the bump connector connecting to a bonding area protruding from the surface of the item

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/16238the bump connector connecting to a bonding area protruding from the surface of the item

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Patents Grantslast 30 patents

Information Patent Grant
Micro-LED mounting substrate, micro-led display, and method of manu...
- Patent number 12,288,769
- Issue date Apr 29, 2025
- SHARP KABUSHIKI KAISHA
- Yoshiyuki Harumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 12,283,577
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate and display device
- Patent number 12,278,213
- Issue date Apr 15, 2025
- BOE Technology Group Co., Ltd.
- Mingxing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforcing resin composition, electronic component, method for man...
- Patent number 12,275,839
- Issue date Apr 15, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shigeru Yamatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and substrate structure thereof
- Patent number 12,278,173
- Issue date Apr 15, 2025
- Siliconware Precision Industries Co., Ltd.
- Wen-Chen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Window assemblies, imaging system including the same, method of man...
- Patent number 12,270,987
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Duhyun Lee
- G02 - OPTICS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,261,102
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, RDL structure comprising redistribution layer ha...
- Patent number 12,249,564
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative surfaces for conductive pad layers of silicon bridges f...
- Patent number 12,243,812
- Issue date Mar 4, 2025
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having plural stacked first chips sealed in a...
- Patent number 12,237,315
- Issue date Feb 25, 2025
- Kioxia Corporation
- Takayuki Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package device
- Patent number 12,230,558
- Issue date Feb 18, 2025
- Innolux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,224,226
- Issue date Feb 11, 2025
- Innolux Corporation
- Chin-Lung Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV check circuit with replica path
- Patent number 12,224,275
- Issue date Feb 11, 2025
- Micron Technology, Inc.
- Harutaka Makabe
- G11 - INFORMATION STORAGE
Information Patent Grant
Package structure for heat dissipation
- Patent number 12,218,026
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via plug resistor
- Patent number 12,218,042
- Issue date Feb 4, 2025
- Intel Corporation
- Santosh Gangal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a dummy pattern
- Patent number 12,211,777
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Minjung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave integrated quantum circuits with cap wafers and their met...
- Patent number 12,207,569
- Issue date Jan 21, 2025
- Rigetti & Co, LLC
- Jayss Daniel Marshall
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-chip packaging
- Patent number 12,199,085
- Issue date Jan 14, 2025
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 12,191,241
- Issue date Jan 7, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with pillar array
- Patent number 12,191,162
- Issue date Jan 7, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,191,238
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- Aenee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive with brain-like elasticity and integrality based on sta...
- Patent number 12,176,902
- Issue date Dec 24, 2024
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,170,259
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Ju Bin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory system
- Patent number 12,169,644
- Issue date Dec 17, 2024
- Kioxia Corporation
- Manabu Matsumoto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package with built-in electronic components and electronic device
- Patent number 12,148,724
- Issue date Nov 19, 2024
- Fujitsu Limited
- Yukiko Oshikubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die ultrafine pitch patch architecture of interconnect bridge...
- Patent number 12,142,568
- Issue date Nov 12, 2024
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,132,024
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with cavity in interposer
- Patent number 12,125,755
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,113,033
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 12,107,082
- Issue date Oct 1, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE
- Publication number 20250149404
- Publication date May 8, 2025
- Shinko Electric Industries Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BUMPS AND METHOD OF MANUFACTURING TH...
- Publication number 20250149484
- Publication date May 8, 2025
- SK HYNIX INC.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH ACTIVE SILICON BRIDGE
- Publication number 20250149525
- Publication date May 8, 2025
- ADVANCED MICRO DEVICES, INC.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250149460
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250149515
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING GLASS-CORED SUBSTRATES WITH S...
- Publication number 20250149421
- Publication date May 8, 2025
- Intel Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149519
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140770
- Publication date May 1, 2025
- Siliconware Precision Industries Co., Ltd.
- Che-Yu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250140645
- Publication date May 1, 2025
- InnoLux Corporation
- Chin-Lung TING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132296
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH BACK-TO-BACK DIE STACKING
- Publication number 20250132240
- Publication date Apr 24, 2025
- Micron Technology, Inc.
- Faxing CHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID STACKING OF SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSE...
- Publication number 20250132302
- Publication date Apr 24, 2025
- Micron Technology, Inc.
- Kwun-Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA PLUG RESISTOR
- Publication number 20250125242
- Publication date Apr 17, 2025
- Intel Corporation
- Santosh Gangal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR INTEGRATED CIRCUIT PACKAGE INTERCONNECTS
- Publication number 20250118641
- Publication date Apr 10, 2025
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118652
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Seunghwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power, Signaling and Thermal Path Co-optimization
- Publication number 20250112154
- Publication date Apr 3, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLEAVED POWER DELIVERY TO 3D DIE COMPLEXES ABOVE BRIDGE CHIPLET...
- Publication number 20250112160
- Publication date Apr 3, 2025
- Intel Corporation
- Andrew P. COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH DOUBLE HYBRID BONDED DIES AND METH...
- Publication number 20250105207
- Publication date Mar 27, 2025
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Multichip Package
- Publication number 20250105238
- Publication date Mar 27, 2025
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105235
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250096099
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- JAESUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250096070
- Publication date Mar 20, 2025
- Murata Manufacturing Co., Ltd.
- Mari SAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING RESIN, AND ELECTRONIC DEVICE INCLUD...
- Publication number 20250096186
- Publication date Mar 20, 2025
- Samsung Electronics Co.,Ltd.
- Chagyu SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250096088
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Aenee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICES COUPLED TO INTERPOSER COMPRISING POROUS PORTION
- Publication number 20250096093
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250089171
- Publication date Mar 13, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seung Min Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087647
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087637
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Fine Pitch Organic Inte...
- Publication number 20250087499
- Publication date Mar 13, 2025
- STATS ChipPAC Pte Ltd.
- KiRak SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH STIFFENER STRUCTURE
- Publication number 20250079246
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS

the bump connector connecting to a bonding area protruding from the surface of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Micro-LED mounting substrate, micro-led display, and method of manu...

Fan-out semiconductor package

Display substrate and display device

Reinforcing resin composition, electronic component, method for man...

Electronic package and substrate structure thereof

Window assemblies, imaging system including the same, method of man...

Semiconductor package and method of forming the same

Package structure, RDL structure comprising redistribution layer ha...

Alternative surfaces for conductive pad layers of silicon bridges f...

Semiconductor device having plural stacked first chips sealed in a...

Package device

Electronic device

TSV check circuit with replica path

Package structure for heat dissipation

Via plug resistor

Semiconductor package including a dummy pattern

Microwave integrated quantum circuits with cap wafers and their met...

Multi-chip packaging

Fine pitch copper pillar package and method

Semiconductor device assembly with pillar array

Semiconductor package

Logic drive with brain-like elasticity and integrality based on sta...

Semiconductor package and method of fabricating the same

Memory system

Package with built-in electronic components and electronic device

Multi-die ultrafine pitch patch architecture of interconnect bridge...

Semiconductor package and method of manufacturing the same

Chip package structure with cavity in interposer

Chip package structure

Offset interposers for large-bottom packages and large-die package-...

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE

SEMICONDUCTOR DEVICE INCLUDING BUMPS AND METHOD OF MANUFACTURING TH...

CHIP PACKAGE WITH ACTIVE SILICON BRIDGE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES

INTEGRATED CIRCUIT PACKAGES INCLUDING GLASS-CORED SUBSTRATES WITH S...

SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE WITH BACK-TO-BACK DIE STACKING

HYBRID STACKING OF SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSE...

VIA PLUG RESISTOR

PLANAR INTEGRATED CIRCUIT PACKAGE INTERCONNECTS

SEMICONDUCTOR PACKAGE

Power, Signaling and Thermal Path Co-optimization

INTERLEAVED POWER DELIVERY TO 3D DIE COMPLEXES ABOVE BRIDGE CHIPLET...

INTEGRATED CIRCUIT PACKAGES WITH DOUBLE HYBRID BONDED DIES AND METH...

3D Multichip Package

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE INCLUDING RESIN, AND ELECTRONIC DEVICE INCLUD...

SEMICONDUCTOR PACKAGE

INTEGRATED DEVICES COUPLED TO INTERPOSER COMPRISING POROUS PORTION

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

Semiconductor Device and Method of Making a Fine Pitch Organic Inte...

SEMICONDUCTOR PACKAGE WITH STIFFENER STRUCTURE