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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/16238
the bump connector connecting to a bonding area protruding from the surface of the item
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Patents Grants
last 30 patents
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Patent Grant
Offset interposers for large-bottom packages and large-die package-...
Patent number
11,978,730
Issue date
May 7, 2024
Intel Corporation
Russell K. Mortensen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing substrate structure with filling material f...
Patent number
11,973,014
Issue date
Apr 30, 2024
Siliconware Precision Industries Co., Ltd.
Chang-Fu Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for low temperature bonding using nanoparticles
Patent number
11,973,056
Issue date
Apr 30, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solderless interconnection structure and method of forming same
Patent number
11,961,810
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company
Yu-Wei Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrates with heat transfer structures for bonding a stack of mic...
Patent number
11,961,818
Issue date
Apr 16, 2024
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package stacking using chip to wafer bonding
Patent number
11,955,462
Issue date
Apr 9, 2024
Intel Corporation
Georg Seidemann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip having stepped conductive pillars
Patent number
11,955,447
Issue date
Apr 9, 2024
Advanced Micro Devices, Inc.
Suming Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,948,808
Issue date
Apr 2, 2024
Amkor Technology Singapore Holding Pte Ltd.
Dong Jin Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having reduced bump height variation
Patent number
11,935,866
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jing-Cheng Lin
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor package and method of fabricating the same
Patent number
11,929,316
Issue date
Mar 12, 2024
Samsung Electronics Co., Ltd.
Jongyoun Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor device having chip stacked a...
Patent number
11,923,287
Issue date
Mar 5, 2024
Kabushiki Kaisha Toshiba
Takayuki Tajima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure including through via structures
Patent number
11,923,310
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Kai Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing the same
Patent number
11,901,277
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Shih-Ting Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing the same
Patent number
11,901,279
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Shih-Ting Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
In-package RF waveguides as high bandwidth chip-to-chip interconnec...
Patent number
11,894,324
Issue date
Feb 6, 2024
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate and package structure
Patent number
11,894,332
Issue date
Feb 6, 2024
Taiwan Semiconductor Manufacturing Company Limited
Wei-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic device with embedded die substrate on interposer
Patent number
11,894,311
Issue date
Feb 6, 2024
Intel Corporation
Robert Alan May
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring design method, wiring structure, and flip chip
Patent number
11,887,923
Issue date
Jan 30, 2024
NEXTVPU (SHANGHAI) CO., LTD.
Aofeng Qian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with through-mold via
Patent number
11,869,829
Issue date
Jan 9, 2024
Amkor Technology Singapore Holding Pte Ltd.
Dong Joo Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package using a coreless signal distribution structure
Patent number
11,869,879
Issue date
Jan 9, 2024
Amkor Technology Singapore Holding Pte Ltd.
Do Hyung Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure for heat dissipation
Patent number
11,854,785
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Alternative surfaces for conductive pad layers of silicon bridges f...
Patent number
11,848,259
Issue date
Dec 19, 2023
Intel Corporation
Dae-Woo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
Patent number
11,842,991
Issue date
Dec 12, 2023
STATS ChipPAC Pte. Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with layer structures, antenna layer and elec...
Patent number
11,837,552
Issue date
Dec 5, 2023
Mediatek Inc.
Wen-Sung Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heated pins to couple with solder elements
Patent number
11,830,846
Issue date
Nov 28, 2023
Intel Corporation
Feroz Mohammad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High-frequency module
Patent number
11,825,603
Issue date
Nov 21, 2023
Murata Manufacturing Co., Ltd.
Tomomi Yasuda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and apparatuses for implementing a pad on solder mask (POSM...
Patent number
11,823,994
Issue date
Nov 21, 2023
Intel Corporation
Eng Huat Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip packaging
Patent number
11,817,444
Issue date
Nov 14, 2023
Intel Corporation
Robert L. Sankman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having through silicon vias and manufacturing...
Patent number
11,817,427
Issue date
Nov 14, 2023
LONGITUDE LICENSING LIMITED
Ryohei Kitada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,817,422
Issue date
Nov 14, 2023
Shinko Electric Industries Co., Ltd.
Yohei Igarashi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE WITH ADVANCED PAD STRUCTURE AND METHOD FOR FOR...
Publication number
20240153897
Publication date
May 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Fu-Chiang Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC ASSEMBLY WITH POWER MODULE INTERPOSER AND METHODS OF FOR...
Publication number
20240145368
Publication date
May 2, 2024
Intel Corporation
Jackson Chung Peng KONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240145444
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Kiju Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE AND PACKAGE STRUCTURE
Publication number
20240136317
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240136331
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
Hyun Soo CHUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240128184
Publication date
Apr 18, 2024
Innolux Corporation
Ker-Yih Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING
Publication number
20240128211
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Wei WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP PACKAGING
Publication number
20240128256
Publication date
Apr 18, 2024
Intel Corporation
Robert L. Sankman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME
Publication number
20240128145
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
HYEONSEOK LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Packages and Methods of Forming the Same
Publication number
20240128148
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chang-Jung Hsueh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIELECTRIC INTERPOSER WITH ELECTRICAL-CONNECTION CUT-IN
Publication number
20240128182
Publication date
Apr 18, 2024
Micron Technology, Inc.
Chin Hui Chong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Efficient Integration of a First Substrate without Solder Bumps wit...
Publication number
20240128209
Publication date
Apr 18, 2024
Newport Fab, LLC dba Tower Semiconductor Newport Beach
Edward Preisler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240128155
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
Minjun Bae
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICALLY INTERCONNECTED SEMICONDUC...
Publication number
20240120317
Publication date
Apr 11, 2024
Western Digital Technologies, Inc.
Cheng-Hsiung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE ANTIOXIDANT LAYER
Publication number
20240120266
Publication date
Apr 11, 2024
SAMSUNG-RO, YEONGTONG-GU
Sujung HYUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTISIDED INTEGRATED CIRCUIT ASSEMBLY
Publication number
20240112966
Publication date
Apr 4, 2024
Azimuth Industrial Company, Inc.
David Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF FORMATION
Publication number
20240107780
Publication date
Mar 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Wei WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Stacking Hybrid Substrates with...
Publication number
20240105630
Publication date
Mar 28, 2024
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCO...
Publication number
20240105655
Publication date
Mar 28, 2024
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240105536
Publication date
Mar 28, 2024
Samsung Electronics Co., Ltd.
Seokbong PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE COMPRISING AN INTEGRATED DEVICE, A CHIPLET AND A METALLIZAT...
Publication number
20240105688
Publication date
Mar 28, 2024
QUALCOMM Incorporated
Xia LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPONENT-EMBEDDED PACKAGING STRUCTURE
Publication number
20240096838
Publication date
Mar 21, 2024
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Chu-Chin HU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNEC...
Publication number
20240096809
Publication date
Mar 21, 2024
Intel Corporation
Hiroki Tanaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240096841
Publication date
Mar 21, 2024
Samsung Electronics Co., Ltd.
Ohguk KWON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
Publication number
20240079346
Publication date
Mar 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chi-Yang Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR REDUCING DIE SLIP DURING GROUP BONDING
Publication number
20240079358
Publication date
Mar 7, 2024
Micron Technology, Inc.
Siva Sai Kishore Palli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DEVICE PACKAGES AND RELATED METHODS AND SYSTEMS
Publication number
20240079306
Publication date
Mar 7, 2024
Micron Technology, Inc.
Kelvin Tan Aik Boo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH POST INTERCONNECTS HAVING A PRO...
Publication number
20240079307
Publication date
Mar 7, 2024
QUALCOMM Incorporated
Wei WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Packages and Methods of Forming the Same
Publication number
20240079356
Publication date
Mar 7, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATES WITH SPACERS, INCLUDING SUBSTRATES WITH SOLDER RESIST SP...
Publication number
20240071975
Publication date
Feb 29, 2024
Micron Technology, Inc.
Bong Woo Choi
H01 - BASIC ELECTRIC ELEMENTS