductor components

Semiconductor chip, method for manufacturing semiconductor chip, in...

Methods for making multi-die package with bridge layer

Expanded head pillar for bump bonds

Vertical shielding and interconnect for SIP modules

Integrated circuit die having a split solder pad

Semiconductor chip having a dense arrangement of contact terminals

Semiconductor chip scale package and manufacturing method thereof

Method of producing a semiconductor device with through-substrate v...

Ball grid array system

Wiring substrate

Wafer level device and method with cantilever pillar structure

Method of producing a semiconductor device with through-substrate v...

Semiconductor device with through-substrate via covered by a solder...

Multi-die package with bridge layer and method for making the same

Semiconductor device with through-substrate via covered by a solder...

Semiconductor device and manufacturing method thereof

Semiconductor light emitting device and semiconductor light emittin...

Semiconductor device, imaging device and semiconductor device manuf...

Method of connecting a semiconductor package to a board

Snubber circuit and method of using bipolar junction transistor in...

Method for generating die identification by measuring whether circu...

Wafer-level device packaging

Method for obtaining three-dimensional actin structures and uses th...

Snubber circuit and method of using bipolar junction transistor in...

Bump for semiconductor package, semiconductor package having bump,...

Solder interconnect on IC chip

Metallization structure over passivation layer for IC chip

Patents Applicationslast 30 patents

DISPLAY SUBSTRATE AND DISPLAY DEVICE

SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUC...

Methods for Making Multi-Die Package With Bridge Layer

EXPANDED HEAD PILLAR FOR BUMP BONDS

SURFACE MOUNTING SEMICONDUCTOR COMPONENTS

METHOD OF PRODUCING A SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE V...

SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA COVERED BY A SOLDER...

Semiconductor Package Configured for Connection to a Board

SEMICONDUCTOR LIGHT EMITTING DEVICE AND SEMICONDUCTOR LIGHT EMITTIN...

SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA COVERED BY A SOLDER...

INTEGRATED CIRCUIT, MULTICORE PROCESSOR APPARATUS, AND METHOD FOR M...

WAFER-LEVEL DEVICE PACKAGING

CHIP-ON-FILM DEVICE

ELECTRONIC DEVICE, WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING E...

SNUBBER CIRCUIT AND METHOD OF USING BIPOLAR JUNCTION TRANSISTOR IN...

SNUBBER CIRCUIT AND METHOD OF USING BIPOLAR JUNCTION TRANSISTOR IN...

TRANSISTOR STRUCTURE AND RELATED TRANSISTOR PACKAGING METHOD THEREOF

BUMP FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE HAVING BUMP,...

SEMICONDUCTOR PACKAGES, ELECTRONIC DEVICES AND ELECTRONIC SYSTEMS E...

SOLDER INTERCONNECT ON IC CHIP

MOUNTED BODY AND METHOD FOR MANUFACTURING THE SAME

Mounted Body and Method for Manufacturing the Same

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE

Solder interconnect on IC chip

Integrated circuit component and mounting method thereof

Ground pad structure for preventing solder extrusion and semiconduc...

Connection of integrated circuit to a substrate

Semiconductor packaging structure, packaging board and inspection m...

Substrate on which ball grid array type electrical part is mounted...